diff --git a/Hardware/LCMXO2/BOM/RAM2E-BOM.LCMXO2HC.csv b/Hardware/LCMXO2/BOM/RAM2E-BOM.LCMXO2HC.csv
index 90933a1..64ab134 100644
--- a/Hardware/LCMXO2/BOM/RAM2E-BOM.LCMXO2HC.csv
+++ b/Hardware/LCMXO2/BOM/RAM2E-BOM.LCMXO2HC.csv
@@ -17,7 +17,8 @@ R7 ,1,DNP,stdpads:R_0805,,,,
 R5 R8 R9 R11 ,4,10k,stdpads:R_0603,,C25804,Uniroyal 0603WAF1002T5E,Any manufacturer's part is acceptable.
 U1 ,1,LCMXO2-TG100,stdpads:TQFP-100_14x14mm_P0.5mm,,C1519051,"Lattice LCMXO2-640HC-4TG100C, Lattice LCMXO2-640HC-5TG100C, Lattice LCMXO2-640HC-6TG100C, Lattice LCMXO2-640HC-4TG100I, Lattice LCMXO2-640HC-5TG100I, Lattice LCMXO2-640HC-6TG100I, Lattice LCMXO2-1200HC-4TG100C, Lattice LCMXO2-1200HC-5TG100C, Lattice LCMXO2-1200HC-6TG100C, Lattice LCMXO2-1200HC-4TG100I, Lattice LCMXO2-1200HC-5TG100I, Lattice LCMXO2-1200HC-6TG100I",
 U2 ,1,W9812G6KH-6,stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm,,C62379,"Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G",Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable.
-U3 U4 U5 ,3,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI 74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.
+U4 ,1,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI 74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.
+U3 U5 ,2,74AHC245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI 74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.
 U6 U7 ,2,74AHCT245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C173388,"NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW",Most 74AHCT245 in TSSOP-20 package is acceptable.
 U8 ,1,XC6206P332MR,stdpads:SOT-23,,C5446,Torex XC6206P332MR,Most 3.3V regulator in SOT-23 package is acceptable.
-U9 ,1,DNP,stdpads:SOT-23-5,,,,
\ No newline at end of file
+U9 ,1,DNP,stdpads:SOT-23-5,,,,
diff --git a/Hardware/LCMXO2/BOM/RAM2E-BOM.LCMXO2HE.csv b/Hardware/LCMXO2/BOM/RAM2E-BOM.LCMXO2HE.csv
index c3720f5..5bc29ed 100644
--- a/Hardware/LCMXO2/BOM/RAM2E-BOM.LCMXO2HE.csv
+++ b/Hardware/LCMXO2/BOM/RAM2E-BOM.LCMXO2HE.csv
@@ -17,7 +17,8 @@ R7 ,1,DNP,stdpads:R_0805,,,,
 R5 R8 R9 R11 ,4,10k,stdpads:R_0603,,C25804,Uniroyal 0603WAF1002T5E,Any manufacturer's part is acceptable.
 U1 ,1,LCMXO2-TG100,stdpads:TQFP-100_14x14mm_P0.5mm,,C1519051,"Lattice LCMXO2-640HE-4TG100C, Lattice LCMXO2-640HE-5TG100C, Lattice LCMXO2-640HE-6TG100C, Lattice LCMXO2-640HE-4TG100I, Lattice LCMXO2-640HE-5TG100I, Lattice LCMXO2-640HE-6TG100I, Lattice LCMXO2-1200HE-4TG100C, Lattice LCMXO2-1200HE-5TG100C, Lattice LCMXO2-1200HE-6TG100C, Lattice LCMXO2-1200HE-4TG100I, Lattice LCMXO2-1200HE-5TG100I, Lattice LCMXO2-1200HE-6TG100I",
 U2 ,1,W9812G6KH-6,stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm,,C62379,"Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G",Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable.
-U3 U4 U5 ,3,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI 74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.
+U4 ,1,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI 74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.
+U3 U5 ,2,74AHC245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI 74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.
 U6 U7 ,2,74AHCT245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C173388,"NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW",Most 74AHCT245 in TSSOP-20 package is acceptable.
