diff --git a/Hardware/LCMXO/gerber/RAM2E-BOM.LCMXOC.csv b/Hardware/LCMXO/gerber/RAM2E-BOM.LCMXOC.csv new file mode 100644 index 0000000..411c60b --- /dev/null +++ b/Hardware/LCMXO/gerber/RAM2E-BOM.LCMXOC.csv @@ -0,0 +1,24 @@ +Reference, Quantity, Value, Footprint, Datasheet, LCSC Part, Mfg. Part Numbers, Notes +C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 C30 ,23,2u2,stdpads:C_0603,,C23630,Samsung CL10A225KO8NNNC,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +C1 C2 C3 C4 C5 C6 C29 ,7,10u,stdpads:C_0805,,C15850,Samsung CL21A106KAYNNNE,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +C31 ,1,15p,stdpads:C_0603,,,,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +D1 ,1,White,stdpads:LED_0805,,C34499,Hubei Kento C34499,Any manufacturer's part is acceptable. +FID1 FID2 FID3 FID4 ,4,Fiducial,stdpads:Fiducial,,,,DNP - SMT vision system fiducial +H1 H2 H3 H4 ,4, ,stdpads:PasteHole_1.152mm_NPTH,,,,DNP - mounting hole for solder paste printing +H5 ,1, ,stdpads:PasteHole_1.1mm_PTH,,,,DNP - mounting hole +J1 ,1,AppleIIeAux,stdpads:AppleIIeAux_Edge,,,,DNP - edge connector +J2 ,1,JTAG,stdpads:TC2050,,,,DNP - test pad connector +J3 ,1,C14M,Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical,,,,DNP +R1 ,1,0,stdpads:R_0805,,C17477,Uniroyal 0805W8F0000T5E,Any manufacturer's part is acceptable. +R10 ,1,180,stdpads:R_0805,,C25270,Uniroyal 0805W8F1800T5E,Any manufacturer's part is acceptable. +R2 R3 R4 R5 R8 ,5,47,stdpads:R_0603,,C23182,Uniroyal 0603WAF470JT5E,Any manufacturer's part is acceptable. +R6 ,1,0,stdpads:R_0805,,C17477,Uniroyal 0805W8F0000T5E,Any manufacturer's part is acceptable. +R7 ,1,DNP,stdpads:R_0805,,,, +R9 ,1,10k,stdpads:R_0603,,C25804,Uniroyal 0603WAF1002T5E,Any manufacturer's part is acceptable. +U1 ,1,LCMXO256-TN100,stdpads:TQFP-100_14x14mm_P0.5mm,,C1550734,"Lattice LCMXO256C-3TN100C, Lattice LCMXO256C-4TN100C, Lattice LCMXO256C-5TN100C, Lattice LCMXO256C-3TN100I, Lattice LCMXO256C-4TN100I, Lattice LCMXO640C-3TN100C, Lattice LCMXO640C-4TN100C, Lattice LCMXO640C-5TN100C, Lattice LCMXO640C-3TN100I, Lattice LCMXO640C-4TN100I", +U11 ,1,25F010,stdpads:SOIC-8_5.3mm,,C2687406,"Zetta ZD25WD20BTIGT, Adesto AT25SF081-SSHD, Winbond W25X20CLSNIG",Most SPI flash in SOIC-8 (3.9mm / 150 mil width) package is acceptable. +U2 ,1,W9812G6KH-6,stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm,,C62379,"Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G",Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable. +U3 U4 U5 ,3,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable. +U6 U7 ,2,74AHCT245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C173388,"NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW",Most 74AHCT245 in TSSOP-20 package is acceptable. +U8 ,1,XC6206P332MR,stdpads:SOT-23,,C5446,Torex XC6206P332MR,Most 3.3V regulator in SOT-23 package is acceptable. +U9 ,1,,stdpads:SOT-23-5,,,, \ No newline at end of file diff --git a/Hardware/LCMXO/gerber/RAM2E-BOM.LCMXOE.csv b/Hardware/LCMXO/gerber/RAM2E-BOM.LCMXOE.csv new file mode 100644 index 0000000..cd355dc --- /dev/null +++ b/Hardware/LCMXO/gerber/RAM2E-BOM.LCMXOE.csv @@ -0,0 +1,24 @@ +Reference, Quantity, Value, Footprint, Datasheet, LCSC Part, Mfg. Part Numbers, Notes +C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 C30 ,23,2u2,stdpads:C_0603,,C23630,Samsung CL10A225KO8NNNC,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +C1 C2 C3 C4 C5 C6 C29 ,7,10u,stdpads:C_0805,,C15850,Samsung CL21A106KAYNNNE,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +C31 ,1,15p,stdpads:C_0603,,,,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +D1 ,1,White,stdpads:LED_0805,,C34499,Hubei Kento C34499,Any manufacturer's part is acceptable. +FID1 FID2 FID3 FID4 ,4,Fiducial,stdpads:Fiducial,,,,DNP - SMT vision system fiducial +H1 H2 H3 H4 ,4, ,stdpads:PasteHole_1.152mm_NPTH,,,,DNP - mounting hole for solder paste printing +H5 ,1, ,stdpads:PasteHole_1.1mm_PTH,,,,DNP - mounting hole +J1 ,1,AppleIIeAux,stdpads:AppleIIeAux_Edge,,,,DNP - edge connector +J2 ,1,JTAG,stdpads:TC2050,,,,DNP - test pad connector +J3 ,1,C14M,Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical,,,,DNP +R1 ,1,DNP,stdpads:R_0805,,,, +R10 ,1,180,stdpads:R_0805,,C25270,Uniroyal 0805W8F1800T5E,Any manufacturer's part is acceptable. +R2 R3 R4 R5 R8 ,5,47,stdpads:R_0603,,C23182,Uniroyal 0603WAF470JT5E,Any manufacturer's part is acceptable. +R6 ,1,0,stdpads:R_0805,,C17477,Uniroyal 0805W8F0000T5E,Any manufacturer's part is acceptable. +R7 ,1,DNP,stdpads:R_0805,,,, +R9 ,1,10k,stdpads:R_0603,,C25804,Uniroyal 0603WAF1002T5E,Any manufacturer's part is acceptable. +U1 ,1,LCMXO256-TN100,stdpads:TQFP-100_14x14mm_P0.5mm,,C1550734,"Lattice LCMXO256E-3TN100C, Lattice LCMXO256E-4TN100C, Lattice LCMXO256E-5TN100C, Lattice LCMXO256E-3TN100I, Lattice LCMXO256E-4TN100I, Lattice LCMXO640E-3TN100C, Lattice LCMXO640E-4TN100C, Lattice LCMXO640E-5TN100C, Lattice LCMXO640E-3TN100I, Lattice