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RAM128/Voyager128.kicad_pcb
Zane Kaminski 3995f86d30 Board done but ugly
2020-09-10 12:08:51 -04:00

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(kicad_pcb (version 20171130) (host pcbnew "(5.1.5-0-10_14)")
(general
(thickness 1.6)
(drawings 25)
(tracks 1160)
(zones 0)
(modules 32)
(nets 99)
)
(page A4)
(layers
(0 F.Cu signal)
(1 In1.Cu signal)
(2 In2.Cu signal)
(31 B.Cu signal)
(32 B.Adhes user)
(33 F.Adhes user)
(34 B.Paste user)
(35 F.Paste user)
(36 B.SilkS user hide)
(37 F.SilkS user)
(38 B.Mask user)
(39 F.Mask user)
(40 Dwgs.User user)
(41 Cmts.User user)
(42 Eco1.User user)
(43 Eco2.User user)
(44 Edge.Cuts user)
(45 Margin user)
(46 B.CrtYd user)
(47 F.CrtYd user)
(48 B.Fab user)
(49 F.Fab user)
)
(setup
(last_trace_width 0.15)
(user_trace_width 0.15)
(user_trace_width 0.2)
(user_trace_width 0.25)
(user_trace_width 0.3)
(user_trace_width 0.35)
(user_trace_width 0.4)
(user_trace_width 0.45)
(user_trace_width 0.5)
(user_trace_width 0.6)
(user_trace_width 0.8)
(user_trace_width 1)
(user_trace_width 1.27)
(user_trace_width 1.524)
(trace_clearance 0.15)
(zone_clearance 0.15)
(zone_45_only no)
(trace_min 0.15)
(via_size 0.5)
(via_drill 0.2)
(via_min_size 0.5)
(via_min_drill 0.2)
(user_via 0.6 0.3)
(user_via 0.8 0.4)
(user_via 1 0.5)
(user_via 1.524 0.762)
(uvia_size 0.3)
(uvia_drill 0.1)
(uvias_allowed no)
(uvia_min_size 0.2)
(uvia_min_drill 0.1)
(edge_width 0.15)
(segment_width 0.1524)
(pcb_text_width 0.3)
(pcb_text_size 1.5 1.5)
(mod_edge_width 0.15)
(mod_text_size 1 1)
(mod_text_width 0.15)
(pad_size 1.05 1.4)
(pad_drill 0)
(pad_to_mask_clearance 0.0762)
(solder_mask_min_width 0.127)
(pad_to_paste_clearance -0.0381)
(aux_axis_origin 0 0)
(visible_elements FFFFEF7F)
(pcbplotparams
(layerselection 0x010f8_ffffffff)
(usegerberextensions true)
(usegerberattributes false)
(usegerberadvancedattributes false)
(creategerberjobfile false)
(excludeedgelayer true)
(linewidth 0.100000)
(plotframeref false)
(viasonmask false)
(mode 1)
(useauxorigin false)
(hpglpennumber 1)
(hpglpenspeed 20)
(hpglpendiameter 15.000000)
(psnegative false)
(psa4output false)
(plotreference true)
(plotvalue true)
(plotinvisibletext false)
(padsonsilk false)
(subtractmaskfromsilk true)
(outputformat 1)
(mirror false)
(drillshape 0)
(scaleselection 1)
(outputdirectory "gerber/"))
)
(net 0 "")
(net 1 +5V)
(net 2 GND)
(net 3 /A4)
(net 4 /D7)
(net 5 /D6)
(net 6 /A8)
(net 7 /A7)
(net 8 /A6)
(net 9 /A5)
(net 10 /A3)
(net 11 /A2)
(net 12 /A1)
(net 13 /A0)
(net 14 /A9)
(net 15 /D1)
(net 16 /D5)
(net 17 /D0)
(net 18 /D2)
(net 19 /D3)
(net 20 /D4)
(net 21 /A10)
(net 22 +12V)
(net 23 -12V)
(net 24 -5V)
(net 25 /~IOSEL~)
(net 26 /A11)
(net 27 /A12)
(net 28 /A13)
(net 29 /A14)
(net 30 /A15)
(net 31 /~IOSTRB~)
(net 32 /RDY)
(net 33 /DMA)
(net 34 /~NMI~)
(net 35 /~IRQ~)
(net 36 /~RES~)
(net 37 /~INH~)
(net 38 /COLORREF)
(net 39 /7M)
(net 40 /Q3)
(net 41 /PHI1)
(net 42 /USER1)
(net 43 /PHI0)
(net 44 /~DEVSEL~)
(net 45 /INTin)
(net 46 /DMAin)
(net 47 /VIDSYNC)
(net 48 /R~WE~)
(net 49 /R~CS~)
(net 50 /RA15)
(net 51 /RA16)
(net 52 /RA14)
(net 53 /RA12)
(net 54 /RD7)
(net 55 /RD6)
(net 56 /RD5)
(net 57 /RD4)
(net 58 /RD3)
(net 59 /RD2)
(net 60 /RD1)
(net 61 /RD0)
(net 62 /BankAB)
(net 63 /ENWR1)
(net 64 /ENRD)
(net 65 /ENWR)
(net 66 "Net-(U4-Pad10)")
(net 67 "Net-(U1-Pad9)")
(net 68 "Net-(U4-Pad14)")
(net 69 /~DEV~andA2)
(net 70 /ENWR1A0)
(net 71 "Net-(U3-Pad13)")
(net 72 "Net-(U3-Pad12)")
(net 73 /~DEV~and~A2~)
(net 74 "Net-(U3-Pad10)")
(net 75 /~A0XOR1~)
(net 76 "Net-(U4-Pad20)")
(net 77 "Net-(U5-Pad2)")
(net 78 "Net-(U5-Pad4)")
(net 79 "Net-(U5-Pad6)")
(net 80 "Net-(U5-Pad8)")
(net 81 /RCS)
(net 82 "Net-(U5-Pad12)")
(net 83 "Net-(U10-Pad1)")
(net 84 "Net-(U10-Pad2)")
(net 85 "Net-(U10-Pad4)")
(net 86 "Net-(U10-Pad5)")
(net 87 "Net-(U10-Pad10)")
(net 88 "Net-(U8-Pad11)")
(net 89 "Net-(U10-Pad9)")
(net 90 "Net-(U9-Pad10)")
(net 91 "Net-(U10-Pad8)")
(net 92 /INHOE)
(net 93 "Net-(U10-Pad11)")
(net 94 "Net-(U3-Pad14)")
(net 95 "Net-(U3-Pad11)")
(net 96 "Net-(U4-Pad11)")
(net 97 "Net-(U3-Pad15)")
(net 98 "Net-(U4-Pad15)")
(net_class Default "This is the default net class."
