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23 lines
3.4 KiB
Plaintext
23 lines
3.4 KiB
Plaintext
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Reference, Quantity, Value, Footprint, Datasheet, Notes, LCSC Part, Mfg. Part Numbers
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C30 ,1,15p,stdpads:C_0603,,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred.",C1644,Samsung CL10C150JB8NNNC
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C1 C2 C3 C4 C26 ,5,10u,stdpads:C_0805,,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred.",C15850,Samsung CL21A106KAYNNNE
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C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C27 C28 C29 ,24,2u2,stdpads:C_0603,,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred.",C23630,Samsung CL10A225KO8NNNC
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D1 ,1,White,stdpads:LED_0805,,Any manufacturer's part is acceptable.,C34499,Hubei Kento C34499
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FID1 FID2 FID3 FID4 ,4,Fiducial,stdpads:Fiducial,,DNP - SMT vision system fiducial,,
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H1 H2 H4 H5 ,4, ,stdpads:PasteHole_1.152mm_NPTH,,DNP - mounting hole for solder paste printing,,
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H3 ,1, ,stdpads:PasteHole_1.1mm_PTH,,DNP - mounting hole,,
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J1 ,1,IIgs RAM Exp.,stdpads:AppleIIgsMemoryExpansion_Edge,,DNP - edge connector,,
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J2 ,1,JTAG,Connector:Tag-Connect_TC2050-IDC-FP_2x05_P1.27mm_Vertical,,DNP - test pad connector,,
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R1 R2 ,2,22k,stdpads:R_0805,,Any manufacturer's part is acceptable.,C17560,Uniroyal 0805W8F2202T5E
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R4 ,1,0,stdpads:R_0805,,Any manufacturer's part is acceptable.,C17477,Uniroyal 0805W8F0000T5E
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R3 R5 R6 R7 ,4,47,stdpads:R_0603,,Any manufacturer's part is acceptable.,C23182,Uniroyal 0603WAF470JT5E
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R8 ,1,180,stdpads:R_0805,,Any manufacturer's part is acceptable.,C25270,Uniroyal 0805W8F1800T5E
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U1 ,1,LCMXO256C-TN100,stdpads:TQFP-100_14x14mm_P0.5mm,,,C1550734,"Lattice LCMXO256C-3TN100C, Lattice LCMXO256C-4TN100C, Lattice LCMXO256C-5TN100C, Lattice LCMXO256C-3TN100I, Lattice LCMXO256C-4TN100I, Lattice LCMXO640C-3TN100C, Lattice LCMXO640C-4TN100C, Lattice LCMXO640C-5TN100C, Lattice LCMXO640C-3TN100I, Lattice LCMXO640C-4TN100I"
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U9 U10 ,2,74LVC1G04GW,stdpads:SOT-353,,Most 74LVC1G04 or 74AHC1G04 in SOT-353 package is acceptable.,C10237,"NXP 74LVC1G04GW, TI SN74LVC1G04DCK, NXP 74AHC1G04GW, TI SN74AHC1G04DCK"
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U11 ,1,DNP,stdpads:SOT-23-5,,,,
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U12 ,1,25F010,stdpads:SOIC-8_3.9mm,,Most SPI flash in SOIC-8 (3.9mm / 150 mil width) package is acceptable.,C2687406,"Zetta ZD25WD20BTIGT, Adesto AT25SF081-SSHD, Winbond W25X20CLSNIG"
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U2 ,1,W9812G6KH-6,stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm,,Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable.,C62379,"Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G"
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U3 ,1,60M,stdpads:Crystal_SMD_7050-4Pin_7.0x5.0mm_SiTime,,Most 60-62.5 MHz 3.3V crystal oscillator or silicon oscillator is acceptable. Do not use crystal resonator or ceramic resonator.,C26255,"SiTime SIT1602AI-82-33E-60.000000Y, Shenzhen SCTF S7D60.000000B20F30T, Taiten OCETGLJTNF-60MHZ"
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U4 ,1,74AHCT245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,Most 74AHCT245 in TSSOP-20 package is acceptable.,C173388,"NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW"
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U5 U6 U7 ,3,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PW"
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U8 ,1,AZ1117CH-3.3TRG1,stdpads:SOT-223,,Most 1117-type 3.3V regulator in SOT-223 package is acceptable.,C92102,"Diodes AZ1117CH-3.3TRG1, Diodes AZ1117EH-3.3TRG1"
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