LCMXO640E-4TN100I", +U11 ,1,25F010,stdpads:SOIC-8_5.3mm,,C2687406,"Zetta ZD25WD20BTIGT, Adesto AT25SF081-SSHD, Winbond W25X20CLSNIG",Most SPI flash in SOIC-8 (3.9mm / 150 mil width) package is acceptable. +U2 ,1,W9812G6KH-6,stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm,,C62379,"Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G",Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable. +U3 U4 U5 ,3,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable. +U6 U7 ,2,74AHCT245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C173388,"NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW",Most 74AHCT245 in TSSOP-20 package is acceptable. +U8 ,1,XC6206P332MR,stdpads:SOT-23,,C5446,Torex XC6206P332MR,Most 3.3V regulator in SOT-23 package is acceptable. +U9 ,1,AP2127K-1.2TRG1,stdpads:SOT-23-5,,C151376,"Diodes AP2127K-1.2TRG1, Torex XC6228D122VR",Most 1.2V regulator in SOT-23-5 package is acceptable. \ No newline at end of file diff --git a/Hardware/LCMXO/gerber/RAM2E-BOM.csv b/Hardware/LCMXO/gerber/RAM2E-BOM.csv deleted file mode 100644 index aeeba8f..0000000 --- a/Hardware/LCMXO/gerber/RAM2E-BOM.csv +++ /dev/null @@ -1,24 +0,0 @@ -Reference, Quantity, Value, Footprint, Datasheet, LCSC Part, Mfg. Part Numbers, Notes -C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 C30 ,23,"2u2","stdpads:C_0603","","C23630","Samsung CL10A225KO8NNNC","10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." -C1 C2 C3 C4 C5 C6 C29 ,7,"10u","stdpads:C_0805","","C15850","Samsung CL21A106KAYNNNE","10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." -C31 ,1,"15p","stdpads:C_0603","","","","10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." -D1 ,1,"White","stdpads:LED_0805","","C34499","Hubei Kento C34499","Any manufacturer's part is acceptable." -FID1 FID2 FID3 FID4 ,4,"Fiducial","stdpads:Fiducial","","","","DNP - SMT vision system fiducial" -H1 H2 H3 H4 ,4," ","stdpads:PasteHole_1.152mm_NPTH","","","","DNP - mounting hole for solder paste printing" -H5 ,1," ","stdpads:PasteHole_1.1mm_PTH","","","","DNP - mounting hole" -J1 ,1,"AppleIIeAux","stdpads:AppleIIeAux_Edge","","","","DNP - edge connector" -J2 ,1,"JTAG","stdpads:TC2050","","","","DNP - test pad connector" -J3 ,1,"C14M","Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical","","","","DNP" -R1 ,1,"0 ","stdpads:R_0805","","C17477","Uniroyal 0805W8F0000T5E","Any manufacturer's part is acceptable." -R10 ,1,"180","stdpads:R_0805","","C25270","Uniroyal 0805W8F1800T5E","Any manufacturer's part is acceptable." -R2 R3 R4 R5 R8 ,5,"47","stdpads:R_0603","","C23182","Uniroyal 0603WAF470JT5E","Any manufacturer's part is acceptable." -R6 ,1,"0","stdpads:R_0805","","C17477","Uniroyal 0805W8F0000T5E","Any manufacturer's part is acceptable." -R7 ,1,"DNP","stdpads:R_0805","" -R9 ,1,"10k","stdpads:R_0603","","C25804","Uniroyal 0603WAF1002T5E","Any manufacturer's part is acceptable." -U1 ,1,"LCMXO256-TN100","stdpads:TQFP-100_14x14mm_P0.5mm","","C1550734","Lattice LCMXO256C-3TN100C, Lattice LCMXO256C-4TN100C, Lattice LCMXO256C-5TN100C, Lattice LCMXO256C-3TN100I, Lattice LCMXO256C-4TN100I, Lattice LCMXO640C-3TN100C, Lattice LCMXO640C-4TN100C, Lattice LCMXO640C-5TN100C, Lattice LCMXO640C-3TN100I, Lattice LCMXO640C-4TN100I","" -U11 ,1,"25F010","stdpads:SOIC-8_5.3mm","","C2687406","Zetta ZD25WD20BTIGT, Adesto AT25SF081-SSHD, Winbond W25X20CLSNIG","Most SPI flash in SOIC-8 (3.9mm / 150 mil width) package is acceptable." -U2 ,1,"W9812G6KH-6","stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm","","C62379","Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G","Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable." -U3 U4 U5 ,3,"74LVC245APW","stdpads:TSSOP-20_4.4x6.5mm_P0.65mm","","C6082","NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW","Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable." -U6 U7 ,2,"74AHCT245PW","stdpads:TSSOP-20_4.4x6.5mm_P0.65mm","","C173388","NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW","Most 74AHCT245 in TSSOP-20 package is acceptable." -U8 ,1,"XC6206P332MR","stdpads:SOT-23","","C5446","Torex XC6206P332MR","Most 3.3V regulator in SOT-23 package is acceptable." -U9 ,1,"AP2127K-1.2TRG1","stdpads:SOT-23-5","","C151376","Diodes AP2127K-1.2TRG1, Torex XC6228D122VR","Most 1.2V regulator in SOT-23-5 package is acceptable." \ No newline at end of file diff --git a/Hardware/LCMXO2/gerber/RAM2E-BOM.LCMXO2.csv b/Hardware/LCMXO2/gerber/RAM2E-BOM.LCMXO2.csv deleted file mode 100644 index a0aedbb..0000000 --- a/Hardware/LCMXO2/gerber/RAM2E-BOM.LCMXO2.csv +++ /dev/null @@ -1,23 +0,0 @@ -Reference, Quantity, Value, Footprint, Datasheet, LCSC Part, Mfg. Part Numbers, Notes -C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 C30 ,23,"2u2","stdpads:C_0603","","C23630","Samsung CL10A225KO8NNNC","10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." -C1 C2 C3 C4 C5 C6 C29 ,7,"10u","stdpads:C_0805","","C15850","Samsung