(clearance 0.15)
(trace_width 0.15)
(via_dia 0.5)
(via_drill 0.2)
(uvia_dia 0.3)
(uvia_drill 0.1)
(add_net +12V)
(add_net +5V)
(add_net -12V)
(add_net -5V)
(add_net /7M)
(add_net /A0)
(add_net /A1)
(add_net /A10)
(add_net /A11)
(add_net /A12)
(add_net /A13)
(add_net /A14)
(add_net /A15)
(add_net /A2)
(add_net /A3)
(add_net /A4)
(add_net /A5)
(add_net /A6)
(add_net /A7)
(add_net /A8)
(add_net /A9)
(add_net /BankAB)
(add_net /COLORREF)
(add_net /D0)
(add_net /D1)
(add_net /D2)
(add_net /D3)
(add_net /D4)
(add_net /D5)
(add_net /D6)
(add_net /D7)
(add_net /DMA)
(add_net /DMAin)
(add_net /ENRD)
(add_net /ENWR)
(add_net /ENWR1)
(add_net /ENWR1A0)
(add_net /INHOE)
(add_net /INTin)
(add_net /PHI0)
(add_net /PHI1)
(add_net /Q3)
(add_net /RA12)
(add_net /RA14)
(add_net /RA15)
(add_net /RA16)
(add_net /RCS)
(add_net /RD0)
(add_net /RD1)
(add_net /RD2)
(add_net /RD3)
(add_net /RD4)
(add_net /RD5)
(add_net /RD6)
(add_net /RD7)
(add_net /RDY)
(add_net /R~CS~)
(add_net /R~WE~)
(add_net /USER1)
(add_net /VIDSYNC)
(add_net /~A0XOR1~)
(add_net /~DEVSEL~)
(add_net /~DEV~andA2)
(add_net /~DEV~and~A2~)
(add_net /~INH~)
(add_net /~IOSEL~)
(add_net /~IOSTRB~)
(add_net /~IRQ~)
(add_net /~NMI~)
(add_net /~RES~)
(add_net GND)
(add_net "Net-(U1-Pad9)")
(add_net "Net-(U10-Pad1)")
(add_net "Net-(U10-Pad10)")
(add_net "Net-(U10-Pad11)")
(add_net "Net-(U10-Pad2)")
(add_net "Net-(U10-Pad4)")
(add_net "Net-(U10-Pad5)")
(add_net "Net-(U10-Pad8)")
(add_net "Net-(U10-Pad9)")
(add_net "Net-(U3-Pad10)")
(add_net "Net-(U3-Pad11)")
(add_net "Net-(U3-Pad12)")
(add_net "Net-(U3-Pad13)")
(add_net "Net-(U3-Pad14)")
(add_net "Net-(U3-Pad15)")
(add_net "Net-(U4-Pad10)")
(add_net "Net-(U4-Pad11)")
(add_net "Net-(U4-Pad14)")
(add_net "Net-(U4-Pad15)")
(add_net "Net-(U4-Pad20)")
(add_net "Net-(U5-Pad12)")
(add_net "Net-(U5-Pad2)")
(add_net "Net-(U5-Pad4)")
(add_net "Net-(U5-Pad6)")
(add_net "Net-(U5-Pad8)")
(add_net "Net-(U8-Pad11)")
(add_net "Net-(U9-Pad10)")
)
(module stdpads:TSSOP-14_4.4x5mm_P0.65mm (layer F.Cu) (tedit 5F37C96A) (tstamp 5F8B1E88)
(at 97.15 122.6 180)
(descr "14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.65")
(path /61D062D6)
(solder_mask_margin 0.024)
(solder_paste_margin -0.04)
(attr smd)
(fp_text reference U6 (at 0 0 180) (layer F.Fab)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(fp_text value 74LS08 (at 0 1 180) (layer F.Fab)
(effects (font (size 0.381 0.381) (thickness 0.09525)))
)
(fp_line (start -2.5 1.2) (end -2.5 -2.2) (layer F.Fab) (width 0.15))
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(fp_line (start 2.5 -2.2) (end 2.5 2.2) (layer F.Fab) (width 0.15))
(fp_line (start 2.5 2.2) (end -1.5 2.2) (layer F.Fab) (width 0.15))
(fp_line (start -1.5 2.2) (end -2.5 1.2) (layer F.Fab) (width 0.15))
(fp_line (start -2.8 3.95) (end 2.8 3.95) (layer F.CrtYd) (width 0.05))
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(fp_line (start -2.8 3.95) (end -2.8 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.8 3.95) (end 2.8 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.625 2.325) (end -2.5 2.325) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 -2.325) (end -2.4 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 -2.325) (end 2.4 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 2.325) (end 2.4 2.325) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 2.325) (end -2.625 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 2.325) (end 2.625 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start -2.5 2.325) (end -2.5 3.675) (layer F.SilkS) (width 0.15))
(fp_text user %R (at 0 0 180) (layer F.SilkS)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(pad 1 smd roundrect (at -1.95 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 77 "Net-(U5-Pad2)"))
(pad 2 smd roundrect (at -1.3 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 12 /A1))
(pad 3 smd roundrect (at -0.65 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 83 "Net-(U10-Pad1)"))
(pad 4 smd roundrect (at 0 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 13 /A0))
(pad 5 smd roundrect (at 0.65 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 78 "Net-(U5-Pad4)"))
(pad 6 smd roundrect (at 1.3 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 84 "Net-(U10-Pad2)"))
(pad 7 smd roundrect (at 1.95 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(pad 8 smd roundrect (at 1.95 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 69 /~DEV~andA2))
(pad 9 smd roundrect (at 1.3 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 11 /A2))
(pad 10 smd roundrect (at 0.65 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 44 /~DEVSEL~))
(pad 11 smd roundrect (at 0 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 73 /~DEV~and~A2~))
(pad 12 smd roundrect (at -0.65 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 79 "Net-(U5-Pad6)"))
(pad 13 smd roundrect (at -1.3 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 44 /~DEVSEL~))
(pad 14 smd roundrect (at -1.95 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-14_4.4x5mm_P0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 -90))
)
)
(module stdpads:TSSOP-16_4.4x5mm_P0.65mm (layer F.Cu) (tedit 5F59A51D) (tstamp 5F5D6BBF)
(at 119.95 112.475 270)
(descr "16-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.65")
(path /62125B94)
(solder_mask_margin 0.024)
(solder_paste_margin -0.04)
(attr smd)
(fp_text reference U4 (at 0 0 270) (layer F.Fab)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(fp_text value 74LS174 (at 0 1 270) (layer F.Fab)
(effects (font (size 0.381 0.381) (thickness 0.09525)))
)
(fp_text user %R (at 0 0 270) (layer F.SilkS)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(fp_line (start -2.8 3.775) (end -2.8 -2.2) (layer F.SilkS) (width 0.15))
(fp_line (start 2.725 2.2) (end 2.725 -2.2) (layer F.SilkS) (width 0.15))
(fp_line (start 2.8 3.95) (end 2.8 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.9 3.95) (end -2.9 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.9 -3.95) (end 2.8 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.9 3.95) (end 2.8 3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.5 2.2) (end -2.5 1.2) (layer F.Fab) (width 0.15))
(fp_line (start 2.5 2.2) (end -1.5 2.2) (layer F.Fab) (width 0.15))
(fp_line (start 2.5 -2.2) (end 2.5 2.2) (layer F.Fab) (width 0.15))
(fp_line (start -2.5 -2.2) (end 2.5 -2.2) (layer F.Fab) (width 0.15))
(fp_line (start -2.5 1.2) (end -2.5 -2.2) (layer F.Fab) (width 0.15))
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(net 1 +5V))
(pad 15 smd roundrect (at -1.625 -2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 98 "Net-(U4-Pad15)"))
(pad 14 smd roundrect (at -0.975 -2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 68 "Net-(U4-Pad14)"))
(pad 13 smd roundrect (at -0.325 -2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 70 /ENWR1A0))
(pad 12 smd roundrect (at 0.325 -2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 65 /ENWR))
(pad 11 smd roundrect (at 0.975 -2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 96 "Net-(U4-Pad11)"))
(pad 10 smd roundrect (at 1.625 -2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 66 "Net-(U4-Pad10)"))
(pad 9 smd roundrect (at 2.275 -2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 73 /~DEV~and~A2~))
(pad 8 smd roundrect (at 2.275 2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(pad 7 smd roundrect (at 1.625 2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 63 /ENWR1))
(pad 6 smd roundrect (at 0.975 2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 13 /A0))
(pad 5 smd roundrect (at 0.325 2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 62 /BankAB))
(pad 4 smd roundrect (at -0.325 2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 10 /A3))
(pad 3 smd roundrect (at -0.975 2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 75 /~A0XOR1~))
(pad 2 smd roundrect (at -1.625 2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 64 /ENRD))
(pad 1 smd roundrect (at -2.275 2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 36 /~RES~))
(model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-16_4.4x5mm_P0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 -90))
)
)
(module stdpads:TSSOP-16_4.4x5mm_P0.65mm (layer F.Cu) (tedit 5F59A51D) (tstamp 5F5D5AD4)
(at 111.35 112.475 270)
(descr "16-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.65")
(path /621250C8)
(solder_mask_margin 0.024)
(solder_paste_margin -0.04)
(attr smd)
(fp_text reference U3 (at 0 0 270) (layer F.Fab)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(fp_text value 74LS174 (at 0 1 270) (layer F.Fab)
(effects (font (size 0.381 0.381) (thickness 0.09525)))
)
(fp_text user %R (at 0 0 270) (layer F.SilkS)
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)
(fp_line (start -2.8 3.775) (end -2.8 -2.2) (layer F.SilkS) (width 0.15))
(fp_line (start 2.725 2.2) (end 2.725 -2.2) (layer F.SilkS) (width 0.15))
(fp_line (start 2.8 3.95) (end 2.8 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.9 3.95) (end -2.9 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.9 -3.95) (end 2.8 -3.95) (layer F.CrtYd) (width 0.05))
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(pad 16 smd roundrect (at -2.275 -2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(pad 15 smd roundrect (at -1.625 -2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 97 "Net-(U3-Pad15)"))
