RAM2E/Hardware/LCMXO2/gerber/RAM2E-job.gbrjob
Zane Kaminski 38c155d6b0 2.1?
2023-11-03 04:35:53 -04:00

165 lines
3.4 KiB
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{
"Header": {
"GenerationSoftware": {
"Vendor": "KiCad",
"Application": "Pcbnew",
"Version": "7.0.1-0"
},
"CreationDate": "2023-10-30T17:31:41-04:00"
},
"GeneralSpecs": {
"ProjectId": {
"Name": "RAM2E",
"GUID": "52414d32-452e-46b6-9963-61645f706362",
"Revision": "2.1"
},
"Size": {
"X": 78.382,
"Y": 50.188
},
"LayerNumber": 4,
"BoardThickness": 1.6108,
"Finish": "None"
},
"DesignRules": [
{
"Layers": "Outer",
"PadToPad": 0.15,
"PadToTrack": 0.15,
"TrackToTrack": 0.15,
"MinLineWidth": 0.15,
"TrackToRegion": 0.1524,
"RegionToRegion": 0.1524
},
{
"Layers": "Inner",
"PadToPad": 0.15,
"PadToTrack": 0.15,
"TrackToTrack": 0.15,
"TrackToRegion": 0.154,
"RegionToRegion": 0.154
}
],
"FilesAttributes": [
{
"Path": "RAM2E-F_Cu.gtl",
"FileFunction": "Copper,L1,Top",
"FilePolarity": "Positive"
},
{
"Path": "RAM2E-In1_Cu.g2",
"FileFunction": "Copper,L2,Inr",
"FilePolarity": "Positive"
},
{
"Path": "RAM2E-In2_Cu.g3",
"FileFunction": "Copper,L3,Inr",
"FilePolarity": "Positive"
},
{
"Path": "RAM2E-B_Cu.gbl",
"FileFunction": "Copper,L4,Bot",
"FilePolarity": "Positive"
},
{
"Path": "RAM2E-F_Paste.gtp",
"FileFunction": "SolderPaste,Top",
"FilePolarity": "Positive"
},
{
"Path": "RAM2E-F_Silkscreen.gto",
"FileFunction": "Legend,Top",
"FilePolarity": "Positive"
},
{
"Path": "RAM2E-B_Silkscreen.gbo",
"FileFunction": "Legend,Bot",
"FilePolarity": "Positive"
},
{
"Path": "RAM2E-F_Mask.gts",
"FileFunction": "SolderMask,Top",
"FilePolarity": "Negative"
},
{
"Path": "RAM2E-B_Mask.gbs",
"FileFunction": "SolderMask,Bot",
"FilePolarity": "Negative"
},
{
"Path": "RAM2E-Edge_Cuts.gm1",
"FileFunction": "Profile",
"FilePolarity": "Positive"
}
],
"MaterialStackup": [
{
"Type": "Legend",
"Name": "Top Silk Screen"
},
{
"Type": "SolderPaste",
"Name": "Top Solder Paste"
},
{
"Type": "SolderMask",
"Thickness": 0.01,
"Name": "Top Solder Mask"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "F.Cu"
},
{
"Type": "Dielectric",
"Thickness": 0.2104,
"Material": "FR4",
"Name": "F.Cu/In1.Cu",
"Notes": "Type: dielectric layer 1 (from F.Cu to In1.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.0175,
"Name": "In1.Cu"
},
{
"Type": "Dielectric",
"Thickness": 1.065,
"Material": "FR4",
"Name": "In1.Cu/In2.Cu",
"Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.0175,
"Name": "In2.Cu"
},
{
"Type": "Dielectric",
"Thickness": 0.2104,
"Material": "FR4",
"Name": "In2.Cu/B.Cu",
"Notes": "Type: dielectric layer 3 (from In2.Cu to B.Cu)"
},
{
"Type": "Copper",
"Thickness": 0.035,
"Name": "B.Cu"
},
{
"Type": "SolderMask",
"Thickness": 0.01,
"Name": "Bottom Solder Mask"
},
{
"Type": "SolderPaste",
"Name": "Bottom Solder Paste"
},
{
"Type": "Legend",
"Name": "Bottom Silk Screen"
}
]
}