CL21A106KAYNNNE","10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." -C31 ,1,"15p","stdpads:C_0603","","C1644","Samsung CL10C150JB8NNNC","10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." -D1 ,1,"White","stdpads:LED_0805","","C34499","Hubei Kento C34499","Any manufacturer's part is acceptable." -FID1 FID2 FID3 FID4 ,4,"Fiducial","stdpads:Fiducial","","","","DNP - SMT vision system fiducial" -H1 H2 H3 H4 ,4," ","stdpads:PasteHole_1.152mm_NPTH","","","","DNP - mounting hole for solder paste printing" -H5 ,1," ","stdpads:PasteHole_1.1mm_PTH","","","","DNP - mounting hole" -J1 ,1,"AppleIIeAux","stdpads:AppleIIeAux_Edge","","","","DNP - edge connector" -J2 ,1,"JTAG","stdpads:TC2050","","","","DNP - test pad connector" -J3 ,1,"C14M","Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical","","","","DNP" -R1 ,1,"0 ","stdpads:R_0805","","C17477","Uniroyal 0805W8F0000T5E","Any manufacturer's part is acceptable." -R10 ,1,"180","stdpads:R_0805","","C25270","Uniroyal 0805W8F1800T5E","Any manufacturer's part is acceptable." -R2 R3 R4 R12 R13 ,5,"47","stdpads:R_0603","","C23182","Uniroyal 0603WAF470JT5E","Any manufacturer's part is acceptable." -R6 ,1,"0","stdpads:R_0805","","C17477","Uniroyal 0805W8F0000T5E","Any manufacturer's part is acceptable." -R7 ,1,"DNP","stdpads:R_0805","" -R5 R8 R9 R11 ,4,"10k","stdpads:R_0603","","C25804","Uniroyal 0603WAF1002T5E","Any manufacturer's part is acceptable." -U1 ,1,"LCMXO2-TG100","stdpads:TQFP-100_14x14mm_P0.5mm","","C1519051","Lattice LCMXO2-640HC-4TG100C, Lattice LCMXO2-640HC-5TG100C, Lattice LCMXO2-640HC-6TG100C, Lattice LCMXO2-640HC-4TG100I, Lattice LCMXO2-640HC-5TG100I, Lattice LCMXO2-640HC-6TG100I, Lattice LCMXO2-1200HC-4TG100C, Lattice LCMXO2-1200HC-5TG100C, Lattice LCMXO2-1200HC-6TG100C, Lattice LCMXO2-1200HC-4TG100I, Lattice LCMXO2-1200HC-5TG100I, Lattice LCMXO2-1200HC-6TG100I","" -U2 ,1,"W9812G6KH-6","stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm","","C62379","Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G","Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable." -U3 U4 U5 ,3,"74LVC245APW","stdpads:TSSOP-20_4.4x6.5mm_P0.65mm","","C6082","NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI 74AHC245PW","Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable." -U6 U7 ,2,"74AHCT245PW","stdpads:TSSOP-20_4.4x6.5mm_P0.65mm","","C173388","NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW","Most 74AHCT245 in TSSOP-20 package is acceptable." -U8 ,1,"XC6206P332MR","stdpads:SOT-23","","C5446","Torex XC6206P332MR","Most 3.3V regulator in SOT-23 package is acceptable." -U9 ,1,"AP2127K-1.2TRG1","stdpads:SOT-23-5","","C151376","Diodes AP2127K-1.2TRG1, Torex XC6228D122VR","Most 1.2V regulator in SOT-23-5 package is acceptable." \ No newline at end of file diff --git a/Hardware/LCMXO2/gerber/RAM2E-BOM.LCMXO2HC.csv b/Hardware/LCMXO2/gerber/RAM2E-BOM.LCMXO2HC.csv new file mode 100644 index 0000000..f9442cb --- /dev/null +++ b/Hardware/LCMXO2/gerber/RAM2E-BOM.LCMXO2HC.csv @@ -0,0 +1,23 @@ +Reference, Quantity, Value, Footprint, Datasheet, LCSC Part, Mfg. Part Numbers, Notes +C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 C30 ,23,2u2,stdpads:C_0603,,C23630,Samsung CL10A225KO8NNNC,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +C1 C2 C3 C4 C5 C6 C29 ,7,10u,stdpads:C_0805,,C15850,Samsung CL21A106KAYNNNE,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +C31 ,1,15p,stdpads:C_0603,,C1644,Samsung CL10C150JB8NNNC,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +D1 ,1,White,stdpads:LED_0805,,C34499,Hubei Kento C34499,Any manufacturer's part is acceptable. +FID1 FID2 FID3 FID4 ,4,Fiducial,stdpads:Fiducial,,,,DNP - SMT vision system fiducial +H1 H2 H3 H4 ,4, ,stdpads:PasteHole_1.152mm_NPTH,,,,DNP - mounting hole for solder paste printing +H5 ,1, ,stdpads:PasteHole_1.1mm_PTH,,,,DNP - mounting hole +J1 ,1,AppleIIeAux,stdpads:AppleIIeAux_Edge,,,,DNP - edge connector +J2 ,1,JTAG,stdpads:TC2050,,,,DNP - test pad connector +J3 ,1,C14M,Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical,,,,DNP +R1 ,1,0,stdpads:R_0805,,C17477,Uniroyal 0805W8F0000T5E,Any manufacturer's part is acceptable. +R10 ,1,180,stdpads:R_0805,,C25270,Uniroyal 0805W8F1800T5E,Any manufacturer's part is acceptable. +R2 R3 R4 R12 R13 ,5,47,stdpads:R_0603,,C23182,Uniroyal 0603WAF470JT5E,Any manufacturer's part is acceptable. +R6 ,1,0,stdpads:R_0805,,C17477,Uniroyal 0805W8F0000T5E,Any manufacturer's part is acceptable. +R7 ,1,DNP,stdpads:R_0805,,,, +R5 R8 R9 R11 ,4,10k,stdpads:R_0603,,C25804,Uniroyal 0603WAF1002T5E,Any manufacturer's part is acceptable. +U1 ,1,LCMXO2-TG100,stdpads:TQFP-100_14x14mm_P0.5mm,,C1519051,"Lattice LCMXO2-640HC-4TG100C, Lattice LCMXO2-640HC-5TG100C, Lattice LCMXO2-640HC-6TG100C, Lattice LCMXO2-640HC-4TG100I, Lattice LCMXO2-640HC-5TG100I, Lattice LCMXO2-640HC-6TG100I, Lattice LCMXO2-1200HC-4TG100C, Lattice LCMXO2-1200HC-5TG100C, Lattice