(pad 14 smd roundrect (at -0.975 -2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 94 "Net-(U3-Pad14)"))
(pad 13 smd roundrect (at -0.325 -2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 71 "Net-(U3-Pad13)"))
(pad 12 smd roundrect (at 0.325 -2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 72 "Net-(U3-Pad12)"))
(pad 11 smd roundrect (at 0.975 -2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 95 "Net-(U3-Pad11)"))
(pad 10 smd roundrect (at 1.625 -2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 74 "Net-(U3-Pad10)"))
(pad 9 smd roundrect (at 2.275 -2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 69 /~DEV~andA2))
(pad 8 smd roundrect (at 2.275 2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(pad 7 smd roundrect (at 1.625 2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 51 /RA16))
(pad 6 smd roundrect (at 0.975 2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 10 /A3))
(pad 5 smd roundrect (at 0.325 2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 50 /RA15))
(pad 4 smd roundrect (at -0.325 2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 12 /A1))
(pad 3 smd roundrect (at -0.975 2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 13 /A0))
(pad 2 smd roundrect (at -1.625 2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 52 /RA14))
(pad 1 smd roundrect (at -2.275 2.95) (size 1.5 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 36 /~RES~))
(model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-16_4.4x5mm_P0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 -90))
)
)
(module stdpads:C_0603 (layer F.Cu) (tedit 5EE29C36) (tstamp 5F5CC4AD)
(at 107.95 124.8 90)
(tags capacitor)
(path /61D3AE9C)
(solder_mask_margin 0.05)
(solder_paste_margin -0.04)
(attr smd)
(fp_text reference C8 (at 0 0 90) (layer F.Fab)
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(fp_text value 2u2 (at 0 0.25 90) (layer F.Fab)
(effects (font (size 0.127 0.127) (thickness 0.03175)))
)
(fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1))
(fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start 0.8 0.4) (end -0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.162779 -0.51) (end 0.162779 -0.51) (layer F.SilkS) (width 0.12))
(fp_line (start -0.162779 0.51) (end 0.162779 0.51) (layer F.SilkS) (width 0.12))
(fp_line (start -1.4 0.7) (end -1.4 -0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.4 -0.7) (end 1.4 -0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.4 -0.7) (end 1.4 0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.4 0.7) (end -1.4 0.7) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at 0 0 90) (layer F.SilkS) hide
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(pad 1 smd roundrect (at -0.75 0 90) (size 0.85 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(pad 2 smd roundrect (at 0.75 0 90) (size 0.85 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module stdpads:TSOP-I-32_18.4x8mm_P0.5mm (layer F.Cu) (tedit 5F599AB1) (tstamp 5F5CD0D0)
(at 92.1 112.15 180)
(descr "TSOP I, 32 pins, 18.4x8mm body (https://www.micron.com/~/media/documents/products/technical-note/nor-flash/tn1225_land_pad_design.pdf, http://www.fujitsu.com/downloads/MICRO/fma/pdfmcu/f32pm25.pdf)")
(tags "TSOP I 32")
(path /61C2B655)
(solder_mask_margin 0.024)
(solder_paste_margin -0.035)
(attr smd)
(fp_text reference U1 (at 0 0) (layer F.Fab)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(fp_text value 621024 (at 0 1.25) (layer F.Fab)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(fp_line (start -8.2 -4) (end 9.2 -4) (layer F.Fab) (width 0.1))
(fp_line (start -9.2 4) (end -9.2 -3) (layer F.Fab) (width 0.1))
(fp_line (start 9.2 4) (end -9.2 4) (layer F.Fab) (width 0.1))
(fp_line (start 9.2 -4) (end 9.2 4) (layer F.Fab) (width 0.1))
(fp_text user %R (at 0 0) (layer F.SilkS)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(fp_line (start -8.2 -4) (end -9.2 -3) (layer F.Fab) (width 0.1))
(fp_line (start 9.2 -4.12) (end -10.2 -4.12) (layer F.SilkS) (width 0.1))
(fp_line (start -9.2 4.12) (end 9.2 4.12) (layer F.SilkS) (width 0.12))
(fp_line (start -10.55 -4.25) (end 10.55 -4.25) (layer F.CrtYd) (width 0.05))
(fp_line (start 10.55 -4.25) (end 10.55 4.25) (layer F.CrtYd) (width 0.05))
(fp_line (start 10.55 4.25) (end -10.55 4.25) (layer F.CrtYd) (width 0.05))
(fp_line (start -10.55 4.25) (end -10.55 -4.25) (layer F.CrtYd) (width 0.05))
(pad 32 smd roundrect (at 9.75 -3.75 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(pad 31 smd roundrect (at 9.75 -3.25 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 28 /A13))
(pad 30 smd roundrect (at 9.75 -2.75 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 49 /R~CS~))
(pad 29 smd roundrect (at 9.75 -2.25 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 58 /RD3))
(pad 28 smd roundrect (at 9.75 -1.75 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 59 /RD2))
(pad 27 smd roundrect (at 9.75 -1.25 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 60 /RD1))
(pad 26 smd roundrect (at 9.75 -0.75 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 61 /RD0))
(pad 25 smd roundrect (at 9.75 -0.25 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 54 /RD7))
(pad 24 smd roundrect (at 9.75 0.25 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(pad 23 smd roundrect (at 9.75 0.75 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 55 /RD6))
(pad 22 smd roundrect (at 9.75 1.25 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 56 /RD5))
(pad 21 smd roundrect (at 9.75 1.75 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 57 /RD4))
(pad 20 smd roundrect (at 9.75 2.25 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 26 /A11))
(pad 19 smd roundrect (at 9.75 2.75 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 21 /A10))
(pad 18 smd roundrect (at 9.75 3.25 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 14 /A9))
(pad 16 smd roundrect (at -9.75 3.75 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 3 /A4))
(pad 15 smd roundrect (at -9.75 3.25 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 9 /A5))
(pad 14 smd roundrect (at -9.75 2.75 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 53 /RA12))
(pad 13 smd roundrect (at -9.75 2.25 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 8 /A6))
(pad 12 smd roundrect (at -9.75 1.75 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 52 /RA14))
(pad 11 smd roundrect (at -9.75 1.25 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 50 /RA15))
(pad 10 smd roundrect (at -9.75 0.75 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 51 /RA16))
(pad 9 smd roundrect (at -9.75 0.25 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 67 "Net-(U1-Pad9)"))
(pad 8 smd roundrect (at -9.75 -0.25 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(pad 7 smd roundrect (at -9.75 -0.75 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 7 /A7))
(pad 6 smd roundrect (at -9.75 -1.25 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(pad 5 smd roundrect (at -9.75 -1.75 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 48 /R~WE~))
(pad 4 smd roundrect (at -9.75 -2.25 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 10 /A3))
(pad 3 smd roundrect (at -9.75 -2.75 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 11 /A2))
(pad 2 smd roundrect (at -9.75 -3.25 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 12 /A1))
(pad 17 smd roundrect (at 9.75 3.75 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 6 /A8))
(pad 1 smd roundrect (at -9.75 -3.75 180) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 13 /A0))
(model ${KISYS3DMOD}/Package_SO.3dshapes/TSOP-I-32_18.4x8mm_P0.5mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module stdpads:C_0603 (layer F.Cu) (tedit 5EE29C36) (tstamp 5F8B1CE1)
(at 86.05 124.8 90)
(tags capacitor)
(path /5D14D1AA)
(solder_mask_margin 0.05)
(solder_paste_margin -0.04)
(attr smd)
(fp_text reference C3 (at 0 0 90) (layer F.Fab)
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(fp_text value 2u2 (at 0 0.25 90) (layer F.Fab)
(effects (font (size 0.127 0.127) (thickness 0.03175)))
)
(fp_text user %R (at 0 0 90) (layer F.SilkS) hide
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(fp_line (start 1.4 0.7) (end -1.4 0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.4 -0.7) (end 1.4 0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.4 -0.7) (end 1.4 -0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.4 0.7) (end -1.4 -0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.162779 0.51) (end 0.162779 0.51) (layer F.SilkS) (width 0.12))
(fp_line (start -0.162779 -0.51) (end 0.162779 -0.51) (layer F.SilkS) (width 0.12))
(fp_line (start 0.8 0.4) (end -0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1))
(pad 2 smd roundrect (at 0.75 0 90) (size 0.85 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(pad 1 smd roundrect (at -0.75 0 90) (size 0.85 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module stdpads:C_0603 (layer F.Cu) (tedit 5EE29C36) (tstamp 5F8B1BF1)
(at 126.3 124.8 90)
(tags capacitor)
(path /61D3AEA8)
(solder_mask_margin 0.05)
(solder_paste_margin -0.04)
(attr smd)