 U8 ,1,XC6206P332MR,stdpads:SOT-23,,C5446,Torex XC6206P332MR,Most 3.3V regulator in SOT-23 package is acceptable.
-U9 ,1,AP2127K-1.2TRG1,stdpads:SOT-23-5,,C151376,"Diodes AP2127K-1.2TRG1, Torex XC6228D122VR",Most 1.2V regulator in SOT-23-5 package is acceptable.
\ No newline at end of file
+U9 ,1,AP2127K-1.2TRG1,stdpads:SOT-23-5,,C151376,"Diodes AP2127K-1.2TRG1, Torex XC6228D122VR",Most 1.2V regulator in SOT-23-5 package is acceptable.
diff --git a/Hardware/LCMXO2/Documentation/RAM2E.4203B.LCMXO2-Placement.pdf b/Hardware/LCMXO2/Documentation/RAM2E.4203B.LCMXO2-Placement.pdf
index 34822b4..5d01624 100644
Binary files a/Hardware/LCMXO2/Documentation/RAM2E.4203B.LCMXO2-Placement.pdf and b/Hardware/LCMXO2/Documentation/RAM2E.4203B.LCMXO2-Placement.pdf differ
diff --git a/Hardware/LCMXO2/Documentation/RAM2E.4203B.LCMXO2-Schematic.pdf b/Hardware/LCMXO2/Documentation/RAM2E.4203B.LCMXO2-Schematic.pdf
index 2b242e9..96efad2 100644
Binary files a/Hardware/LCMXO2/Documentation/RAM2E.4203B.LCMXO2-Schematic.pdf and b/Hardware/LCMXO2/Documentation/RAM2E.4203B.LCMXO2-Schematic.pdf differ
diff --git a/Hardware/LCMXO2/RAM2E.kicad_pcb b/Hardware/LCMXO2/RAM2E.kicad_pcb
index c7518ab..80059ef 100644
--- a/Hardware/LCMXO2/RAM2E.kicad_pcb
+++ b/Hardware/LCMXO2/RAM2E.kicad_pcb
@@ -306,7 +306,7 @@
     (at 239.175 124.6)
     (descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
     (tags "SSOP 0.65")
-    (property "LCSC Part" "C6082")
+    (property "LCSC Part" "C5516")
     (property "Mfg. Part Numbers" "NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI 74AHC245PW")
     (property "Notes" "Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.")
     (property "Sheetfile" "RAM2E.kicad_sch")
@@ -319,7 +319,7 @@
         (effects (font (size 0.8128 0.8128) (thickness 0.2032)))
       (tstamp b4047194-c01c-4c03-87bf-fbfca3cd5c4e)
     )
-    (fp_text value "74LVC245APW" (at 0 1.016 180) (layer "F.Fab")
+    (fp_text value "74AHC245PW" (at 0 1.016 180) (layer "F.Fab")
         (effects (font (size 0.508 0.508) (thickness 0.127)))
       (tstamp a371cd02-8df4-4bca-b47d-17cf165763c2)
     )
@@ -670,7 +670,7 @@
     (at 220.775 124.6)
     (descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
     (tags "SSOP 0.65")
-    (property "LCSC Part" "C6082")
+    (property "LCSC Part" "C5516")
     (property "Mfg. Part Numbers" "NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI 74AHC245PW")
     (property "Notes" "Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.")
