380 lines
20 KiB
Plaintext
380 lines
20 KiB
Plaintext
(kicad_pcb (version 20171130) (host pcbnew "(5.1.5-0-10_14)")
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(general
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(thickness 1.6)
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(drawings 20)
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(tracks 0)
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(zones 0)
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(modules 4)
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(nets 1)
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)
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(page USLetter)
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(layers
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(0 F.Cu signal)
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(1 In1.Cu signal)
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(2 In2.Cu signal)
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(31 B.Cu signal)
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(32 B.Adhes user)
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(33 F.Adhes user)
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(34 B.Paste user)
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(35 F.Paste user)
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(36 B.SilkS user)
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(37 F.SilkS user)
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(38 B.Mask user)
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(39 F.Mask user)
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(40 Dwgs.User user)
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(41 Cmts.User user)
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(42 Eco1.User user)
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(43 Eco2.User user)
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(44 Edge.Cuts user)
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(45 Margin user)
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(46 B.CrtYd user)
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(47 F.CrtYd user)
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(48 B.Fab user)
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(49 F.Fab user)
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)
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(setup
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(last_trace_width 0.15)
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(user_trace_width 0.2)
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(user_trace_width 0.25)
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(user_trace_width 0.3)
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(user_trace_width 0.35)
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(user_trace_width 0.4)
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(user_trace_width 0.45)
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(user_trace_width 0.5)
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(user_trace_width 0.6)
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(user_trace_width 0.8)
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(user_trace_width 1)
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(user_trace_width 1.27)
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(user_trace_width 1.524)
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(trace_clearance 0.15)
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(zone_clearance 0.15)
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(zone_45_only no)
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(trace_min 0.15)
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(via_size 0.5)
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(via_drill 0.2)
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(via_min_size 0.5)
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(via_min_drill 0.2)
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(user_via 0.6 0.3)
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(user_via 0.8 0.4)
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(user_via 1 0.5)
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(user_via 1.524 0.762)
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(uvia_size 0.3)
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(uvia_drill 0.1)
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(uvias_allowed no)
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(uvia_min_size 0.2)
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(uvia_min_drill 0.1)
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(edge_width 0.15)
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(segment_width 0.1524)
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(pcb_text_width 0.3)
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(pcb_text_size 1.5 1.5)
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(mod_edge_width 0.15)
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(mod_text_size 1 1)
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(mod_text_width 0.15)
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(pad_size 0.85 1.4)
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(pad_drill 0)
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(pad_to_mask_clearance 0.05)
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(solder_mask_min_width 0.1)
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(pad_to_paste_clearance -0.0381)
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(aux_axis_origin 0 0)
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(visible_elements FFFFFF7F)
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(pcbplotparams
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(layerselection 0x010f8_ffffffff)
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(usegerberextensions true)
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(usegerberattributes false)
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(usegerberadvancedattributes false)
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(creategerberjobfile false)
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(excludeedgelayer true)
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(linewidth 0.100000)
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(plotframeref false)
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(viasonmask false)
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(mode 1)
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(useauxorigin false)
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(hpglpennumber 1)
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(hpglpenspeed 20)
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(hpglpendiameter 15.000000)
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(psnegative false)
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(psa4output false)
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(plotreference true)
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(plotvalue true)
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(plotinvisibletext false)
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(padsonsilk false)
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(subtractmaskfromsilk true)
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(outputformat 1)
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(mirror false)
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(drillshape 0)
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(scaleselection 1)
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(outputdirectory "gerber/"))
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)
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(net 0 "")
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(net_class Default "This is the default net class."