(fp_text reference C10 (at 0 0 90) (layer F.Fab)
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(fp_text value 2u2 (at 0 0.25 90) (layer F.Fab)
(effects (font (size 0.127 0.127) (thickness 0.03175)))
)
(fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1))
(fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start 0.8 0.4) (end -0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.162779 -0.51) (end 0.162779 -0.51) (layer F.SilkS) (width 0.12))
(fp_line (start -0.162779 0.51) (end 0.162779 0.51) (layer F.SilkS) (width 0.12))
(fp_line (start -1.4 0.7) (end -1.4 -0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.4 -0.7) (end 1.4 -0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.4 -0.7) (end 1.4 0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.4 0.7) (end -1.4 0.7) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at 0 0 90) (layer F.SilkS) hide
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(pad 1 smd roundrect (at -0.75 0 90) (size 0.85 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(pad 2 smd roundrect (at 0.75 0 90) (size 0.85 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module stdpads:C_0603 (layer F.Cu) (tedit 5EE29C36) (tstamp 5F8B1C21)
(at 115.25 124.8 90)
(tags capacitor)
(path /61D3AEA2)
(solder_mask_margin 0.05)
(solder_paste_margin -0.04)
(attr smd)
(fp_text reference C9 (at 0 0 90) (layer F.Fab)
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(fp_text value 2u2 (at 0 0.25 90) (layer F.Fab)
(effects (font (size 0.127 0.127) (thickness 0.03175)))
)
(fp_text user %R (at 0 0 90) (layer F.SilkS) hide
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(fp_line (start 1.4 0.7) (end -1.4 0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.4 -0.7) (end 1.4 0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.4 -0.7) (end 1.4 -0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.4 0.7) (end -1.4 -0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.162779 0.51) (end 0.162779 0.51) (layer F.SilkS) (width 0.12))
(fp_line (start -0.162779 -0.51) (end 0.162779 -0.51) (layer F.SilkS) (width 0.12))
(fp_line (start 0.8 0.4) (end -0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1))
(pad 2 smd roundrect (at 0.75 0 90) (size 0.85 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(pad 1 smd roundrect (at -0.75 0 90) (size 0.85 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module stdpads:R_0805 (layer F.Cu) (tedit 5CC267AA) (tstamp 5F5D2D24)
(at 118.3 125.55 180)
(tags resistor)
(path /5E6C502A)
(attr smd)
(fp_text reference R1 (at 0 -1.5) (layer F.SilkS) hide
(effects (font (size 0.8128 0.8128) (thickness 0.1524)))
)
(fp_text value 3k3 (at 0 0.889) (layer F.Fab) hide
(effects (font (size 0.127 0.127) (thickness 0.03175)))
)
(fp_line (start -1 0.625) (end -1 -0.625) (layer F.Fab) (width 0.1))
(fp_line (start -1 -0.625) (end 1 -0.625) (layer F.Fab) (width 0.1))
(fp_line (start 1 -0.625) (end 1 0.625) (layer F.Fab) (width 0.1))
(fp_line (start 1 0.625) (end -1 0.625) (layer F.Fab) (width 0.1))
(fp_line (start -0.4064 -0.8) (end 0.4064 -0.8) (layer F.SilkS) (width 0.1524))
(fp_line (start -0.4064 0.8) (end 0.4064 0.8) (layer F.SilkS) (width 0.1524))
(fp_line (start -1.7 1) (end -1.7 -1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.7 -1) (end 1.7 -1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.7 -1) (end 1.7 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.7 1) (end -1.7 1) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at 0 0 90) (layer F.Fab)
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(pad 1 smd roundrect (at -0.95 0 180) (size 0.85 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(pad 2 smd roundrect (at 0.95 0 180) (size 0.85 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 37 /~INH~))
(model ${KISYS3DMOD}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module stdpads:C_0603 (layer F.Cu) (tedit 5EE29C36) (tstamp 5F8B1C51)
(at 93.35 124.8 90)
(tags capacitor)
(path /5E988E8B)
(solder_mask_margin 0.05)
(solder_paste_margin -0.04)
(attr smd)
(fp_text reference C6 (at 0 0 90) (layer F.Fab)
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(fp_text value 2u2 (at 0 0.25 90) (layer F.Fab)
(effects (font (size 0.127 0.127) (thickness 0.03175)))
)
(fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1))
(fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start 0.8 0.4) (end -0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.162779 -0.51) (end 0.162779 -0.51) (layer F.SilkS) (width 0.12))
(fp_line (start -0.162779 0.51) (end 0.162779 0.51) (layer F.SilkS) (width 0.12))
(fp_line (start -1.4 0.7) (end -1.4 -0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.4 -0.7) (end 1.4 -0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.4 -0.7) (end 1.4 0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.4 0.7) (end -1.4 0.7) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at 0 0 90) (layer F.SilkS) hide
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(pad 1 smd roundrect (at -0.75 0 90) (size 0.85 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(pad 2 smd roundrect (at 0.75 0 90) (size 0.85 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module stdpads:AppleIIBus_Edge (layer F.Cu) (tedit 5CFDB600) (tstamp 5D312B09)
(at 106.68 135.382)
(path /5CFC517D)
(attr virtual)
(fp_text reference J1 (at 25.4 -5.08) (layer F.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value AppleIIBus (at 0 5.207) (layer F.Fab)
(effects (font (size 0.8128 0.8128) (thickness 0.1524)))
)
(fp_line (start -32.512 4.318) (end -32.512 -3.81) (layer B.Fab) (width 0.127))
(fp_line (start 32.512 4.318) (end -32.512 4.318) (layer B.Fab) (width 0.127))
(fp_line (start 32.512 -3.81) (end 32.512 4.318) (layer F.Fab) (width 0.127))
(fp_line (start 32.512 4.318) (end -32.512 4.318) (layer F.Fab) (width 0.127))
(fp_line (start -32.512 4.318) (end -32.512 -3.81) (layer F.Fab) (width 0.127))
(fp_line (start 32.512 -3.81) (end 32.512 4.318) (layer B.Fab) (width 0.127))
(fp_text user J1 (at 25.4 -5.08) (layer B.SilkS) hide
(effects (font (size 1 1) (thickness 0.15)) (justify mirror))
)
(pad 26 smd roundrect (at 30.48 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(pad 27 smd roundrect (at 27.94 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 46 /DMAin))
(pad 28 smd roundrect (at 25.4 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 45 /INTin))
(pad 50 smd roundrect (at -30.48 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 22 +12V))
(pad 49 smd roundrect (at -27.94 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 17 /D0))
(pad 48 smd roundrect (at -25.4 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 15 /D1))
(pad 47 smd roundrect (at -22.86 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 18 /D2))
(pad 46 smd roundrect (at -20.32 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 19 /D3))
(pad 45 smd roundrect (at -17.78 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 20 /D4))
(pad 44 smd roundrect (at -15.24 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 16 /D5))
(pad 43 smd roundrect (at -12.7 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 5 /D6))
(pad 42 smd roundrect (at -10.16 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 4 /D7))
(pad 41 smd roundrect (at -7.62 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 44 /~DEVSEL~))
(pad 40 smd roundrect (at -5.08 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 43 /PHI0))
(pad 39 smd roundrect (at -2.54 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 42 /USER1))
(pad 38 smd roundrect (at 0 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 41 /PHI1))
(pad 37 smd roundrect (at 2.54 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 40 /Q3))
(pad 36 smd roundrect (at 5.08 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 39 /7M))
(pad 35 smd roundrect (at 7.62 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 38 /COLORREF))
(pad 34 smd roundrect (at 10.16 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 24 -5V))
(pad 33 smd roundrect (at 12.7 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 23 -12V))
(pad 32 smd roundrect (at 15.24 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 37 /~INH~))
(pad 31 smd roundrect (at 17.78 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 36 /~RES~))
(pad 30 smd roundrect (at 20.32 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 35 /~IRQ~))
(pad 29 smd roundrect (at 22.86 -0.1 180) (size 1.524 7.34) (layers B.Cu B.Mask) (roundrect_rratio 0.25)
(net 34 /~NMI~))
(pad 25 smd roundrect (at 30.48 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(pad 24 smd roundrect (at 27.94 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 46 /DMAin))
(pad 23 smd roundrect (at 25.4 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 45 /INTin))
(pad 22 smd roundrect (at 22.86 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 33 /DMA))
(pad 21 smd roundrect (at 20.32 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 32 /RDY))
(pad 20 smd roundrect (at 17.78 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 31 /~IOSTRB~))
(pad 19 smd roundrect (at 15.24 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 47 /VIDSYNC))
(pad 18 smd roundrect (at 12.7 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 48 /R~WE~))