     (property "Sheetfile" "RAM2E.kicad_sch")
@@ -683,7 +683,7 @@
         (effects (font (size 0.8128 0.8128) (thickness 0.2032)))
       (tstamp 6c436cef-ec3d-4280-9151-bc8998ffb053)
     )
-    (fp_text value "74LVC245APW" (at 0 1.016 180) (layer "F.Fab")
+    (fp_text value "74AHC245PW" (at 0 1.016 180) (layer "F.Fab")
         (effects (font (size 0.508 0.508) (thickness 0.127)))
       (tstamp daae6207-9cc6-4536-9dd0-dbb319406c79)
     )
diff --git a/Hardware/LCMXO2/RAM2E.kicad_sch b/Hardware/LCMXO2/RAM2E.kicad_sch
index 5faeda7..571ee0d 100644
--- a/Hardware/LCMXO2/RAM2E.kicad_sch
+++ b/Hardware/LCMXO2/RAM2E.kicad_sch
@@ -5034,7 +5034,7 @@
     (property "Reference" "U3" (at 76.2 22.86 0)
       (effects (font (size 1.27 1.27)))
     )
-    (property "Value" "74LVC245APW" (at 76.2 53.34 0)
+    (property "Value" "74AHC245PW" (at 76.2 53.34 0)
       (effects (font (size 1.27 1.27)))
     )
     (property "Footprint" "stdpads:TSSOP-20_4.4x6.5mm_P0.65mm" (at 76.2 54.61 0)
@@ -5043,7 +5043,7 @@
     (property "Datasheet" "" (at 76.2 35.56 0)
       (effects (font (size 1.524 1.524)) hide)
     )
-    (property "LCSC Part" "C6082" (at 76.2 38.1 0)
+    (property "LCSC Part" "C5516" (at 76.2 38.1 0)
       (effects (font (size 1.27 1.27)) hide)
     )
     (property "Mfg. Part Numbers" "NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI 74AHC245PW" (at 76.2 38.1 0)
@@ -5087,7 +5087,7 @@
     (property "Reference" "U5" (at 76.2 88.9 0)
       (effects (font (size 1.27 1.27)))
     )
-    (property "Value" "74LVC245APW" (at 76.2 119.38 0)
+    (property "Value" "74AHC245PW" (at 76.2 119.38 0)
       (effects (font (size 1.27 1.27)))
     )
     (property "Footprint" "stdpads:TSSOP-20_4.4x6.5mm_P0.65mm" (at 76.2 120.65 0)
@@ -5096,7 +5096,7 @@
     (property "Datasheet" "" (at 76.2 101.6 0)
       (effects (font (size 1.524 1.524)) hide)
     )
-    (property "LCSC Part" "C6082" (at 76.2 104.14 0)
+    (property "LCSC Part" "C5516" (at 76.2 104.14 0)
       (effects (font (size 1.27 1.27)) hide)
     )
     (property "Mfg. Part Numbers" "NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI 74AHC245PW" (at 76.2 104.14 0)
diff --git a/Hardware/LCMXO2/gerber/RAM2E-top-pos.JUMPER.csv b/Hardware/LCMXO2/gerber/RAM2E-top-pos.JUMPER.csv
index 3f51395..20249d1 100644
--- a/Hardware/LCMXO2/gerber/RAM2E-top-pos.JUMPER.csv
+++ b/Hardware/LCMXO2/gerber/RAM2E-top-pos.JUMPER.csv
@@ -49,9 +49,9 @@ Ref,Val,Package,MidX,MidY,Rotation,Side
 "R13","47","R_0603",228.000000,-118.550000,-90.000000,top
 "U1","LCMXO2-TG100","TQFP-100_14x14mm_P0.5mm",240.050000,-108.350000,90.000000,top
 "U2","W9812G6KH-6","TSOP-II-54_22.2x10.16mm_P0.8mm",218.800000,-105.450000,-90.000000,top
-"U3","74LVC245APW","TSSOP-20_4.4x6.5mm_P0.65mm",220.775000,-124.600000,0.000000,top
+"U3","74AHC245PW","TSSOP-20_4.4x6.5mm_P0.65mm",220.775000,-124.600000,0.000000,top
 "U4","74LVC245APW","TSSOP-20_4.4x6.5mm_P0.65mm",229.975000,-124.600000,0.000000,top