LCMXO2-1200HC-6TG100C, Lattice LCMXO2-1200HC-4TG100I, Lattice LCMXO2-1200HC-5TG100I, Lattice LCMXO2-1200HC-6TG100I", +U2 ,1,W9812G6KH-6,stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm,,C62379,"Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G",Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable. +U3 U4 U5 ,3,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI 74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable. +U6 U7 ,2,74AHCT245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C173388,"NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW",Most 74AHCT245 in TSSOP-20 package is acceptable. +U8 ,1,XC6206P332MR,stdpads:SOT-23,,C5446,Torex XC6206P332MR,Most 3.3V regulator in SOT-23 package is acceptable. +U9 ,1,DNP,stdpads:SOT-23-5,,,, \ No newline at end of file diff --git a/Hardware/LCMXO2/gerber/RAM2E-BOM.LCMXO2HE.csv b/Hardware/LCMXO2/gerber/RAM2E-BOM.LCMXO2HE.csv new file mode 100644 index 0000000..86ca3ce --- /dev/null +++ b/Hardware/LCMXO2/gerber/RAM2E-BOM.LCMXO2HE.csv @@ -0,0 +1,23 @@ +Reference, Quantity, Value, Footprint, Datasheet, LCSC Part, Mfg. Part Numbers, Notes +C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 C30 ,23,2u2,stdpads:C_0603,,C23630,Samsung CL10A225KO8NNNC,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +C1 C2 C3 C4 C5 C6 C29 ,7,10u,stdpads:C_0805,,C15850,Samsung CL21A106KAYNNNE,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +C31 ,1,15p,stdpads:C_0603,,C1644,Samsung CL10C150JB8NNNC,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +D1 ,1,White,stdpads:LED_0805,,C34499,Hubei Kento C34499,Any manufacturer's part is acceptable. +FID1 FID2 FID3 FID4 ,4,Fiducial,stdpads:Fiducial,,,,DNP - SMT vision system fiducial +H1 H2 H3 H4 ,4, ,stdpads:PasteHole_1.152mm_NPTH,,,,DNP - mounting hole for solder paste printing +H5 ,1, ,stdpads:PasteHole_1.1mm_PTH,,,,DNP - mounting hole +J1 ,1,AppleIIeAux,stdpads:AppleIIeAux_Edge,,,,DNP - edge connector +J2 ,1,JTAG,stdpads:TC2050,,,,DNP - test pad connector +J3 ,1,C14M,Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical,,,,DNP +R1 ,1,DNP,stdpads:R_0805,,,, +R10 ,1,180,stdpads:R_0805,,C25270,Uniroyal 0805W8F1800T5E,Any manufacturer's part is acceptable. +R2 R3 R4 R12 R13 ,5,47,stdpads:R_0603,,C23182,Uniroyal 0603WAF470JT5E,Any manufacturer's part is acceptable. +R6 ,1,0,stdpads:R_0805,,C17477,Uniroyal 0805W8F0000T5E,Any manufacturer's part is acceptable. +R7 ,1,DNP,stdpads:R_0805,,,, +R5 R8 R9 R11 ,4,10k,stdpads:R_0603,,C25804,Uniroyal 0603WAF1002T5E,Any manufacturer's part is acceptable. +U1 ,1,LCMXO2-TG100,stdpads:TQFP-100_14x14mm_P0.5mm,,C1519051,"Lattice LCMXO2-640HE-4TG100C, Lattice LCMXO2-640HE-5TG100C, Lattice LCMXO2-640HE-6TG100C, Lattice LCMXO2-640HE-4TG100I, Lattice LCMXO2-640HE-5TG100I, Lattice LCMXO2-640HE-6TG100I, Lattice LCMXO2-1200HE-4TG100C, Lattice LCMXO2-1200HE-5TG100C, Lattice LCMXO2-1200HE-6TG100C, Lattice LCMXO2-1200HE-4TG100I, Lattice LCMXO2-1200HE-5TG100I, Lattice LCMXO2-1200HE-6TG100I", +U2 ,1,W9812G6KH-6,stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm,,C62379,"Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G",Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable. +U3 U4 U5 ,3,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI 74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable. +U6 U7 ,2,74AHCT245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C173388,"NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW",Most 74AHCT245 in TSSOP-20 package is acceptable. +U8 ,1,XC6206P332MR,stdpads:SOT-23,,C5446,Torex XC6206P332MR,Most 3.3V regulator in SOT-23 package is acceptable. +U9 ,1,AP2127K-1.2TRG1,stdpads:SOT-23-5,,C151376,"Diodes AP2127K-1.2TRG1, Torex XC6228D122VR",Most 1.2V regulator in SOT-23-5 package is acceptable. \ No newline at end of file diff --git a/Hardware/LCMXO2/gerber/RAM2E-BOM.LCMXO2ZE.csv b/Hardware/LCMXO2/gerber/RAM2E-BOM.LCMXO2ZE.csv new file mode 100644 index 0000000..461679f --- /dev/null +++ b/Hardware/LCMXO2/gerber/RAM2E-BOM.LCMXO2ZE.csv @@ -0,0 +1,23 @@ +Reference, Quantity, Value, Footprint, Datasheet, LCSC Part, Mfg. Part Numbers, Notes +C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 C30 ,23,2u2,stdpads:C_0603,,C23630,Samsung CL10A225KO8NNNC,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +C1 C2 C3 C4 C5 C6 C29 ,7,10u,stdpads:C_0805,,C15850,Samsung CL21A106KAYNNNE,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +C31 ,1,15p,stdpads:C_0603,,C1644,Samsung CL10C150JB8NNNC,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +D1 ,1,White,stdpads:LED_0805,,C34499,Hubei Kento C34499,Any manufacturer's part is acceptable. +FID1 FID2 FID3 FID4 ,4,Fiducial,stdpads:Fiducial,,,,DNP - SMT vision system fiducial +H1 H2 H3 H4 ,4, ,stdpads:PasteHole_1.152mm_NPTH,,,,DNP - mounting hole for solder paste printing +H5 ,1, ,stdpads:PasteHole_1.1mm_PTH,,,,DNP - mounting hole +J1 ,1,AppleIIeAux,stdpads:AppleIIeAux_Edge,,,,DNP - edge connector +J2 ,1,JTAG,stdpads:TC2050,,,,DNP - test pad connector +J3 ,1,C14M,Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical,,,,DNP +R1 ,1,DNP,stdpads:R_0805,,,, +R10 ,1,180,stdpads:R_0805,,C25270,Uniroyal 0805W8F1800T5E,Any manufacturer's part is acceptable. +R2 R3 R4 R12 R13 ,5,47,stdpads:R_0603,,C23182,Uniroyal 0603WAF470JT5E,Any manufacturer's part is acceptable. +R6 ,1,0,stdpads:R_0805,,C17477,Uniroyal 0805W8F0000T5E,Any manufacturer's part is acceptable. +R7 ,1,DNP,stdpads:R_0805,,,, +R5 R8 R9 R11 ,4,10k,stdpads:R_0603,,C25804,Uniroyal 0603WAF1002T5E,Any manufacturer's part is acceptable. +U1 ,1,LCMXO2-TG100,stdpads:TQFP-100_14x14mm_P0.5mm,,C1519051,"Lattice LCMXO2-640ZE-4TG100C, Lattice LCMXO2-640ZE-5TG100C, Lattice LCMXO2-640ZE-6TG100C, Lattice LCMXO2-640ZE-4TG100I, Lattice LCMXO2-640ZE-5TG100I, Lattice LCMXO2-640ZE-6TG100I, Lattice LCMXO2-1200ZE-4TG100C, Lattice LCMXO2-1200ZE-5TG100C, Lattice LCMXO2-1200ZE-6TG100C, Lattice LCMXO2-1200ZE-4TG100I, Lattice LCMXO2-1200ZE-5TG100I, Lattice LCMXO2-1200ZE-6TG100I", +U2 ,1,W9812G6KH-6,stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm,,C62379,"Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G",Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable. +U3 U4 U5 ,3,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI 74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable. +U6 U7 ,2,74AHCT245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C173388,"NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW",Most 74AHCT245 in TSSOP-20 package is acceptable. +U8 ,1,XC6206P332MR,stdpads:SOT-23,,C5446,Torex XC6206P332MR,Most 3.3V regulator in SOT-23 package is acceptable. +U9 ,1,AP2127K-1.2TRG1,stdpads:SOT-23-5,,C151376,"Diodes AP2127K-1.2TRG1, Torex XC6228D122VR",Most 1.2V regulator in SOT-23-5 package is acceptable. \ No newline at end of file diff --git a/Hardware/MAX/RAM2E.sch b/Hardware/MAX/RAM2E.sch index 98eeeea..6846bf0 100644 --- a/Hardware/MAX/RAM2E.sch +++ b/Hardware/MAX/RAM2E.sch @@ -2043,7 +2043,7 @@ F 1 "EPM240T100" H 5600 4000 50 0000 C CNN F 2 "stdpads:TQFP-100_14x14mm_P0.5mm" H 6000 1700 50 0001 L CNN F 3 "" H 5600 4050 50 0001 C CNN F 4 "C10041" H 5600 4050 50 0001 C CNN "LCSC Part" -F 5 "Altera 5M240ZT100C5N , Altera 5M240ZT100C4N, Altera 5M240ZT100C3N, Altera 5M240ZT100I5N, Altera 5M240ZT100I4N, Altera 5M240ZT100A5N, Altera 5M240ZT100A4N, Altera EPM240T100C5N, Altera EPM240T100C4N, Altera EPM240T100C3N, Altera EPM240T100I5N, Altera EPM240T100I4N, Altera EPM240T100A5N, Altera EPM240T100A4N, AGM/Alta-Gate AG256SL100, AGM AG256SL100C3, AGM AG256SL100C4, AGM/Alta-Gate AG272SL100, AGM AG272SL100C3, AGM AG272SL100C4, AGM/Alta-Gate AG576SL100, AGM AG576SL100C3, AGM AG576SL100C4" H 5600 4050 50 0001 C CNN "Mfg. Part Numbers" +F 5 "Altera 5M240ZT100C5N, Altera 5M240ZT100C4N, Altera 5M240ZT100C3N, Altera 5M240ZT100I5N, Altera 5M240ZT100I4N, Altera 5M240ZT100A5N, Altera 5M240ZT100A4N, Altera EPM240T100C5N, Altera EPM240T100C4N, Altera EPM240T100C3N, Altera EPM240T100I5N, Altera EPM240T100I4N, Altera EPM240T100A5N, Altera EPM240T100A4N, AGM/Alta-Gate AG256SL100, AGM AG256SL100C3, AGM AG256SL100C4, AGM/Alta-Gate AG272SL100, AGM AG272SL100C3, AGM AG272SL100C4, AGM/Alta-Gate AG576SL100, AGM AG576SL100C3, AGM AG576SL100C4" H 5600 4050 50 0001 C CNN "Mfg. Part Numbers" 1 5600 4050 1 0 0 -1 $EndComp diff --git a/Hardware/MAX/gerber/RAM2E-BOM.AGM.csv b/Hardware/MAX/gerber/RAM2E-BOM.AGM.csv new file mode 100644 index 0000000..4d431a3 --- /dev/null +++ b/Hardware/MAX/gerber/RAM2E-BOM.AGM.csv @@ -0,0 +1,22 @@ +Reference, Quantity, Value, Footprint, Datasheet, LCSC Part, Mfg. Part Numbers, Notes +C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 ,22,2u2,stdpads:C_0603,,C23630,Samsung CL10A225KO8NNNC,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +C1 C2 C3 C4 C5 C6 C29 ,7,10u,stdpads:C_0805,,C15850,Samsung CL21A106KAYNNNE,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +D1 ,1,White,stdpads:LED_0805,,C34499,Hubei Kento C34499,Any manufacturer's part is acceptable. +FID1 FID2 FID3 FID4 ,4,Fiducial,stdpads:Fiducial,,,,DNP - SMT vision system fiducial +H1 H2 H3 H4 ,4, ,stdpads:PasteHole_1.152mm_NPTH,,,,DNP - mounting hole for solder paste printing +H5 ,1, ,stdpads:PasteHole_1.1mm_PTH,,,,DNP - mounting hole +J1 ,1,AppleIIeAux,stdpads:AppleIIeAux_Edge,,,,DNP - edge connector +J2 ,1,JTAG,stdpads:TC2050,,,,DNP - test pad connector +J3 ,1,C14M,Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical,,,,DNP +R1 ,1,0,stdpads:R_0805,,C17477,Uniroyal 0805W8F0000T5E,Any manufacturer's part is acceptable. +R2 R3 R4 R5 ,4,47,stdpads:R_0603,,C23182,Uniroyal 0603WAF470JT5E,Any manufacturer's part is acceptable. +R6 ,1,0,stdpads:R_0805,,C17477,Uniroyal 0805W8F0000T5E,Any manufacturer's part is acceptable. +R7 ,1,DNP,stdpads:R_0805,,,, +R8 ,1,180,stdpads:R_0805,,C25270,Uniroyal 0805W8F1800T5E,Any manufacturer's part is acceptable. +R9 R10 ,2,22k,stdpads:R_0805,,C17560,Uniroyal 0805W8F2202T5E,Any manufacturer's part is acceptable. +U1 ,1,EPM240T100,stdpads:TQFP-100_14x14mm_P0.5mm,,C10041,"AGM/Alta-Gate AG256SL100, AGM AG256SL100C3, AGM AG256SL100C4, AGM/Alta-Gate AG272SL100, AGM AG272SL100C3, AGM AG272SL100C4, AGM/Alta-Gate AG576SL100, AGM AG576SL100C3, AGM AG576SL100C4", +U2 ,1,W9812G6KH-6,stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm,,C62379,"Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G",Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable. +U3 U4 U5 ,3,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable. +U6 U7 ,2,74AHCT245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C173388,"NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW",Most 74AHCT245 in TSSOP-20 package is acceptable. +U8 ,1,XC6206P332MR,stdpads:SOT-23,,C5446,Torex XC6206P332MR,Most 3.3V regulator in SOT-23 package is acceptable. +U9 ,1,AP2127K-1.8TRG1,stdpads:SOT-23-5,,C151375,"Diodes AP2127K-1.8TRG1, Torex XC6228D182VR",Most 1.8V regulator in SOT-23-5 package is acceptable. \ No newline at end of file diff --git a/Hardware/MAX/gerber/RAM2E-BOM.MAX.csv b/Hardware/MAX/gerber/RAM2E-BOM.MAX.csv deleted file mode 100644 index 82e21d8..0000000 --- a/Hardware/MAX/gerber/RAM2E-BOM.MAX.csv +++ /dev/null @@ -1,22 +0,0 @@ -Reference, Quantity, Value, Footprint, Datasheet, LCSC Part, Mfg. Part Numbers, Notes -C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 ,22,"2u2","stdpads:C_0603","","C23630","Samsung CL10A225KO8NNNC","10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." -C1 C2 C3 C4 C5 C6 C29 ,7,"10u","stdpads:C_0805","","C15850","Samsung CL21A106KAYNNNE","10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." -D1 ,1,"White","stdpads:LED_0805","","C34499","Hubei Kento C34499","Any manufacturer's part is acceptable." -FID1 FID2 FID3 FID4 ,4,"Fiducial","stdpads:Fiducial","","","","DNP - SMT vision system fiducial" -H1 H2 H3 H4 ,4," ","stdpads:PasteHole_1.152mm_NPTH","","","","DNP - mounting hole for solder paste printing" -H5 ,1," ","stdpads:PasteHole_1.1mm_PTH","","","","DNP - mounting hole" -J1 ,1,"AppleIIeAux","stdpads:AppleIIeAux_Edge","","","","DNP - edge connector" -J2 ,1,"JTAG","stdpads:TC2050","","","","DNP - test pad connector" -J3 ,1,"C14M","Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical","","","","DNP" -R1 ,1,"0 ","stdpads:R_0805","","C17477","Uniroyal 0805W8F0000T5E","Any manufacturer's part is acceptable." -R2 R3 R4 R5 ,4,"47","stdpads:R_0603","","C23182","Uniroyal 0603WAF470JT5E","Any manufacturer's part is acceptable." -R6 ,1,"0","stdpads:R_0805","","C17477","Uniroyal 0805W8F0000T5E","Any manufacturer's part is acceptable." -R7 ,1,"DNP","stdpads:R_0805","" -R8 ,1,"180","stdpads:R_0805","","C25270","Uniroyal 0805W8F1800T5E","Any manufacturer's part is acceptable." -R9 R10 ,2,"22k","stdpads:R_0805","","C17560","Uniroyal 0805W8F2202T5E","Any manufacturer's part is acceptable." -U1 ,1,"EPM240T100","stdpads:TQFP-100_14x14mm_P0.5mm","","C10041","Altera 5M240ZT100C5N , Altera 5M240ZT100C4N, Altera 5M240ZT100C3N, Altera 5M240ZT100I5N, Altera 5M240ZT100I4N, Altera 5M240ZT100A5N, Altera 5M240ZT100A4N, Altera EPM240T100C5N, Altera EPM240T100C4N, Altera EPM240T100C3N, Altera EPM240T100I5N, Altera EPM240T100I4N, Altera EPM240T100A5N, Altera EPM240T100A4N, AGM/Alta-Gate AG256SL100, AGM AG256SL100C3, AGM AG256SL100C4, AGM/Alta-Gate AG272SL100, AGM AG272SL100C3, AGM AG272SL100C4, AGM/Alta-Gate AG576SL100, AGM AG576SL100C3, AGM AG576SL100C4","" -U2 ,1,"W9812G6KH-6","stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm","","C62379","Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G","Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable." -U3 U4 U5 ,3,"74LVC245APW","stdpads:TSSOP-20_4.4x6.5mm_P0.65mm","","C6082","NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW","Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable." -U6 U7 ,2,"74AHCT245PW","stdpads:TSSOP-20_4.4x6.5mm_P0.65mm","","C173388","NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW","Most 74AHCT245 in TSSOP-20 package is acceptable." -U8 ,1,"XC6206P332MR","stdpads:SOT-23","","C5446","Torex XC6206P332MR","Most 3.3V regulator in SOT-23 package is acceptable." -U9 ,1,"AP2127K-1.8TRG1","stdpads:SOT-23-5","","C151375","Diodes AP2127K-1.8TRG1, Torex XC6228D182VR","Most 1.8V regulator in SOT-23-5 package is acceptable." \ No newline at end of file diff --git a/Hardware/MAX/gerber/RAM2E-BOM.MAXII.csv b/Hardware/MAX/gerber/RAM2E-BOM.MAXII.csv new file mode 100644 index 0000000..27d9e8d --- /dev/null +++ b/Hardware/MAX/gerber/RAM2E-BOM.MAXII.csv @@ -0,0 +1,22 @@ +Reference, Quantity, Value, Footprint, Datasheet, LCSC Part, Mfg. Part Numbers, Notes +C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 ,22,2u2,stdpads:C_0603,,C23630,Samsung CL10A225KO8NNNC,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +C1 C2 C3 C4 C5 C6 C29 ,7,10u,stdpads:C_0805,,C15850,Samsung