(pad 17 smd roundrect (at 10.16 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 30 /A15))
(pad 16 smd roundrect (at 7.62 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 29 /A14))
(pad 15 smd roundrect (at 5.08 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 28 /A13))
(pad 14 smd roundrect (at 2.54 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 27 /A12))
(pad 13 smd roundrect (at 0 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 26 /A11))
(pad 12 smd roundrect (at -2.54 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 21 /A10))
(pad 11 smd roundrect (at -5.08 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 14 /A9))
(pad 10 smd roundrect (at -7.62 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 6 /A8))
(pad 9 smd roundrect (at -10.16 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 7 /A7))
(pad 8 smd roundrect (at -12.7 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 8 /A6))
(pad 7 smd roundrect (at -15.24 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 9 /A5))
(pad 6 smd roundrect (at -17.78 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 3 /A4))
(pad 5 smd roundrect (at -20.32 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 10 /A3))
(pad 4 smd roundrect (at -22.86 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 11 /A2))
(pad 3 smd roundrect (at -25.4 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 12 /A1))
(pad 2 smd roundrect (at -27.94 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 13 /A0))
(pad 1 smd roundrect (at -30.48 -0.1 180) (size 1.524 7.34) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
(net 25 /~IOSEL~))
)
(module stdpads:Fiducial (layer F.Cu) (tedit 5CFD71CD) (tstamp 5DE2C990)
(at 70.358 115.189 90)
(descr "Circular Fiducial, 1mm bare copper top; 2mm keepout (Level A)")
(tags marker)
(path /5D321D2B)
(attr smd)
(fp_text reference FID2 (at 0 -1.6 90) (layer F.SilkS) hide
(effects (font (size 0.508 0.508) (thickness 0.127)))
)
(fp_text value Fiducial (at 0 2 90) (layer F.Fab) hide
(effects (font (size 0.508 0.508) (thickness 0.127)))
)
(fp_circle (center 0 0) (end 1.25 0) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at 0 0 90) (layer F.Fab)
(effects (font (size 0.4 0.4) (thickness 0.06)))
)
(fp_circle (center 0 0) (end 1 0) (layer F.Fab) (width 0.1))
(pad ~ smd circle (at 0 0 90) (size 1 1) (layers F.Cu F.Mask)
(solder_mask_margin 0.5) (clearance 0.575))
)
(module stdpads:Fiducial (layer F.Cu) (tedit 5CFD71CD) (tstamp 5DE2B53A)
(at 136.906 106.553 270)
(descr "Circular Fiducial, 1mm bare copper top; 2mm keepout (Level A)")
(tags marker)
(path /5D319AED)
(attr smd)
(fp_text reference FID1 (at 0 -1.6 90) (layer F.SilkS) hide
(effects (font (size 0.508 0.508) (thickness 0.127)))
)
(fp_text value Fiducial (at 0 2 90) (layer F.Fab) hide
(effects (font (size 0.508 0.508) (thickness 0.127)))
)
(fp_circle (center 0 0) (end 1 0) (layer F.Fab) (width 0.1))
(fp_text user %R (at 0 0 90) (layer F.Fab)
(effects (font (size 0.4 0.4) (thickness 0.06)))
)
(fp_circle (center 0 0) (end 1.25 0) (layer F.CrtYd) (width 0.05))
(pad ~ smd circle (at 0 0 270) (size 1 1) (layers F.Cu F.Mask)
(solder_mask_margin 0.5) (clearance 0.575))
)
(module stdpads:Fiducial (layer F.Cu) (tedit 5CFD71CD) (tstamp 5DE2C9B7)
(at 70.358 129.54)
(descr "Circular Fiducial, 1mm bare copper top; 2mm keepout (Level A)")
(tags marker)
(path /5D3223BF)
(attr smd)
(fp_text reference FID5 (at 0 -1.6) (layer F.SilkS) hide
(effects (font (size 0.508 0.508) (thickness 0.127)))
)
(fp_text value Fiducial (at 0 2) (layer F.Fab) hide
(effects (font (size 0.508 0.508) (thickness 0.127)))
)
(fp_circle (center 0 0) (end 1 0) (layer F.Fab) (width 0.1))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.4 0.4) (thickness 0.06)))
)
(fp_circle (center 0 0) (end 1.25 0) (layer F.CrtYd) (width 0.05))
(pad ~ smd circle (at 0 0) (size 1 1) (layers F.Cu F.Mask)
(solder_mask_margin 0.5) (clearance 0.575))
)
(module stdpads:Fiducial (layer F.Cu) (tedit 5CFD71CD) (tstamp 5F8AC618)
(at 136.906 124.841)
(descr "Circular Fiducial, 1mm bare copper top; 2mm keepout (Level A)")
(tags marker)
(path /5D322056)
(attr smd)
(fp_text reference FID4 (at 2.032 0) (layer F.SilkS) hide
(effects (font (size 0.508 0.508) (thickness 0.127)))
)
(fp_text value Fiducial (at 0 2) (layer F.Fab) hide
(effects (font (size 0.508 0.508) (thickness 0.127)))
)
(fp_circle (center 0 0) (end 1 0) (layer F.Fab) (width 0.1))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.4 0.4) (thickness 0.06)))
)
(fp_circle (center 0 0) (end 1.25 0) (layer F.CrtYd) (width 0.05))
(pad ~ smd circle (at 0 0) (size 1 1) (layers F.Cu F.Mask)
(solder_mask_margin 0.5) (clearance 0.575))
)
(module stdpads:PasteHole_1.1mm_PTH (layer F.Cu) (tedit 5D0D2B78) (tstamp 5DE2C9CC)
(at 70.358 117.729 90)
(descr "Circular Fiducial, 1mm bare copper top; 2mm keepout (Level A)")
(tags marker)
(path /607FA434)
(zone_connect 2)
(attr virtual)
(fp_text reference H2 (at 0 -1.6 90) (layer F.SilkS) hide
(effects (font (size 0.508 0.508) (thickness 0.127)))
)
(fp_text value " " (at 0 2 90) (layer F.Fab) hide
(effects (font (size 0.508 0.508) (thickness 0.127)))
)
(fp_circle (center 0 0) (end 1 0) (layer F.Fab) (width 0.1))
(fp_text user %R (at 0 0 90) (layer F.Fab)
(effects (font (size 0.4 0.4) (thickness 0.06)))
)
(fp_circle (center 0 0) (end 1.25 0) (layer F.CrtYd) (width 0.05))
(pad 1 thru_hole circle (at 0 0 90) (size 2 2) (drill 1.1) (layers *.Cu *.Mask)
(net 2 GND) (zone_connect 2))
)
(module stdpads:PasteHole_1.1mm_PTH (layer F.Cu) (tedit 5CC28323) (tstamp 5DE2B519)
(at 134.366 106.553 270)
(descr "Circular Fiducial, 1mm bare copper top; 2mm keepout (Level A)")
(tags marker)
(path /607FA433)
(zone_connect 2)
(attr virtual)
(fp_text reference H1 (at 0 -1.6 90) (layer F.SilkS) hide
(effects (font (size 0.508 0.508) (thickness 0.127)))
)
(fp_text value " " (at 0 2 90) (layer F.Fab) hide
(effects (font (size 0.508 0.508) (thickness 0.127)))
)
(fp_circle (center 0 0) (end 1 0) (layer F.Fab) (width 0.1))
(fp_text user %R (at 0 0 90) (layer F.Fab)
(effects (font (size 0.4 0.4) (thickness 0.06)))
)
(fp_circle (center 0 0) (end 1.25 0) (layer F.CrtYd) (width 0.05))
(pad 1 thru_hole circle (at 0 0 270) (size 2 2) (drill 1.1) (layers *.Cu *.Mask)
(net 2 GND) (zone_connect 2))
)
(module stdpads:PasteHole_1.1mm_PTH (layer F.Cu) (tedit 5CC28312) (tstamp 5DE45E2A)
(at 133.35 129.54)
(descr "Circular Fiducial, 1mm bare copper top; 2mm keepout (Level A)")
(tags marker)
(path /5CC7E0C0)
(zone_connect 2)
(attr virtual)
(fp_text reference H4 (at -1.905 0) (layer F.SilkS) hide
(effects (font (size 0.508 0.508) (thickness 0.127)))
)
(fp_text value " " (at 0 2) (layer F.Fab) hide
(effects (font (size 0.508 0.508) (thickness 0.127)))
)
(fp_circle (center 0 0) (end 1 0) (layer F.Fab) (width 0.1))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.4 0.4) (thickness 0.06)))
)
(fp_circle (center 0 0) (end 1.25 0) (layer F.CrtYd) (width 0.05))
(pad 1 thru_hole circle (at 0 0) (size 2 2) (drill 1.1) (layers *.Cu *.Mask)
(net 2 GND) (zone_connect 2))
)
(module stdpads:PasteHole_1.1mm_PTH (layer F.Cu) (tedit 5CC2832B) (tstamp 5DE2C9F6)
(at 72.898 129.54)
(descr "Circular Fiducial, 1mm bare copper top; 2mm keepout (Level A)")
(tags marker)
(path /5CC871F0)
(zone_connect 2)
(attr virtual)
(fp_text reference H5 (at 0 -1.6) (layer F.SilkS) hide
(effects (font (size 0.508 0.508) (thickness 0.127)))
)
(fp_text value " " (at 0 2) (layer F.Fab) hide
(effects (font (size 0.508 0.508) (thickness 0.127)))
)
(fp_circle (center 0 0) (end 1 0) (layer F.Fab) (width 0.1))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.4 0.4) (thickness 0.06)))
)
(fp_circle (center 0 0) (end 1.25 0) (layer F.CrtYd) (width 0.05))
(pad 1 thru_hole circle (at 0 0) (size 2 2) (drill 1.1) (layers *.Cu *.Mask)
(net 2 GND) (zone_connect 2))
)
(module stdpads:C_0805 (layer F.Cu) (tedit 5CC26793) (tstamp 5DE2B4F2)
(at 136.31 127.889 180)
(tags capacitor)
(path /5D136B08)
(attr smd)
(fp_text reference C1 (at 0 -1.5) (layer F.SilkS) hide
(effects (font (size 0.8128 0.8128) (thickness 0.1524)))
)
(fp_text value 2u2 (at 0 0.9) (layer F.Fab) hide
(effects (font (size 0.127 0.127) (thickness 0.03175)))
)
(fp_line (start -1 0.625) (end -1 -0.625) (layer F.Fab) (width 0.15))
(fp_line (start -1 -0.625) (end 1 -0.625) (layer F.Fab) (width 0.15))
(fp_line (start 1 -0.625) (end 1 0.625) (layer F.Fab) (width 0.15))
(fp_line (start 1 0.625) (end -1 0.625) (layer F.Fab) (width 0.15))
(fp_line (start -0.4064 -0.8) (end 0.4064 -0.8) (layer F.SilkS) (width 0.1524))
(fp_line (start -0.4064 0.8) (end 0.4064 0.8) (layer F.SilkS) (width 0.1524))
(fp_line (start -1.7 1) (end -1.7 -1) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.7 -1) (end 1.7 -1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.7 -1) (end 1.7 1) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.7 1) (end -1.7 1) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at 0 0 90) (layer F.Fab)
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(pad 1 smd roundrect (at -0.85 0 180) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(pad 2 smd roundrect (at 0.85 0 180) (size 1.05 1.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0805_2012Metric.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module stdpads:TSSOP-20_4.4x6.5mm_P0.65mm (layer F.Cu) (tedit 5F27C9F6) (tstamp 5F8B1DF0)