-"U5","74LVC245APW","TSSOP-20_4.4x6.5mm_P0.65mm",239.175000,-124.600000,0.000000,top
+"U5","74AHC245PW","TSSOP-20_4.4x6.5mm_P0.65mm",239.175000,-124.600000,0.000000,top
 "U6","74AHCT245PW","TSSOP-20_4.4x6.5mm_P0.65mm",248.375000,-124.600000,0.000000,top
 "U7","74AHCT245PW","TSSOP-20_4.4x6.5mm_P0.65mm",257.575000,-124.600000,0.000000,top
 "U8","XC6206P332MR","SOT-23",267.650000,-110.800000,180.000000,top
diff --git a/Hardware/LCMXO2/gerber/RAM2E-top-pos.VCORE.csv b/Hardware/LCMXO2/gerber/RAM2E-top-pos.VCORE.csv
index c1d35c8..7aa4177 100644
--- a/Hardware/LCMXO2/gerber/RAM2E-top-pos.VCORE.csv
+++ b/Hardware/LCMXO2/gerber/RAM2E-top-pos.VCORE.csv
@@ -48,9 +48,9 @@ Ref,Val,Package,MidX,MidY,Rotation,Side
 "R13","47","R_0603",228.000000,-118.550000,-90.000000,top
 "U1","LCMXO2-TG100","TQFP-100_14x14mm_P0.5mm",240.050000,-108.350000,90.000000,top
 "U2","W9812G6KH-6","TSOP-II-54_22.2x10.16mm_P0.8mm",218.800000,-105.450000,-90.000000,top
-"U3","74LVC245APW","TSSOP-20_4.4x6.5mm_P0.65mm",220.775000,-124.600000,0.000000,top
+"U3","74AHC245PW","TSSOP-20_4.4x6.5mm_P0.65mm",220.775000,-124.600000,0.000000,top
 "U4","74LVC245APW","TSSOP-20_4.4x6.5mm_P0.65mm",229.975000,-124.600000,0.000000,top
-"U5","74LVC245APW","TSSOP-20_4.4x6.5mm_P0.65mm",239.175000,-124.600000,0.000000,top
+"U5","74AHC245PW","TSSOP-20_4.4x6.5mm_P0.65mm",239.175000,-124.600000,0.000000,top
 "U6","74AHCT245PW","TSSOP-20_4.4x6.5mm_P0.65mm",248.375000,-124.600000,0.000000,top
 "U7","74AHCT245PW","TSSOP-20_4.4x6.5mm_P0.65mm",257.575000,-124.600000,0.000000,top
 "U8","XC6206P332MR","SOT-23",267.650000,-110.800000,180.000000,top
diff --git a/Hardware/LCMXO2/gerber/RAM2E-top-pos.csv b/Hardware/LCMXO2/gerber/RAM2E-top-pos.csv
index 9889a68..28ce055 100644
--- a/Hardware/LCMXO2/gerber/RAM2E-top-pos.csv
+++ b/Hardware/LCMXO2/gerber/RAM2E-top-pos.csv
@@ -49,9 +49,9 @@ Ref,Val,Package,MidX,MidY,Rotation,Side
 "R13","47","R_0603",228.000000,-118.550000,-90.000000,top
 "U1","LCMXO2-TG100","TQFP-100_14x14mm_P0.5mm",240.050000,-108.350000,90.000000,top
 "U2","W9812G6KH-6","TSOP-II-54_22.2x10.16mm_P0.8mm",218.800000,-105.450000,-90.000000,top
-"U3","74LVC245APW","TSSOP-20_4.4x6.5mm_P0.65mm",220.775000,-124.600000,0.000000,top
+"U3","74AHC245PW","TSSOP-20_4.4x6.5mm_P0.65mm",220.775000,-124.600000,0.000000,top
 "U4","74LVC245APW","TSSOP-20_4.4x6.5mm_P0.65mm",229.975000,-124.600000,0.000000,top
-"U5","74LVC245APW","TSSOP-20_4.4x6.5mm_P0.65mm",239.175000,-124.600000,0.000000,top
+"U5","74AHC245PW","TSSOP-20_4.4x6.5mm_P0.65mm",239.175000,-124.600000,0.000000,top
 "U6","74AHCT245PW","TSSOP-20_4.4x6.5mm_P0.65mm",248.375000,-124.600000,0.000000,top
 "U7","74AHCT245PW","TSSOP-20_4.4x6.5mm_P0.65mm",257.575000,-124.600000,0.000000,top
 "U8","XC6206P332MR","SOT-23",267.650000,-110.800000,180.000000,top
diff --git a/Hardware/LCMXO2/gerber/RAM2E.4203B.LCMXO2-gerber.zip b/Hardware/LCMXO2/gerber/RAM2E.4203B.LCMXO2-gerber.zip
index e3745bf..eb90454 100644
Binary files a/Hardware/LCMXO2/gerber/RAM2E.4203B.LCMXO2-gerber.zip and b/Hardware/LCMXO2/gerber/RAM2E.4203B.LCMXO2-gerber.zip differ
