51 lines
3.1 KiB
Plaintext
51 lines
3.1 KiB
Plaintext
(module TSSOP-20_4.4x6.5mm_P0.65mm_ForSeeedStudio (layer F.Cu) (tedit 613DC505)
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(descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
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(tags "SSOP 0.65")
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(attr smd)
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(fp_text reference REF** (at 0 -4.3) (layer F.SilkS)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_text value TSSOP-20_4.4x6.5mm_P0.65mm_ForSeeedStudio (at 0 4.3) (layer F.Fab)
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(effects (font (size 1 1) (thickness 0.15)))
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)
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(fp_line (start -1.2 -3.25) (end 2.2 -3.25) (layer F.Fab) (width 0.15))
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(fp_line (start 2.2 -3.25) (end 2.2 3.25) (layer F.Fab) (width 0.15))
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(fp_line (start 2.2 3.25) (end -2.2 3.25) (layer F.Fab) (width 0.15))
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(fp_line (start -2.2 3.25) (end -2.2 -2.25) (layer F.Fab) (width 0.15))
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(fp_line (start -2.2 -2.25) (end -1.2 -3.25) (layer F.Fab) (width 0.15))
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(fp_line (start -3.95 -3.55) (end -3.95 3.55) (layer F.CrtYd) (width 0.05))
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(fp_line (start 3.95 -3.55) (end 3.95 3.55) (layer F.CrtYd) (width 0.05))
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(fp_line (start -3.95 -3.55) (end 3.95 -3.55) (layer F.CrtYd) (width 0.05))
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(fp_line (start -3.95 3.55) (end 3.95 3.55) (layer F.CrtYd) (width 0.05))
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(fp_line (start -2.225 3.45) (end 2.225 3.45) (layer F.SilkS) (width 0.15))
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(fp_line (start -3.75 -3.45) (end 2.225 -3.45) (layer F.SilkS) (width 0.15))
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(fp_text user %R (at 0 0) (layer F.Fab)
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(effects (font (size 0.8 0.8) (thickness 0.15)))
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)
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(pad 1 smd rect (at -2.8 -2.925) (size 1.55 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 2 smd rect (at -2.8 -2.275) (size 1.55 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 3 smd rect (at -2.8 -1.625) (size 1.55 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 4 smd rect (at -2.8 -0.975) (size 1.55 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 5 smd rect (at -2.8 -0.325) (size 1.55 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 6 smd rect (at -2.8 0.325) (size 1.55 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 7 smd rect (at -2.8 0.975) (size 1.55 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 8 smd rect (at -2.8 1.625) (size 1.55 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 9 smd rect (at -2.8 2.275) (size 1.55 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 10 smd rect (at -2.8 2.925) (size 1.55 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 11 smd rect (at 2.8 2.925) (size 1.55 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 12 smd rect (at 2.8 2.275) (size 1.55 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 13 smd rect (at 2.8 1.625) (size 1.55 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 14 smd rect (at 2.8 0.975) (size 1.55 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 15 smd rect (at 2.8 0.325) (size 1.55 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 16 smd rect (at 2.8 -0.325) (size 1.55 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 17 smd rect (at 2.8 -0.975) (size 1.55 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 18 smd rect (at 2.8 -1.625) (size 1.55 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 19 smd rect (at 2.8 -2.275) (size 1.55 0.45) (layers F.Cu F.Paste F.Mask))
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(pad 20 smd rect (at 2.8 -2.925) (size 1.55 0.45) (layers F.Cu F.Paste F.Mask))
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(model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-20_4.4x6.5mm_P0.65mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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