(at 81.675 122.6 180)
(descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.65")
(path /5DE36B22)
(solder_mask_margin 0.024)
(solder_paste_margin -0.04)
(attr smd)
(fp_text reference U2 (at 0 0 180) (layer F.Fab)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(fp_text value 74HCT245 (at 0 1.016 180) (layer F.Fab)
(effects (font (size 0.508 0.508) (thickness 0.127)))
)
(fp_line (start -3.25 1.2) (end -3.25 -2.2) (layer F.Fab) (width 0.15))
(fp_line (start -3.25 -2.2) (end 3.25 -2.2) (layer F.Fab) (width 0.15))
(fp_line (start 3.25 -2.2) (end 3.25 2.2) (layer F.Fab) (width 0.15))
(fp_line (start 3.25 2.2) (end -2.25 2.2) (layer F.Fab) (width 0.15))
(fp_line (start -2.25 2.2) (end -3.25 1.2) (layer F.Fab) (width 0.15))
(fp_line (start -3.55 3.95) (end 3.55 3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.55 -3.95) (end 3.55 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.55 3.95) (end -3.55 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.55 3.95) (end 3.55 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.45 2.225) (end 3.45 -2.225) (layer F.SilkS) (width 0.15))
(fp_line (start -3.45 3.75) (end -3.45 -2.225) (layer F.SilkS) (width 0.15))
(fp_text user %R (at 0 0) (layer F.SilkS)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(pad 1 smd roundrect (at -2.925 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 48 /R~WE~))
(pad 2 smd roundrect (at -2.275 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 58 /RD3))
(pad 3 smd roundrect (at -1.625 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 59 /RD2))
(pad 4 smd roundrect (at -0.975 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 60 /RD1))
(pad 5 smd roundrect (at -0.325 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 61 /RD0))
(pad 6 smd roundrect (at 0.325 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 54 /RD7))
(pad 7 smd roundrect (at 0.975 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 55 /RD6))
(pad 8 smd roundrect (at 1.625 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 56 /RD5))
(pad 9 smd roundrect (at 2.275 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 57 /RD4))
(pad 10 smd roundrect (at 2.925 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(pad 11 smd roundrect (at 2.925 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 17 /D0))
(pad 12 smd roundrect (at 2.275 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 15 /D1))
(pad 13 smd roundrect (at 1.625 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 18 /D2))
(pad 14 smd roundrect (at 0.975 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 19 /D3))
(pad 15 smd roundrect (at 0.325 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 20 /D4))
(pad 16 smd roundrect (at -0.325 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 16 /D5))
(pad 17 smd roundrect (at -0.975 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 5 /D6))
(pad 18 smd roundrect (at -1.625 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 4 /D7))
(pad 19 smd roundrect (at -2.275 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 49 /R~CS~))
(pad 20 smd roundrect (at -2.925 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-20_4.4x6.5mm_P0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 -90))
)
)
(module stdpads:TSSOP-14_4.4x5mm_P0.65mm (layer F.Cu) (tedit 5F37C96A) (tstamp 5F8B1D23)
(at 122.8 122.6 180)
(descr "14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.65")
(path /61D098B2)
(solder_mask_margin 0.024)
(solder_paste_margin -0.04)
(attr smd)
(fp_text reference U9 (at 0 0 180) (layer F.Fab)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(fp_text value 74LS08 (at 0 1 180) (layer F.Fab)
(effects (font (size 0.381 0.381) (thickness 0.09525)))
)
(fp_line (start -2.5 1.2) (end -2.5 -2.2) (layer F.Fab) (width 0.15))
(fp_line (start -2.5 -2.2) (end 2.5 -2.2) (layer F.Fab) (width 0.15))
(fp_line (start 2.5 -2.2) (end 2.5 2.2) (layer F.Fab) (width 0.15))
(fp_line (start 2.5 2.2) (end -1.5 2.2) (layer F.Fab) (width 0.15))
(fp_line (start -1.5 2.2) (end -2.5 1.2) (layer F.Fab) (width 0.15))
(fp_line (start -2.8 3.95) (end 2.8 3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.8 -3.95) (end 2.8 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.8 3.95) (end -2.8 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.8 3.95) (end 2.8 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.625 2.325) (end -2.5 2.325) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 -2.325) (end -2.4 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 -2.325) (end 2.4 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 2.325) (end 2.4 2.325) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 2.325) (end -2.625 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 2.325) (end 2.625 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start -2.5 2.325) (end -2.5 3.675) (layer F.SilkS) (width 0.15))
(fp_text user %R (at 0 0 180) (layer F.SilkS)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(pad 1 smd roundrect (at -1.95 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 88 "Net-(U8-Pad11)"))
(pad 2 smd roundrect (at -1.3 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 93 "Net-(U10-Pad11)"))
(pad 3 smd roundrect (at -0.65 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 90 "Net-(U9-Pad10)"))
(pad 4 smd roundrect (at 0 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 92 /INHOE))
(pad 5 smd roundrect (at 0.65 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 43 /PHI0))
(pad 6 smd roundrect (at 1.3 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 81 /RCS))
(pad 7 smd roundrect (at 1.95 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(pad 8 smd roundrect (at 1.95 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 92 /INHOE))
(pad 9 smd roundrect (at 1.3 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 91 "Net-(U10-Pad8)"))
(pad 10 smd roundrect (at 0.65 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 90 "Net-(U9-Pad10)"))
(pad 11 smd roundrect (at 0 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 89 "Net-(U10-Pad9)"))
(pad 12 smd roundrect (at -0.65 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 64 /ENRD))
(pad 13 smd roundrect (at -1.3 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 48 /R~WE~))
(pad 14 smd roundrect (at -1.95 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-14_4.4x5mm_P0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 -90))
)
)
(module stdpads:TSSOP-14_4.4x5mm_P0.65mm (layer F.Cu) (tedit 5F37C96A) (tstamp 5F8B1D89)
(at 111.75 122.6 180)
(descr "14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.65")
(path /61D08FB5)
(solder_mask_margin 0.024)
(solder_paste_margin -0.04)
(attr smd)
(fp_text reference U8 (at 0 0 180) (layer F.Fab)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(fp_text value 74LS08 (at 0 1 180) (layer F.Fab)
(effects (font (size 0.381 0.381) (thickness 0.09525)))
)
(fp_line (start -2.5 1.2) (end -2.5 -2.2) (layer F.Fab) (width 0.15))
(fp_line (start -2.5 -2.2) (end 2.5 -2.2) (layer F.Fab) (width 0.15))
(fp_line (start 2.5 -2.2) (end 2.5 2.2) (layer F.Fab) (width 0.15))
(fp_line (start 2.5 2.2) (end -1.5 2.2) (layer F.Fab) (width 0.15))
(fp_line (start -1.5 2.2) (end -2.5 1.2) (layer F.Fab) (width 0.15))
(fp_line (start -2.8 3.95) (end 2.8 3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.8 -3.95) (end 2.8 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.8 3.95) (end -2.8 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start 2.8 3.95) (end 2.8 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.625 2.325) (end -2.5 2.325) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 -2.325) (end -2.4 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 -2.325) (end 2.4 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 2.325) (end 2.4 2.325) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 2.325) (end -2.625 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 2.325) (end 2.625 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start -2.5 2.325) (end -2.5 3.675) (layer F.SilkS) (width 0.15))
(fp_text user %R (at 0 0 180) (layer F.SilkS)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(pad 1 smd roundrect (at -1.95 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 80 "Net-(U5-Pad8)"))
(pad 2 smd roundrect (at -1.3 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 62 /BankAB))
(pad 3 smd roundrect (at -0.65 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 85 "Net-(U10-Pad4)"))
(pad 4 smd roundrect (at 0 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 28 /A13))
(pad 5 smd roundrect (at 0.65 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 27 /A12))
(pad 6 smd roundrect (at 1.3 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 86 "Net-(U10-Pad5)"))
(pad 7 smd roundrect (at 1.95 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(pad 8 smd roundrect (at 1.95 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 87 "Net-(U10-Pad10)"))
(pad 9 smd roundrect (at 1.3 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 65 /ENWR))
(pad 10 smd roundrect (at 0.65 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 82 "Net-(U5-Pad12)"))