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(clearance 0.15)
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(trace_width 0.15)
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(via_dia 0.5)
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(via_drill 0.2)
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(uvia_dia 0.3)
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(uvia_drill 0.1)
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)
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(module stdpads:SOIC-16_3.9mm (layer F.Cu) (tedit 5FDA018C) (tstamp 601BEDD6)
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(at 124.079 115.6716)
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(descr "SOIC, 16 Pin (JEDEC MS-012AC, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_16.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py")
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(tags "SOIC SO")
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(solder_mask_margin 0.05)
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(solder_paste_margin -0.025)
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(attr smd)
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(fp_text reference REF** (at 0 0 180) (layer F.Fab)
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(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
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)
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(fp_text value SOIC-16_3.9mm (at 0 1.016 180) (layer F.Fab)
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(effects (font (size 0.508 0.508) (thickness 0.127)))
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)
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(fp_line (start 5.06 0) (end 5.06 -1.95) (layer F.SilkS) (width 0.12))
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(fp_line (start 5.06 0) (end 5.06 1.95) (layer F.SilkS) (width 0.12))
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(fp_line (start -5.06 0) (end -5.06 -1.95) (layer F.SilkS) (width 0.12))
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(fp_line (start -5.06 0) (end -5.06 3.45) (layer F.SilkS) (width 0.12))
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(fp_line (start -4.95 0.975) (end -4.95 -1.95) (layer F.Fab) (width 0.1))
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(fp_line (start -4.95 -1.95) (end 4.95 -1.95) (layer F.Fab) (width 0.1))
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(fp_line (start 4.95 -1.95) (end 4.95 1.95) (layer F.Fab) (width 0.1))
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(fp_line (start 4.95 1.95) (end -3.975 1.95) (layer F.Fab) (width 0.1))
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(fp_line (start -3.975 1.95) (end -4.95 0.975) (layer F.Fab) (width 0.1))
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(fp_line (start -5.2 3.7) (end 5.2 3.7) (layer F.CrtYd) (width 0.05))
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(fp_line (start 5.2 3.7) (end 5.2 -3.7) (layer F.CrtYd) (width 0.05))
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(fp_line (start 5.2 -3.7) (end -5.2 -3.7) (layer F.CrtYd) (width 0.05))
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(fp_line (start -5.2 -3.7) (end -5.2 3.7) (layer F.CrtYd) (width 0.05))
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(fp_text user %R (at 0 0 180) (layer F.SilkS)
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(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
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)
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(pad 1 smd roundrect (at -4.445 2.475 90) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 2 smd roundrect (at -3.175 2.475 90) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 3 smd roundrect (at -1.905 2.475 90) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 4 smd roundrect (at -0.635 2.475 90) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 5 smd roundrect (at 0.635 2.475 90) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 6 smd roundrect (at 1.905 2.475 90) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 7 smd roundrect (at 3.175 2.475 90) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 8 smd roundrect (at 4.445 2.475 90) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 9 smd roundrect (at 4.445 -2.475 90) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 10 smd roundrect (at 3.175 -2.475 90) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 11 smd roundrect (at 1.905 -2.475 90) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 12 smd roundrect (at 0.635 -2.475 90) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 13 smd roundrect (at -0.635 -2.475 90) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 14 smd roundrect (at -1.905 -2.475 90) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 15 smd roundrect (at -3.175 -2.475 90) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 16 smd roundrect (at -4.445 -2.475 90) (size 1.95 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(model ${KISYS3DMOD}/Package_SO.3dshapes/SOIC-16_3.9x9.9mm_P1.27mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 -90))
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)
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)
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(module stdpads:USB_Micro-B_Amphenol_10118192-0001 (layer F.Cu) (tedit 5F027735) (tstamp 601BE61C)
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(at 106.8578 108.6612 270)
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(descr "Micro USB B receptable with flange, bottom-mount, SMD, right-angle (http://www.molex.com/pdm_docs/sd/473460001_sd.pdf)")
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(tags "Micro B USB SMD")
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(solder_mask_margin 0.05)
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(solder_paste_margin -0.025)
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(attr smd)
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(fp_text reference REF** (at 0 0) (layer F.Fab)
