RAM2GS/Hardware/LCMXO/BOM/RAM2GS-BOM.LCMXOE.csv

Reference, Quantity, Value, Footprint, Datasheet, Notes, LCSC Part, Mfg. Part Numbers
C30 ,1,15p,stdpads:C_0603,,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred.",C1644,Samsung CL10C150JB8NNNC
C1 C2 C3 C4 C26 ,5,10u,stdpads:C_0805,,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred.",C15850,Samsung CL21A106KAYNNNE
C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C27 C28 C29 ,24,2u2,stdpads:C_0603,,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred.",C23630,Samsung CL10A225KO8NNNC
D1 ,1,Amber,stdpads:LED_0805,,Any manufacturer's part is acceptable.,,
FID1 FID2 FID3 FID4 ,4,Fiducial,stdpads:Fiducial,,DNP - SMT vision system fiducial,,
H1 H2 H4 H5 ,4, ,stdpads:PasteHole_1.152mm_NPTH,,DNP - mounting hole for solder paste printing,,
H3 ,1, ,stdpads:PasteHole_1.1mm_PTH,,DNP - mounting hole,,
J1 ,1,IIgs RAM Exp.,stdpads:AppleIIgsMemoryExpansion_Edge,,DNP - edge connector,,
J2 ,1,JTAG,Connector:Tag-Connect_TC2050-IDC-FP_2x05_P1.27mm_Vertical,,DNP - test pad connector,,
R1 R2 ,2,22k,stdpads:R_0805,,Any manufacturer's part is acceptable.,C17560,Uniroyal 0805W8F2202T5E
R4 ,1,DNP,stdpads:R_0805,,,,
R3 R5 R6 R7 ,4,47,stdpads:R_0603,,Any manufacturer's part is acceptable.,C23182,Uniroyal 0603WAF470JT5E
R8 ,1,220,stdpads:R_0805,,Any manufacturer's part is acceptable.,C17557,Uniroyal 0805W8F2200T5E
U1 ,1,LCMXO256E-TN100,stdpads:TQFP-100_14x14mm_P0.5mm,,,C1550734,"Lattice LCMXO256E-3TN100C, Lattice LCMXO256E-4TN100C, Lattice LCMXO256E-5TN100C, Lattice LCMXO256E-3TN100I, Lattice LCMXO256E-4TN100I, Lattice LCMXO640E-3TN100C, Lattice LCMXO640E-4TN100C, Lattice LCMXO640E-5TN100C, Lattice LCMXO640E-3TN100I, Lattice LCMXO640E-4TN100I"
U9 U10 ,2,74LVC1G04GW,stdpads:SOT-353,,Most 74LVC1G04 or 74AHC1G04 in SOT-353 package is acceptable.,C10237,"NXP 74LVC1G04GW, TI SN74LVC1G04DCK, NXP 74AHC1G04GW, TI SN74AHC1G04DCK"
U11 ,1,AP2127K-1.2TRG1,stdpads:SOT-23-5,,Most 1.2V regulator in SOT-23-5 package is acceptable.,C151376,"Diodes AP2127K-1.2TRG1, Torex XC6228D122VR"
U12 ,1,25F010,stdpads:SOIC-8_3.9mm,,Most SPI flash in SOIC-8 (3.9mm / 150 mil width) package is acceptable.,C2687406,"Zetta ZD25WD20BTIGT, Adesto AT25SF081-SSHD, Winbond W25X20CLSNIG"
U2 ,1,W9812G6KH-6,stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm,,Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable.,C62379,"Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G"
U3 ,1,60M,stdpads:Crystal_SMD_7050-4Pin_7.0x5.0mm_SiTime,,Most 60-62.5 MHz 3.3V crystal oscillator or silicon oscillator is acceptable. Do not use crystal resonator or ceramic resonator.,C26255,"SiTime SIT1602AI-82-33E-60.000000Y, Shenzhen SCTF S7D60.000000B20F30T, Taiten OCETGLJTNF-60MHZ"
U4 ,1,74AHCT245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,Most 74AHCT245 in TSSOP-20 package is acceptable.,C173388,"NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW"
U5 U6 U7 ,3,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW"
U8 ,1,AZ1117CH-3.3TRG1,stdpads:SOT-223,,Most 1117-type 3.3V regulator in SOT-223 package is acceptable.,C92102,"Diodes AZ1117CH-3.3TRG1, Diodes AZ1117EH-3.3TRG1"