(pad 11 smd roundrect (at 0 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 88 "Net-(U8-Pad11)"))
(pad 12 smd roundrect (at -0.65 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 29 /A14))
(pad 13 smd roundrect (at -1.3 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 30 /A15))
(pad 14 smd roundrect (at -1.95 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-14_4.4x5mm_P0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 -90))
)
)
(module stdpads:TSSOP-14_4.4x5mm_P0.65mm (layer F.Cu) (tedit 5F37C96A) (tstamp 5F8B1AFE)
(at 104.45 122.6 180)
(descr "14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.65")
(path /61D074CA)
(solder_mask_margin 0.024)
(solder_paste_margin -0.04)
(attr smd)
(fp_text reference U7 (at 0 0 180) (layer F.Fab)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(fp_text value 74LS08 (at 0 1 180) (layer F.Fab)
(effects (font (size 0.381 0.381) (thickness 0.09525)))
)
(fp_text user %R (at 0 0 180) (layer F.SilkS)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(fp_line (start -2.5 2.325) (end -2.5 3.675) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 2.325) (end 2.625 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 2.325) (end -2.625 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 2.325) (end 2.4 2.325) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 -2.325) (end 2.4 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 -2.325) (end -2.4 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 2.325) (end -2.5 2.325) (layer F.SilkS) (width 0.15))
(fp_line (start 2.8 3.95) (end 2.8 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.8 3.95) (end -2.8 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.8 -3.95) (end 2.8 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.8 3.95) (end 2.8 3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.5 2.2) (end -2.5 1.2) (layer F.Fab) (width 0.15))
(fp_line (start 2.5 2.2) (end -1.5 2.2) (layer F.Fab) (width 0.15))
(fp_line (start 2.5 -2.2) (end 2.5 2.2) (layer F.Fab) (width 0.15))
(fp_line (start -2.5 -2.2) (end 2.5 -2.2) (layer F.Fab) (width 0.15))
(fp_line (start -2.5 1.2) (end -2.5 -2.2) (layer F.Fab) (width 0.15))
(pad 14 smd roundrect (at -1.95 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(pad 13 smd roundrect (at -1.3 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 12 smd roundrect (at -0.65 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 11 smd roundrect (at 0 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 10 smd roundrect (at 0.65 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 13 /A0))
(pad 9 smd roundrect (at 1.3 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 63 /ENWR1))
(pad 8 smd roundrect (at 1.95 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 70 /ENWR1A0))
(pad 7 smd roundrect (at 1.95 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(pad 6 smd roundrect (at 1.3 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 5 smd roundrect (at 0.65 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 4 smd roundrect (at 0 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 3 smd roundrect (at -0.65 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 2 smd roundrect (at -1.3 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 1 smd roundrect (at -1.95 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-14_4.4x5mm_P0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 -90))
)
)
(module stdpads:TSSOP-14_4.4x5mm_P0.65mm (layer F.Cu) (tedit 5F37C96A) (tstamp 5F8B1B64)
(at 89.85 122.6 180)
(descr "14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.65")
(path /61D05E00)
(solder_mask_margin 0.024)
(solder_paste_margin -0.04)
(attr smd)
(fp_text reference U5 (at 0 0 180) (layer F.Fab)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(fp_text value 74LS04 (at 0 1 180) (layer F.Fab)
(effects (font (size 0.381 0.381) (thickness 0.09525)))
)
(fp_text user %R (at 0 0 180) (layer F.SilkS)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(fp_line (start -2.5 2.325) (end -2.5 3.675) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 2.325) (end 2.625 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 2.325) (end -2.625 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 2.325) (end 2.4 2.325) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 -2.325) (end 2.4 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 -2.325) (end -2.4 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 2.325) (end -2.5 2.325) (layer F.SilkS) (width 0.15))
(fp_line (start 2.8 3.95) (end 2.8 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.8 3.95) (end -2.8 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.8 -3.95) (end 2.8 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.8 3.95) (end 2.8 3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.5 2.2) (end -2.5 1.2) (layer F.Fab) (width 0.15))
(fp_line (start 2.5 2.2) (end -1.5 2.2) (layer F.Fab) (width 0.15))
(fp_line (start 2.5 -2.2) (end 2.5 2.2) (layer F.Fab) (width 0.15))
(fp_line (start -2.5 -2.2) (end 2.5 -2.2) (layer F.Fab) (width 0.15))
(fp_line (start -2.5 1.2) (end -2.5 -2.2) (layer F.Fab) (width 0.15))
(pad 14 smd roundrect (at -1.95 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(pad 13 smd roundrect (at -1.3 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 48 /R~WE~))
(pad 12 smd roundrect (at -0.65 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 82 "Net-(U5-Pad12)"))
(pad 11 smd roundrect (at 0 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 81 /RCS))
(pad 10 smd roundrect (at 0.65 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 49 /R~CS~))
(pad 9 smd roundrect (at 1.3 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 28 /A13))
(pad 8 smd roundrect (at 1.95 -2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 80 "Net-(U5-Pad8)"))
(pad 7 smd roundrect (at 1.95 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(pad 6 smd roundrect (at 1.3 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 79 "Net-(U5-Pad6)"))
(pad 5 smd roundrect (at 0.65 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 11 /A2))
(pad 4 smd roundrect (at 0 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 78 "Net-(U5-Pad4)"))
(pad 3 smd roundrect (at -0.65 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 12 /A1))
(pad 2 smd roundrect (at -1.3 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 77 "Net-(U5-Pad2)"))
(pad 1 smd roundrect (at -1.95 2.95 270) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 13 /A0))
(model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-14_4.4x5mm_P0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 -90))
)
)
(module stdpads:TSSOP-14_4.4x5mm_P0.65mm (layer F.Cu) (tedit 5F37C96A) (tstamp 5F8AB3FE)
(at 128.5 112.45 270)
(descr "14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.65")
(path /61D0A2BD)
(solder_mask_margin 0.024)
(solder_paste_margin -0.04)
(attr smd)
(fp_text reference U10 (at 0 0 270) (layer F.Fab)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(fp_text value 74LS32 (at 0 1 270) (layer F.Fab)
(effects (font (size 0.381 0.381) (thickness 0.09525)))
)
(fp_text user %R (at 0 0 270) (layer F.SilkS)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(fp_line (start -2.5 2.325) (end -2.5 3.675) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 2.325) (end 2.625 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 2.325) (end -2.625 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 2.325) (end 2.4 2.325) (layer F.SilkS) (width 0.15))
(fp_line (start 2.625 -2.325) (end 2.4 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 -2.325) (end -2.4 -2.325) (layer F.SilkS) (width 0.15))
(fp_line (start -2.625 2.325) (end -2.5 2.325) (layer F.SilkS) (width 0.15))
(fp_line (start 2.8 3.95) (end 2.8 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.8 3.95) (end -2.8 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.8 -3.95) (end 2.8 -3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.8 3.95) (end 2.8 3.95) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.5 2.2) (end -2.5 1.2) (layer F.Fab) (width 0.15))
(fp_line (start 2.5 2.2) (end -1.5 2.2) (layer F.Fab) (width 0.15))
(fp_line (start 2.5 -2.2) (end 2.5 2.2) (layer F.Fab) (width 0.15))
(fp_line (start -2.5 -2.2) (end 2.5 -2.2) (layer F.Fab) (width 0.15))
(fp_line (start -2.5 1.2) (end -2.5 -2.2) (layer F.Fab) (width 0.15))
(pad 14 smd roundrect (at -1.95 -2.95) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(pad 13 smd roundrect (at -1.3 -2.95) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 27 /A12))
(pad 12 smd roundrect (at -0.65 -2.95) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 28 /A13))
(pad 11 smd roundrect (at 0 -2.95) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 93 "Net-(U10-Pad11)"))
(pad 10 smd roundrect (at 0.65 -2.95) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 87 "Net-(U10-Pad10)"))
(pad 9 smd roundrect (at 1.3 -2.95) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 89 "Net-(U10-Pad9)"))
(pad 8 smd roundrect (at 1.95 -2.95) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 91 "Net-(U10-Pad8)"))
(pad 7 smd roundrect (at 1.95 2.95) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(pad 6 smd roundrect (at 1.3 2.95) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 53 /RA12))