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(effects (font (size 0.508 0.508) (thickness 0.127)))
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)
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(fp_text value USB_Micro-B_Amphenol_10118192-0001 (at 0 3.302 270) (layer F.Fab)
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(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
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)
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(fp_text user "PCB Edge" (at 0 1.47 270) (layer Dwgs.User)
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(effects (font (size 0.4 0.4) (thickness 0.04)))
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)
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(fp_text user %R (at 0 -4.45 270) (layer F.SilkS)
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(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
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)
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(fp_line (start 5 2.7) (end -5 2.7) (layer F.CrtYd) (width 0.05))
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(fp_line (start 5 -3.9) (end 5 2.7) (layer F.CrtYd) (width 0.05))
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(fp_line (start -5 -3.9) (end 5 -3.9) (layer F.CrtYd) (width 0.05))
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(fp_line (start -5 2.7) (end -5 -3.9) (layer F.CrtYd) (width 0.05))
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(fp_line (start 3.95 2.2) (end -3.95 2.2) (layer F.Fab) (width 0.1))
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(fp_line (start 3.95 -3.35) (end 3.95 2.2) (layer F.Fab) (width 0.1))
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(fp_line (start -3.95 -3.35) (end 3.95 -3.35) (layer F.Fab) (width 0.1))
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(fp_line (start -3.95 2.2) (end -3.95 -3.35) (layer F.Fab) (width 0.1))
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(fp_line (start -3.25 1.45) (end 3.25 1.45) (layer F.Fab) (width 0.1))
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(pad 1 smd roundrect (at -1.3 -2.675 270) (size 0.4 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
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(solder_mask_margin 0.04) (solder_paste_margin -0.04))
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(pad 2 smd roundrect (at -0.65 -2.675 270) (size 0.4 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
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(solder_mask_margin 0.04) (solder_paste_margin -0.04))
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(pad 3 smd roundrect (at 0 -2.675 270) (size 0.4 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
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(solder_mask_margin 0.04) (solder_paste_margin -0.04))
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(pad 4 smd roundrect (at 0.65 -2.675 270) (size 0.4 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
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(solder_mask_margin 0.04) (solder_paste_margin -0.04))
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(pad 5 smd roundrect (at 1.3 -2.675 270) (size 0.4 1.35) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
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(solder_mask_margin 0.04) (solder_paste_margin -0.05))
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(pad 6 smd roundrect (at -3.1 -2.55 270) (size 2.1 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 6 smd roundrect (at 3.1 -2.55 270) (size 2.1 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 6 smd roundrect (at -3.8 0 270) (size 1.8 1.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 6 smd roundrect (at 3.8 0 270) (size 1.8 1.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 6 smd roundrect (at -1.2 0 270) (size 1.9 1.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 6 smd roundrect (at 1.2 0 270) (size 1.9 1.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(model ${KISYS3DMOD}/Connector_USB.3dshapes/USB_Micro-B_Molex_47346-0001.wrl
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(offset (xyz 0 1.5 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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(module stdpads:MD-40 (layer F.Cu) (tedit 601B7899) (tstamp 601BDE5F)
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(at 104.3178 93.7514 90)
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(fp_text reference REF** (at 0 8.5 90) (layer F.Fab)
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(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
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)
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(fp_text value MD-40 (at 0 -0.8 90) (layer F.Fab)
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(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
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)
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(fp_line (start 9 0) (end -9 0) (layer F.CrtYd) (width 0.12))
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(fp_line (start 9 14) (end 9 0) (layer F.CrtYd) (width 0.12))
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(fp_line (start -9 14) (end 9 14) (layer F.CrtYd) (width 0.12))
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(fp_line (start -9 0) (end -9 14) (layer F.CrtYd) (width 0.12))
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(fp_line (start -7 13) (end 7 13) (layer F.Fab) (width 0.4))
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(fp_line (start 7 0) (end 7 13) (layer F.Fab) (width 0.4))
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(fp_line (start -7 0) (end -7 13) (layer F.Fab) (width 0.4))
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(fp_text user %R (at 0 8.5 90) (layer F.SilkS)
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(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
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)
