Generated from liron.sch by exp-lbrs.ulp Dual In Line Package >NAME >VALUE Dual In Line Package >NAME >VALUE Leadless Chip Carrier Ceramic Package >NAME >VALUE Small Outline package 150 mil >VALUE >NAME Wide Small Outline package 300 mil >VALUE >NAME .050 DIP EDGE CARD CONNECTOR SURFACE MOUNT .050 [1.27mm] CONTACT CENTERS .610" INSULATEOR HEIGHT Source: .050 DIP EDGE CARD.pdf >NAME >VALUE .050 DIP EDGE CARD CONNECTOR STAGGERED DIP SOLDER .050 [1.27mm] CONTACT CENTERS .610" INSULATEOR HEIGHT Source: .050 DIP EDGE CARD.pdf >NAME >VALUE >NAME >VALUE Dual In Line Package >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME GND VCC >VALUE >NAME >NAME >VALUE >NAME >VALUE Quad 2-input NAND gate Dual 4-input NAND gate Dual 4-input AND gate 8-input NAND gate Octal BUS TRANSCEIVER, 3-state .050 DIP EDGE CARD CONNECTOR .050 [1.27mm] CONTACT CENTERS .610" INSULATEOR HEIGHT Source: .050 DIP EDGE CARD.pdf MEMORY