diff --git a/Hardware/MAX/BOM/RAM2E-BOM.MAXII.csv b/Hardware/MAX/BOM/RAM2E-BOM.MAXII.csv
index 6af108a..63694e4 100644
--- a/Hardware/MAX/BOM/RAM2E-BOM.MAXII.csv
+++ b/Hardware/MAX/BOM/RAM2E-BOM.MAXII.csv
@@ -16,7 +16,8 @@ R8 ,1,220,stdpads:R_0805,,C17557,Uniroyal 0805W8F2200T5E,Any manufacturer's part
 R9 R10 ,2,22k,stdpads:R_0805,,C17560,Uniroyal 0805W8F2202T5E,Any manufacturer's part is acceptable.
 U1 ,1,EPM240T100,stdpads:TQFP-100_14x14mm_P0.5mm,,C10041,"Altera EPM240T100C5N, Altera EPM240T100C4N, Altera EPM240T100C3N, Altera EPM240T100I5N, Altera EPM240T100I4N, Altera EPM240T100A5N, Altera EPM240T100A4N",
 U2 ,1,W9812G6KH-6,stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm,,C62379,"Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G",Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable.
-U3 U4 U5 ,3,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.
+U4 ,1,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.
+U3 U5 ,2,74AHC245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C5516,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.
 U6 U7 ,2,74AHCT245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C173388,"NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW",Most 74AHCT245 in TSSOP-20 package is acceptable.
 U8 ,1,XC6206P332MR,stdpads:SOT-23,,C5446,Torex XC6206P332MR,Most 3.3V regulator in SOT-23 package is acceptable.
-U9 ,1,AP2127K-1.8TRG1,stdpads:SOT-23-5,,C151375,"Diodes AP2127K-1.8TRG1, Torex XC6228D182VR",Most 1.8V regulator in SOT-23-5 package is acceptable.
\ No newline at end of file
+U9 ,1,DNP,stdpads:SOT-23-5,,,,
diff --git a/Hardware/MAX/BOM/RAM2E-BOM.MAXV.csv b/Hardware/MAX/BOM/RAM2E-BOM.MAXV.csv
index b6ca5c1..f25e7d2 100644
--- a/Hardware/MAX/BOM/RAM2E-BOM.MAXV.csv
+++ b/Hardware/MAX/BOM/RAM2E-BOM.MAXV.csv
@@ -16,7 +16,8 @@ R8 ,1,220,stdpads:R_0805,,C17557,Uniroyal 0805W8F2200T5E,Any manufacturer's part
 R9 R10 ,2,22k,stdpads:R_0805,,C17560,Uniroyal 0805W8F2202T5E,Any manufacturer's part is acceptable.
 U1 ,1,5M240ZT100,stdpads:TQFP-100_14x14mm_P0.5mm,,C10041,"Altera 5M240ZT100C5N, Altera 5M240ZT100C4N, Altera 5M240ZT100C3N, Altera 5M240ZT100I5N, Altera 5M240ZT100I4N, Altera 5M240ZT100A5N, Altera 5M240ZT100A4N",
 U2 ,1,W9812G6KH-6,stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm,,C62379,"Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G",Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable.
-U3 U4 U5 ,3,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.
+U4 ,1,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.
+U3 U5 ,2,74AHC245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C5516,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.
 U6 U7 ,2,74AHCT245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C173388,"NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW",Most 74AHCT245 in TSSOP-20 package is acceptable.
 U8 ,1,XC6206P332MR,stdpads:SOT-23,,C5446,Torex XC6206P332MR,Most 3.3V regulator in SOT-23 package is acceptable.
