Generated from <b>liron.sch</b><p> by exp-lbrs.ulp <b>Dual In Line Package</b> >NAME >VALUE <b>Dual In Line Package</b> >NAME >VALUE <b>Leadless Chip Carrier</b><p> Ceramic Package >NAME >VALUE <b>Small Outline package</b> 150 mil >VALUE >NAME <b>Wide Small Outline package</b> 300 mil >VALUE >NAME <b>Dual In Line Package</b> >NAME >VALUE <b>PIN HEADER</b> >NAME >VALUE <b>PIN HEADER</b> >NAME >VALUE <b>UNSH HEADER</b> 2.0mm VERTICAL TMT<p> Source: https://portal.fciconnect.com/res/en/pdffiles/doc_search/57102.pdf >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME >VALUE >NAME GND VCC >NAME >VALUE >NAME >VALUE >NAME >VALUE Quad 2-input <b>NAND</b> gate Dual 4-input <b>NAND</b> gate Dual 4-input <b>AND</b> gate 8-input <b>NAND</b> gate Octal <b>BUS TRANSCEIVER</b>, 3-state <b>MEMORY</b> <b>PIN HEADER</b>