(pad 5 smd roundrect (at 0.65 2.95) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 86 "Net-(U10-Pad5)"))
(pad 4 smd roundrect (at 0 2.95) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 85 "Net-(U10-Pad4)"))
(pad 3 smd roundrect (at -0.65 2.95) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 75 /~A0XOR1~))
(pad 2 smd roundrect (at -1.3 2.95) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 84 "Net-(U10-Pad2)"))
(pad 1 smd roundrect (at -1.95 2.95) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 83 "Net-(U10-Pad1)"))
(model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-14_4.4x5mm_P0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 -90))
)
)
(module stdpads:SOT-353 (layer F.Cu) (tedit 5F028B78) (tstamp 5F5D2CCD)
(at 118.3 122.65 270)
(tags "SOT-353 SC-70-5")
(path /61E07386)
(solder_mask_margin 0.04)
(solder_paste_margin -0.04)
(attr smd)
(fp_text reference U11 (at 0 0) (layer F.Fab)
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(fp_text value 74AHC1G126GW (at 0.35 0) (layer F.Fab)
(effects (font (size 0.1905 0.1905) (thickness 0.047625)))
)
(fp_line (start -0.18 -1.1) (end -0.68 -0.6) (layer F.Fab) (width 0.1))
(fp_line (start 0.67 1.1) (end -0.68 1.1) (layer F.Fab) (width 0.1))
(fp_line (start 0.67 -1.1) (end 0.67 1.1) (layer F.Fab) (width 0.1))
(fp_line (start -0.68 -0.6) (end -0.68 1.1) (layer F.Fab) (width 0.1))
(fp_line (start 0.67 -1.1) (end -0.18 -1.1) (layer F.Fab) (width 0.1))
(fp_line (start -0.68 1.16) (end 0.73 1.16) (layer F.SilkS) (width 0.12))
(fp_line (start 0.73 -1.16) (end -1.3 -1.16) (layer F.SilkS) (width 0.12))
(fp_line (start -1.6 1.3) (end -1.6 -1.3) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.6 -1.3) (end 1.6 -1.3) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.6 -1.3) (end 1.6 1.3) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.6 1.3) (end -1.6 1.3) (layer F.CrtYd) (width 0.05))
(pad 3 smd roundrect (at -0.85 0.65 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(pad 1 smd roundrect (at -0.85 -0.65 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 92 /INHOE))
(pad 2 smd roundrect (at -0.85 0 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(pad 4 smd roundrect (at 0.85 0.65 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 37 /~INH~))
(pad 5 smd roundrect (at 0.85 -0.65 270) (size 1 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(model ${KISYS3DMOD}/Package_TO_SOT_SMD.3dshapes/SOT-353_SC-70-5.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module stdpads:C_0603 (layer F.Cu) (tedit 5EE29C36) (tstamp 5F8B1C81)
(at 100.65 124.8 90)
(tags capacitor)
(path /61D5AB0B)
(solder_mask_margin 0.05)
(solder_paste_margin -0.04)
(attr smd)
(fp_text reference C7 (at 0 0 90) (layer F.Fab)
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(fp_text value 2u2 (at 0 0.25 90) (layer F.Fab)
(effects (font (size 0.127 0.127) (thickness 0.03175)))
)
(fp_text user %R (at 0 0 90) (layer F.SilkS) hide
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(fp_line (start 1.4 0.7) (end -1.4 0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.4 -0.7) (end 1.4 0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.4 -0.7) (end 1.4 -0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.4 0.7) (end -1.4 -0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.162779 0.51) (end 0.162779 0.51) (layer F.SilkS) (width 0.12))
(fp_line (start -0.162779 -0.51) (end 0.162779 -0.51) (layer F.SilkS) (width 0.12))
(fp_line (start 0.8 0.4) (end -0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1))
(pad 2 smd roundrect (at 0.75 0 90) (size 0.85 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(pad 1 smd roundrect (at -0.75 0 90) (size 0.85 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module stdpads:C_0603 (layer F.Cu) (tedit 5EE29C36) (tstamp 5F8B27F5)
(at 113.55 108.75 180)
(tags capacitor)
(path /607FA429)
(solder_mask_margin 0.05)
(solder_paste_margin -0.04)
(attr smd)
(fp_text reference C4 (at 0 0) (layer F.Fab)
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(fp_text value 2u2 (at 0 0.25) (layer F.Fab)
(effects (font (size 0.127 0.127) (thickness 0.03175)))
)
(fp_text user %R (at 0 0) (layer F.SilkS) hide
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(fp_line (start 1.4 0.7) (end -1.4 0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.4 -0.7) (end 1.4 0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.4 -0.7) (end 1.4 -0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.4 0.7) (end -1.4 -0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.162779 0.51) (end 0.162779 0.51) (layer F.SilkS) (width 0.12))
(fp_line (start -0.162779 -0.51) (end 0.162779 -0.51) (layer F.SilkS) (width 0.12))
(fp_line (start 0.8 0.4) (end -0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1))
(pad 2 smd roundrect (at 0.75 0 180) (size 0.85 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(pad 1 smd roundrect (at -0.75 0 180) (size 0.85 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module stdpads:C_0603 (layer F.Cu) (tedit 5EE29C36) (tstamp 5F8B2817)
(at 130.7 108.75 180)
(tags capacitor)
(path /61D5AE36)
(solder_mask_margin 0.05)
(solder_paste_margin -0.04)
(attr smd)
(fp_text reference C12 (at 0 0) (layer F.Fab)
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(fp_text value 2u2 (at 0 0.25) (layer F.Fab)
(effects (font (size 0.127 0.127) (thickness 0.03175)))
)
(fp_text user %R (at 0 0) (layer F.SilkS) hide
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(fp_line (start 1.4 0.7) (end -1.4 0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.4 -0.7) (end 1.4 0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.4 -0.7) (end 1.4 -0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.4 0.7) (end -1.4 -0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.162779 0.51) (end 0.162779 0.51) (layer F.SilkS) (width 0.12))
(fp_line (start -0.162779 -0.51) (end 0.162779 -0.51) (layer F.SilkS) (width 0.12))
(fp_line (start 0.8 0.4) (end -0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1))
(pad 2 smd roundrect (at 0.75 0 180) (size 0.85 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(pad 1 smd roundrect (at -0.75 0 180) (size 0.85 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module stdpads:C_0603 (layer F.Cu) (tedit 5EE29C36) (tstamp 5F8B2828)
(at 104.35 112.4)
(tags capacitor)
(path /61D4A326)
(solder_mask_margin 0.05)
(solder_paste_margin -0.04)
(attr smd)
(fp_text reference C13 (at 0 0) (layer F.Fab)
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(fp_text value 2u2 (at 0 0.25) (layer F.Fab)
(effects (font (size 0.127 0.127) (thickness 0.03175)))
)
(fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1))
(fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start 0.8 0.4) (end -0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.162779 -0.51) (end 0.162779 -0.51) (layer F.SilkS) (width 0.12))
(fp_line (start -0.162779 0.51) (end 0.162779 0.51) (layer F.SilkS) (width 0.12))
(fp_line (start -1.4 0.7) (end -1.4 -0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.4 -0.7) (end 1.4 -0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.4 -0.7) (end 1.4 0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.4 0.7) (end -1.4 0.7) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at 0 0) (layer F.SilkS) hide
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(pad 1 smd roundrect (at -0.75 0) (size 0.85 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 1 +5V))
(pad 2 smd roundrect (at 0.75 0) (size 0.85 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(model ${KISYS3DMOD}/Capacitor_SMD.3dshapes/C_0603_1608Metric.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
(module stdpads:C_0603 (layer F.Cu) (tedit 5EE29C36) (tstamp 5F8B284A)
(at 122.15 108.75 180)
(tags capacitor)
(path /61D4A332)
(solder_mask_margin 0.05)
(solder_paste_margin -0.04)
(attr smd)
(fp_text reference C15 (at 0 0) (layer F.Fab)
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(fp_text value 2u2 (at 0 0.25) (layer F.Fab)
(effects (font (size 0.127 0.127) (thickness 0.03175)))
)
(fp_text user %R (at 0 0) (layer F.SilkS) hide
(effects (font (size 0.254 0.254) (thickness 0.0635)))
)
(fp_line (start 1.4 0.7) (end -1.4 0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start 1.4 -0.7) (end 1.4 0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.4 -0.7) (end 1.4 -0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.4 0.7) (end -1.4 -0.7) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.162779 0.51) (end 0.162779 0.51) (layer F.SilkS) (width 0.12))
(fp_line (start -0.162779 -0.51) (end 0.162779 -0.51) (layer F.SilkS) (width 0.12))
(fp_line (start 0.8 0.4) (end -0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start 0.8 -0.4) (end 0.8 0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.8 -0.4) (end 0.8 -0.4) (layer F.Fab) (width 0.1))
(fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1))
(pad 2 smd roundrect (at 0.75 0 180) (size 0.85 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
(net 2 GND))
(pad 1 smd roundrect (at -0.75 0 180) (size 0.85 0.95) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
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