-U9 ,1,AP2127K-1.8TRG1,stdpads:SOT-23-5,,C151375,"Diodes AP2127K-1.8TRG1, Torex XC6228D182VR",Most 1.8V regulator in SOT-23-5 package is acceptable.
\ No newline at end of file
+U9 ,1,AP2127K-1.8TRG1,stdpads:SOT-23-5,,C151375,"Diodes AP2127K-1.8TRG1, Torex XC6228D182VR",Most 1.8V regulator in SOT-23-5 package is acceptable.
diff --git a/Hardware/MAX/Documentation/RAM2E.4203B.MAX-Placement.pdf b/Hardware/MAX/Documentation/RAM2E.4203B.MAX-Placement.pdf
index 118c2ae..3146a3f 100644
Binary files a/Hardware/MAX/Documentation/RAM2E.4203B.MAX-Placement.pdf and b/Hardware/MAX/Documentation/RAM2E.4203B.MAX-Placement.pdf differ
diff --git a/Hardware/MAX/Documentation/RAM2E.4203B.MAX-Schematic.pdf b/Hardware/MAX/Documentation/RAM2E.4203B.MAX-Schematic.pdf
index fbb52ce..ab2ba13 100644
Binary files a/Hardware/MAX/Documentation/RAM2E.4203B.MAX-Schematic.pdf and b/Hardware/MAX/Documentation/RAM2E.4203B.MAX-Schematic.pdf differ
diff --git a/Hardware/MAX/RAM2E.kicad_pcb b/Hardware/MAX/RAM2E.kicad_pcb
index ee101d0..5062f0c 100644
--- a/Hardware/MAX/RAM2E.kicad_pcb
+++ b/Hardware/MAX/RAM2E.kicad_pcb
@@ -309,7 +309,7 @@
     (at 239.175 124.6)
     (descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
     (tags "SSOP 0.65")
-    (property "LCSC Part" "C6082")
+    (property "LCSC Part" "C5516")
     (property "Mfg. Part Numbers" "NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW")
     (property "Notes" "Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.")
     (property "Sheetfile" "RAM2E.kicad_sch")
@@ -322,7 +322,7 @@
         (effects (font (size 0.8128 0.8128) (thickness 0.2032)))
       (tstamp 43b87a36-4fec-461a-8e36-87f8fbaf36ed)
     )
-    (fp_text value "74LVC245APW" (at 0 1.016 180) (layer "F.Fab")
+    (fp_text value "74AHC245PW" (at 0 1.016 180) (layer "F.Fab")
         (effects (font (size 0.508 0.508) (thickness 0.127)))
       (tstamp 1631d143-9b8c-437b-bc5a-81be85c4f743)
     )
@@ -673,7 +673,7 @@
     (at 220.775 124.6)
     (descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
     (tags "SSOP 0.65")
-    (property "LCSC Part" "C6082")
+    (property "LCSC Part" "C5516")
     (property "Mfg. Part Numbers" "NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW")
     (property "Notes" "Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.")