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(fp_line (start -7 0) (end 7 0) (layer F.Fab) (width 0.4))
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(pad 3 thru_hole circle (at -3.4 11 90) (size 1.8 1.8) (drill 1) (layers *.Cu *.Mask))
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(pad 4 thru_hole circle (at 3.4 11 90) (size 1.8 1.8) (drill 1) (layers *.Cu *.Mask))
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(pad 2 thru_hole circle (at 3.4 8.5 90) (size 1.8 1.8) (drill 1) (layers *.Cu *.Mask))
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(pad 1 thru_hole circle (at -3.4 8.5 90) (size 1.8 1.8) (drill 1) (layers *.Cu *.Mask))
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(pad 5 thru_hole circle (at 6.75 5.5 90) (size 4 4) (drill 2.3) (layers *.Cu *.Mask))
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(pad 5 thru_hole circle (at -6.75 5.5 90) (size 4 4) (drill 2.3) (layers *.Cu *.Mask))
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(pad 5 thru_hole circle (at 0 4.7 90) (size 4 4) (drill 2.3) (layers *.Cu *.Mask))
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(model "$(KIPRJMOD)/../stdpads.3dshapes/MiniDIN-8.wrl"
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(offset (xyz 0 -6.5 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 180))
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)
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)
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(module stdpads:ESP32-WROOM-32 (layer F.Cu) (tedit 5EE2A0E8) (tstamp 601BD83D)
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(at 153.289 97.028 270)
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(solder_mask_margin 0.05)
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(solder_paste_margin -0.025)
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(attr smd)
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(fp_text reference REF** (at 0 0 90) (layer F.Fab)
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(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
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)
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(fp_text value ESP32-WROOM-32 (at 0 1.5 90) (layer F.Fab) hide
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(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
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)
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(fp_text user %R (at 0 0 90) (layer F.SilkS)
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(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
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)
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(fp_line (start 9.1 18.11) (end 6.4 18.11) (layer F.SilkS) (width 0.2032))
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(fp_line (start 9 -7.49) (end -9 -7.49) (layer F.Fab) (width 0.05))
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(fp_line (start 9 18.01) (end 9 -7.49) (layer F.Fab) (width 0.05))
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(fp_line (start -9 18.01) (end 9 18.01) (layer F.Fab) (width 0.05))
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(fp_line (start -9 -7.49) (end -9 18.01) (layer F.Fab) (width 0.05))
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(fp_line (start -9.1 -1.14) (end 9.1 -1.14) (layer F.SilkS) (width 0.2032))
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(fp_line (start -9.1 18.11) (end -9.1 17.19) (layer F.SilkS) (width 0.2032))
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(fp_line (start -9.1 -0.65) (end -9.1 -7.49) (layer F.SilkS) (width 0.2032))
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(fp_line (start 9.1 -0.65) (end 9.1 -7.49) (layer F.SilkS) (width 0.2032))
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(fp_line (start -9 -1.14) (end 9 -1.14) (layer F.Fab) (width 0.05))
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(fp_line (start 9.1 18.11) (end 9.1 17.19) (layer F.SilkS) (width 0.2032))
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(fp_line (start -6.4 18.11) (end -9.1 18.11) (layer F.SilkS) (width 0.2032))
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(pad 39 smd rect (at -1 7.53 270) (size 1.5 1.5) (layers F.Cu F.Paste F.Mask)
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(zone_connect 2))
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(pad 39 smd rect (at 1.159 7.53 270) (size 0.5 3) (layers F.Cu F.Paste F.Mask)
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(zone_connect 2))
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(pad 39 smd rect (at -1 9.562 270) (size 3 0.5) (layers F.Cu F.Paste F.Mask)
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(zone_connect 2))
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(pad 39 smd rect (at -3.032 7.53 270) (size 0.5 3) (layers F.Cu F.Paste F.Mask)
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(zone_connect 2))
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(pad 39 smd rect (at -1 5.498 270) (size 3 0.5) (layers F.Cu F.Paste F.Mask)
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(zone_connect 2))
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(pad 39 thru_hole circle (at -1 6.403 270) (size 0.8 0.8) (drill 0.3) (layers *.Cu F.Mask)
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(zone_connect 2))
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(pad 39 thru_hole circle (at -1 8.657 270) (size 0.8 0.8) (drill 0.3) (layers *.Cu F.Mask)
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(zone_connect 2))
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(pad 39 thru_hole circle (at 0.127 8.657 270) (size 0.8 0.8) (drill 0.3) (layers *.Cu F.Mask)
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(zone_connect 2))
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(pad 39 thru_hole circle (at 0.127 7.53 270) (size 0.8 0.8) (drill 0.3) (layers *.Cu F.Mask)
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(zone_connect 2))
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