CL21A106KAYNNNE,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +D1 ,1,White,stdpads:LED_0805,,C34499,Hubei Kento C34499,Any manufacturer's part is acceptable. +FID1 FID2 FID3 FID4 ,4,Fiducial,stdpads:Fiducial,,,,DNP - SMT vision system fiducial +H1 H2 H3 H4 ,4, ,stdpads:PasteHole_1.152mm_NPTH,,,,DNP - mounting hole for solder paste printing +H5 ,1, ,stdpads:PasteHole_1.1mm_PTH,,,,DNP - mounting hole +J1 ,1,AppleIIeAux,stdpads:AppleIIeAux_Edge,,,,DNP - edge connector +J2 ,1,JTAG,stdpads:TC2050,,,,DNP - test pad connector +J3 ,1,C14M,Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical,,,,DNP +R1 ,1,0,stdpads:R_0805,,C17477,Uniroyal 0805W8F0000T5E,Any manufacturer's part is acceptable. +R2 R3 R4 R5 ,4,47,stdpads:R_0603,,C23182,Uniroyal 0603WAF470JT5E,Any manufacturer's part is acceptable. +R6 ,1,0,stdpads:R_0805,,C17477,Uniroyal 0805W8F0000T5E,Any manufacturer's part is acceptable. +R7 ,1,DNP,stdpads:R_0805,,,, +R8 ,1,180,stdpads:R_0805,,C25270,Uniroyal 0805W8F1800T5E,Any manufacturer's part is acceptable. +R9 R10 ,2,22k,stdpads:R_0805,,C17560,Uniroyal 0805W8F2202T5E,Any manufacturer's part is acceptable. +U1 ,1,EPM240T100,stdpads:TQFP-100_14x14mm_P0.5mm,,C10041,"Altera EPM240T100C5N, Altera EPM240T100C4N, Altera EPM240T100C3N, Altera EPM240T100I5N, Altera EPM240T100I4N, Altera EPM240T100A5N, Altera EPM240T100A4N", +U2 ,1,W9812G6KH-6,stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm,,C62379,"Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G",Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable. +U3 U4 U5 ,3,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable. +U6 U7 ,2,74AHCT245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C173388,"NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW",Most 74AHCT245 in TSSOP-20 package is acceptable. +U8 ,1,XC6206P332MR,stdpads:SOT-23,,C5446,Torex XC6206P332MR,Most 3.3V regulator in SOT-23 package is acceptable. +U9 ,1,AP2127K-1.8TRG1,stdpads:SOT-23-5,,C151375,"Diodes AP2127K-1.8TRG1, Torex XC6228D182VR",Most 1.8V regulator in SOT-23-5 package is acceptable. \ No newline at end of file diff --git a/Hardware/MAX/gerber/RAM2E-BOM.MAXIIG.csv b/Hardware/MAX/gerber/RAM2E-BOM.MAXIIG.csv new file mode 100644 index 0000000..98df9b5 --- /dev/null +++ b/Hardware/MAX/gerber/RAM2E-BOM.MAXIIG.csv @@ -0,0 +1,22 @@ +Reference, Quantity, Value, Footprint, Datasheet, LCSC Part, Mfg. Part Numbers, Notes +C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 ,22,2u2,stdpads:C_0603,,C23630,Samsung CL10A225KO8NNNC,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +C1 C2 C3 C4 C5 C6 C29 ,7,10u,stdpads:C_0805,,C15850,Samsung CL21A106KAYNNNE,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +D1 ,1,White,stdpads:LED_0805,,C34499,Hubei Kento C34499,Any manufacturer's part is acceptable. +FID1 FID2 FID3 FID4 ,4,Fiducial,stdpads:Fiducial,,,,DNP - SMT vision system fiducial +H1 H2 H3 H4 ,4, ,stdpads:PasteHole_1.152mm_NPTH,,,,DNP - mounting hole for solder paste printing +H5 ,1, ,stdpads:PasteHole_1.1mm_PTH,,,,DNP - mounting hole +J1 ,1,AppleIIeAux,stdpads:AppleIIeAux_Edge,,,,DNP - edge connector +J2 ,1,JTAG,stdpads:TC2050,,,,DNP - test pad connector +J3 ,1,C14M,Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical,,,,DNP +R1 ,1,DNP,stdpads:R_0805,,,, +R2 R3 R4 R5 ,4,47,stdpads:R_0603,,C23182,Uniroyal 0603WAF470JT5E,Any manufacturer's part is acceptable. +R6 ,1,0,stdpads:R_0805,,C17477,Uniroyal 0805W8F0000T5E,Any manufacturer's part is acceptable. +R7 ,1,DNP,stdpads:R_0805,,,, +R8 ,1,180,stdpads:R_0805,,C25270,Uniroyal 0805W8F1800T5E,Any manufacturer's part is acceptable. +R9 R10 ,2,22k,stdpads:R_0805,,C17560,Uniroyal 0805W8F2202T5E,Any manufacturer's part is acceptable. +U1 ,1,5M240ZT100,stdpads:TQFP-100_14x14mm_P0.5mm,,C10041,"Altera EPM240GT100C5N, Altera EPM240GT100C4N, Altera EPM240GT100C3N, Altera EPM240GT100I5N, Altera EPM240GT100I4N, Altera EPM240GT100A5N, Altera EPM240GT100A4N", +U2 ,1,W9812G6KH-6,stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm,,C62379,"Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G",Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable. +U3 U4 U5 ,3,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable. +U6 U7 ,2,74AHCT245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C173388,"NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW",Most 74AHCT245 in TSSOP-20 package is acceptable. +U8 ,1,XC6206P332MR,stdpads:SOT-23,,C5446,Torex XC6206P332MR,Most 3.3V regulator in SOT-23 package is acceptable. +U9 ,1,AP2127K-1.8TRG1,stdpads:SOT-23-5,,C151375,"Diodes AP2127K-1.8TRG1, Torex XC6228D182VR",Most 1.8V regulator in SOT-23-5 package is acceptable. \ No newline at end of file diff --git a/Hardware/MAX/gerber/RAM2E-BOM.MAXIIZ.csv b/Hardware/MAX/gerber/RAM2E-BOM.MAXIIZ.csv new file mode 100644 index 0000000..c6e0889 --- /dev/null +++ b/Hardware/MAX/gerber/RAM2E-BOM.MAXIIZ.csv @@ -0,0 +1,22 @@ +Reference, Quantity, Value, Footprint, Datasheet, LCSC Part, Mfg. Part Numbers, Notes +C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 ,22,2u2,stdpads:C_0603,,C23630,Samsung CL10A225KO8NNNC,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +C1 C2 C3 C4 C5 C6 C29 ,7,10u,stdpads:C_0805,,C15850,Samsung CL21A106KAYNNNE,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +D1 ,1,White,stdpads:LED_0805,,C34499,Hubei Kento C34499,Any manufacturer's part is acceptable. +FID1 FID2 FID3 FID4 ,4,Fiducial,stdpads:Fiducial,,,,DNP - SMT vision system fiducial +H1 H2 H3 H4 ,4, ,stdpads:PasteHole_1.152mm_NPTH,,,,DNP - mounting hole for solder paste printing +H5 ,1, ,stdpads:PasteHole_1.1mm_PTH,,,,DNP - mounting hole +J1 ,1,AppleIIeAux,stdpads:AppleIIeAux_Edge,,,,DNP - edge connector +J2 ,1,JTAG,stdpads:TC2050,,,,DNP - test pad connector +J3 ,1,C14M,Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical,,,,DNP +R1 ,1,DNP,stdpads:R_0805,,,, +R2 R3 R4 R5 ,4,47,stdpads:R_0603,,C23182,Uniroyal 0603WAF470JT5E,Any manufacturer's part is acceptable. +R6 ,1,0,stdpads:R_0805,,C17477,Uniroyal 0805W8F0000T5E,Any manufacturer's part is acceptable. +R7 ,1,DNP,stdpads:R_0805,,,, +R8 ,1,180,stdpads:R_0805,,C25270,Uniroyal 0805W8F1800T5E,Any manufacturer's part is acceptable. +R9 R10 ,2,22k,stdpads:R_0805,,C17560,Uniroyal 0805W8F2202T5E,Any manufacturer's part is acceptable. +U1 ,1,5M240ZT100,stdpads:TQFP-100_14x14mm_P0.5mm,,C10041,"Altera EPM240ZT100C5N, Altera EPM240ZT100C4N, Altera EPM240ZT100C3N, Altera EPM240ZT100I5N, Altera EPM240ZT100I4N, Altera EPM240ZT100A5N, Altera EPM240ZT100A4N", +U2 ,1,W9812G6KH-6,stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm,,C62379,"Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G",Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable. +U3 U4 U5 ,3,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable. +U6 U7 ,2,74AHCT245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C173388,"NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW",Most 74AHCT245 in TSSOP-20 package is acceptable. +U8 ,1,XC6206P332MR,stdpads:SOT-23,,C5446,Torex XC6206P332MR,Most 3.3V regulator in SOT-23 package is acceptable. +U9 ,1,AP2127K-1.8TRG1,stdpads:SOT-23-5,,C151375,"Diodes AP2127K-1.8TRG1, Torex XC6228D182VR",Most 1.8V regulator in SOT-23-5 package is acceptable. \ No newline at end of file diff --git a/Hardware/MAX/gerber/RAM2E-BOM.MAXV.csv b/Hardware/MAX/gerber/RAM2E-BOM.MAXV.csv new file mode 100644 index 0000000..20e7f6e --- /dev/null +++ b/Hardware/MAX/gerber/RAM2E-BOM.MAXV.csv @@ -0,0 +1,22 @@ +Reference, Quantity, Value, Footprint, Datasheet, LCSC Part, Mfg. Part Numbers, Notes +C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 ,22,2u2,stdpads:C_0603,,C23630,Samsung CL10A225KO8NNNC,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +C1 C2 C3 C4 C5 C6 C29 ,7,10u,stdpads:C_0805,,C15850,Samsung CL21A106KAYNNNE,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred." +D1 ,1,White,stdpads:LED_0805,,C34499,Hubei Kento C34499,Any manufacturer's part is acceptable. +FID1 FID2 FID3 FID4 ,4,Fiducial,stdpads:Fiducial,,,,DNP - SMT vision system fiducial +H1 H2 H3 H4 ,4, ,stdpads:PasteHole_1.152mm_NPTH,,,,DNP - mounting hole for solder paste printing +H5 ,1, ,stdpads:PasteHole_1.1mm_PTH,,,,DNP - mounting hole +J1 ,1,AppleIIeAux,stdpads:AppleIIeAux_Edge,,,,DNP - edge connector +J2 ,1,JTAG,stdpads:TC2050,,,,DNP - test pad connector +J3 ,1,C14M,Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical,,,,DNP +R1 ,1,DNP,stdpads:R_0805,,,, +R2 R3 R4 R5 ,4,47,stdpads:R_0603,,C23182,Uniroyal 0603WAF470JT5E,Any manufacturer's part is acceptable. +R6 ,1,0,stdpads:R_0805,,C17477,Uniroyal 0805W8F0000T5E,Any manufacturer's part is acceptable. +R7 ,1,DNP,stdpads:R_0805,,,, +R8 ,1,180,stdpads:R_0805,,C25270,Uniroyal 0805W8F1800T5E,Any manufacturer's part is acceptable. +R9 R10 ,2,22k,stdpads:R_0805,,C17560,Uniroyal 0805W8F2202T5E,Any manufacturer's part is acceptable. +U1 ,1,5M240ZT100,stdpads:TQFP-100_14x14mm_P0.5mm,,C10041,"Altera 5M240ZT100C5N, Altera 5M240ZT100C4N, Altera 5M240ZT100C3N, Altera 5M240ZT100I5N, Altera 5M240ZT100I4N, Altera 5M240ZT100A5N, Altera 5M240ZT100A4N", +U2 ,1,W9812G6KH-6,stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm,,C62379,"Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G",Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable. +U3 U4 U5 ,3,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable. +U6 U7 ,2,74AHCT245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C173388,"NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW",Most 74AHCT245 in TSSOP-20 package is acceptable. +U8 ,1,XC6206P332MR,stdpads:SOT-23,,C5446,Torex XC6206P332MR,Most 3.3V regulator in SOT-23 package is acceptable. +U9 ,1,AP2127K-1.8TRG1,stdpads:SOT-23-5,,C151375,"Diodes AP2127K-1.8TRG1, Torex XC6228D182VR",Most 1.8V regulator in SOT-23-5 package is acceptable. \ No newline at end of file