     (property "Sheetfile" "RAM2E.kicad_sch")
@@ -686,7 +686,7 @@
         (effects (font (size 0.8128 0.8128) (thickness 0.2032)))
       (tstamp c71e18f5-2bde-4d14-8bbe-a0e754b2be54)
     )
-    (fp_text value "74LVC245APW" (at 0 1.016 180) (layer "F.Fab")
+    (fp_text value "74AHC245PW" (at 0 1.016 180) (layer "F.Fab")
         (effects (font (size 0.508 0.508) (thickness 0.127)))
       (tstamp 72a96a34-4fe1-4d0a-a25b-2de49c0d710c)
     )
diff --git a/Hardware/MAX/RAM2E.kicad_sch b/Hardware/MAX/RAM2E.kicad_sch
index 3630df1..02150bb 100644
--- a/Hardware/MAX/RAM2E.kicad_sch
+++ b/Hardware/MAX/RAM2E.kicad_sch
@@ -4969,7 +4969,7 @@
     (property "Reference" "U3" (at 76.2 22.86 0)
       (effects (font (size 1.27 1.27)))
     )
-    (property "Value" "74LVC245APW" (at 76.2 53.34 0)
+    (property "Value" "74AHC245PW" (at 76.2 53.34 0)
       (effects (font (size 1.27 1.27)))
     )
     (property "Footprint" "stdpads:TSSOP-20_4.4x6.5mm_P0.65mm" (at 76.2 54.61 0)
@@ -4978,7 +4978,7 @@
     (property "Datasheet" "" (at 76.2 35.56 0)
       (effects (font (size 1.524 1.524)) hide)
     )
-    (property "LCSC Part" "C6082" (at 76.2 38.1 0)
+    (property "LCSC Part" "C5516" (at 76.2 38.1 0)
       (effects (font (size 1.27 1.27)) hide)
     )
     (property "Mfg. Part Numbers" "NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW" (at 76.2 38.1 0)
@@ -5022,7 +5022,7 @@
     (property "Reference" "U5" (at 76.2 88.9 0)
       (effects (font (size 1.27 1.27)))
     )
-    (property "Value" "74LVC245APW" (at 76.2 119.38 0)
+    (property "Value" "74AHC245PW" (at 76.2 119.38 0)
       (effects (font (size 1.27 1.27)))
     )
     (property "Footprint" "stdpads:TSSOP-20_4.4x6.5mm_P0.65mm" (at 76.2 120.65 0)
@@ -5031,7 +5031,7 @@
     (property "Datasheet" "" (at 76.2 101.6 0)
       (effects (font (size 1.524 1.524)) hide)
     )
-    (property "LCSC Part" "C6082" (at 76.2 104.14 0)
+    (property "LCSC Part" "C5516" (at 76.2 104.14 0)
       (effects (font (size 1.27 1.27)) hide)
     )
     (property "Mfg. Part Numbers" "NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW" (at 76.2 104.14 0)
diff --git a/Hardware/MAX/gerber/RAM2E-top-pos.JUMPER.csv b/Hardware/MAX/gerber/RAM2E-top-pos.JUMPER.csv
index 4b56d2b..49e52ef 100644
--- a/Hardware/MAX/gerber/RAM2E-top-pos.JUMPER.csv
+++ b/Hardware/MAX/gerber/RAM2E-top-pos.JUMPER.csv
@@ -44,9 +44,9 @@ Ref,Val,Package,MidX,MidY,Rotation,Side
 "R10","22k","R_0805",207.264000,-108.077000,180.000000,top
 "U1","EPM240T100","TQFP-100_14x14mm_P0.5mm",240.050000,-108.350000,-90.000000,top
 "U2","W9812G6KH-6","TSOP-II-54_22.2x10.16mm_P0.8mm",218.800000,-105.450000,-90.000000,top
-"U3","74LVC245APW","TSSOP-20_4.4x6.5mm_P0.65mm",220.775000,-124.600000,0.000000,top
+"U3","74AHC245PW","TSSOP-20_4.4x6.5mm_P0.65mm",220.775000,-124.600000,0.000000,top
 "U4","74LVC245APW","TSSOP-20_4.4x6.5mm_P0.65mm",229.975000,-124.600000,0.000000,top
-"U5","74LVC245APW","TSSOP-20_4.4x6.5mm_P0.65mm",239.175000,-124.600000,0.000000,top
