166 lines
3.5 KiB
Plaintext
166 lines
3.5 KiB
Plaintext
{
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"Header": {
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"GenerationSoftware": {
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"Vendor": "KiCad",
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"Application": "Pcbnew",
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"Version": "7.0.10"
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},
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"CreationDate": "2024-04-24T04:09:26-04:00"
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},
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"GeneralSpecs": {
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"ProjectId": {
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"Name": "WarpSE",
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"GUID": "57617270-5345-42e6-9b69-6361645f7063",
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"Revision": "1.0"
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},
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"Size": {
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"X": 109.243,
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"Y": 102.258
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},
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"LayerNumber": 4,
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"BoardThickness": 1.6108,
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"Finish": "None"
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},
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"DesignRules": [
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{
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"Layers": "Outer",
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"PadToPad": 0.15,
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"PadToTrack": 0.15,
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"TrackToTrack": 0.15,
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"MinLineWidth": 0.15,
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"TrackToRegion": 0.15,
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"RegionToRegion": 0.15
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},
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{
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"Layers": "Inner",
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"PadToPad": 0.15,
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"PadToTrack": 0.15,
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"TrackToTrack": 0.15,
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"MinLineWidth": 0.8,
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"TrackToRegion": 0.15,
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"RegionToRegion": 0.15
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}
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],
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"FilesAttributes": [
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{
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"Path": "WarpSE-F_Cu.gtl",
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"FileFunction": "Copper,L1,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "WarpSE-In1_Cu.g2",
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"FileFunction": "Copper,L2,Inr",
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"FilePolarity": "Positive"
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},
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{
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"Path": "WarpSE-In2_Cu.g3",
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"FileFunction": "Copper,L3,Inr",
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"FilePolarity": "Positive"
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},
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{
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"Path": "WarpSE-B_Cu.gbl",
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"FileFunction": "Copper,L4,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "WarpSE-F_Paste.gtp",
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"FileFunction": "SolderPaste,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "WarpSE-F_Silkscreen.gto",
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"FileFunction": "Legend,Top",
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"FilePolarity": "Positive"
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},
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{
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"Path": "WarpSE-B_Silkscreen.gbo",
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"FileFunction": "Legend,Bot",
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"FilePolarity": "Positive"
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},
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{
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"Path": "WarpSE-F_Mask.gts",
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"FileFunction": "SolderMask,Top",
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"FilePolarity": "Negative"
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},
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{
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"Path": "WarpSE-B_Mask.gbs",
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"FileFunction": "SolderMask,Bot",
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"FilePolarity": "Negative"
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},
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{
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"Path": "WarpSE-Edge_Cuts.gm1",
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"FileFunction": "Profile",
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"FilePolarity": "Positive"
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}
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],
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"MaterialStackup": [
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{
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"Type": "Legend",
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"Name": "Top Silk Screen"
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},
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{
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"Type": "SolderPaste",
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"Name": "Top Solder Paste"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Top Solder Mask"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "F.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 0.2104,
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"Material": "FR4",
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"Name": "F.Cu/In1.Cu",
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"Notes": "Type: dielectric layer 1 (from F.Cu to In1.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.0175,
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"Name": "In1.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 1.065,
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"Material": "FR4",
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"Name": "In1.Cu/In2.Cu",
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"Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.0175,
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"Name": "In2.Cu"
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},
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{
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"Type": "Dielectric",
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"Thickness": 0.2104,
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"Material": "FR4",
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"Name": "In2.Cu/B.Cu",
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"Notes": "Type: dielectric layer 3 (from In2.Cu to B.Cu)"
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},
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{
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"Type": "Copper",
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"Thickness": 0.035,
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"Name": "B.Cu"
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},
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{
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"Type": "SolderMask",
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"Thickness": 0.01,
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"Name": "Bottom Solder Mask"
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},
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{
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"Type": "SolderPaste",
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"Name": "Bottom Solder Paste"
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},
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{
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"Type": "Legend",
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"Name": "Bottom Silk Screen"
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}
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]
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}
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