+"U5","74AHC245PW","TSSOP-20_4.4x6.5mm_P0.65mm",239.175000,-124.600000,0.000000,top
 "U6","74AHCT245PW","TSSOP-20_4.4x6.5mm_P0.65mm",248.375000,-124.600000,0.000000,top
 "U7","74AHCT245PW","TSSOP-20_4.4x6.5mm_P0.65mm",257.575000,-124.600000,0.000000,top
 "U8","XC6206P332MR","SOT-23",267.650000,-110.800000,180.000000,top
diff --git a/Hardware/MAX/gerber/RAM2E-top-pos.VCORE.csv b/Hardware/MAX/gerber/RAM2E-top-pos.VCORE.csv
index d62fe67..4934ab0 100644
--- a/Hardware/MAX/gerber/RAM2E-top-pos.VCORE.csv
+++ b/Hardware/MAX/gerber/RAM2E-top-pos.VCORE.csv
@@ -43,9 +43,9 @@ Ref,Val,Package,MidX,MidY,Rotation,Side
 "R10","22k","R_0805",207.264000,-108.077000,180.000000,top
 "U1","EPM240T100","TQFP-100_14x14mm_P0.5mm",240.050000,-108.350000,-90.000000,top
 "U2","W9812G6KH-6","TSOP-II-54_22.2x10.16mm_P0.8mm",218.800000,-105.450000,-90.000000,top
-"U3","74LVC245APW","TSSOP-20_4.4x6.5mm_P0.65mm",220.775000,-124.600000,0.000000,top
+"U3","74AHC245PW","TSSOP-20_4.4x6.5mm_P0.65mm",220.775000,-124.600000,0.000000,top
 "U4","74LVC245APW","TSSOP-20_4.4x6.5mm_P0.65mm",229.975000,-124.600000,0.000000,top
-"U5","74LVC245APW","TSSOP-20_4.4x6.5mm_P0.65mm",239.175000,-124.600000,0.000000,top
+"U5","74AHC245PW","TSSOP-20_4.4x6.5mm_P0.65mm",239.175000,-124.600000,0.000000,top
 "U6","74AHCT245PW","TSSOP-20_4.4x6.5mm_P0.65mm",248.375000,-124.600000,0.000000,top
 "U7","74AHCT245PW","TSSOP-20_4.4x6.5mm_P0.65mm",257.575000,-124.600000,0.000000,top
 "U8","XC6206P332MR","SOT-23",267.650000,-110.800000,180.000000,top
diff --git a/Hardware/MAX/gerber/RAM2E-top-pos.csv b/Hardware/MAX/gerber/RAM2E-top-pos.csv
index 60194ac..f78cf31 100644
--- a/Hardware/MAX/gerber/RAM2E-top-pos.csv
+++ b/Hardware/MAX/gerber/RAM2E-top-pos.csv
@@ -44,9 +44,9 @@ Ref,Val,Package,MidX,MidY,Rotation,Side
 "R10","22k","R_0805",207.264000,-108.077000,180.000000,top
 "U1","EPM240T100","TQFP-100_14x14mm_P0.5mm",240.050000,-108.350000,-90.000000,top
 "U2","W9812G6KH-6","TSOP-II-54_22.2x10.16mm_P0.8mm",218.800000,-105.450000,-90.000000,top
-"U3","74LVC245APW","TSSOP-20_4.4x6.5mm_P0.65mm",220.775000,-124.600000,0.000000,top
+"U3","74AHC245PW","TSSOP-20_4.4x6.5mm_P0.65mm",220.775000,-124.600000,0.000000,top
 "U4","74LVC245APW","TSSOP-20_4.4x6.5mm_P0.65mm",229.975000,-124.600000,0.000000,top
-"U5","74LVC245APW","TSSOP-20_4.4x6.5mm_P0.65mm",239.175000,-124.600000,0.000000,top
+"U5","74AHC245PW","TSSOP-20_4.4x6.5mm_P0.65mm",239.175000,-124.600000,0.000000,top
 "U6","74AHCT245PW","TSSOP-20_4.4x6.5mm_P0.65mm",248.375000,-124.600000,0.000000,top
 "U7","74AHCT245PW","TSSOP-20_4.4x6.5mm_P0.65mm",257.575000,-124.600000,0.000000,top
 "U8","XC6206P332MR","SOT-23",267.650000,-110.800000,180.000000,top
diff --git a/Hardware/MAX/gerber/RAM2E.4203B.MAX-gerber.zip b/Hardware/MAX/gerber/RAM2E.4203B.MAX-gerber.zip
index a5b3774..d60bf35 100644
Binary files a/Hardware/MAX/gerber/RAM2E.4203B.MAX-gerber.zip and b/Hardware/MAX/gerber/RAM2E.4203B.MAX-gerber.zip differ