stdpads.pretty/TSOP-I-32_18.4x8mm_P0.5mm.kicad_mod

(module TSOP-I-32_18.4x8mm_P0.5mm (layer F.Cu) (tedit 5F599AB1)
  (descr "TSOP I, 32 pins, 18.4x8mm body (https://www.micron.com/~/media/documents/products/technical-note/nor-flash/tn1225_land_pad_design.pdf, http://www.fujitsu.com/downloads/MICRO/fma/pdfmcu/f32pm25.pdf)")
  (tags "TSOP I 32")
  (solder_mask_margin 0.024)
  (solder_paste_margin -0.035)
  (attr smd)
  (fp_text reference REF** (at 0 0) (layer F.Fab)
    (effects (font (size 0.8128 0.8128) (thickness 0.2032)))
  )
  (fp_text value TSOP-I-32_18.4x8mm_P0.5mm (at 0 1.25) (layer F.Fab)
    (effects (font (size 0.8128 0.8128) (thickness 0.2032)))
  )
  (fp_line (start -10.55 4.25) (end -10.55 -4.25) (layer F.CrtYd) (width 0.05))
  (fp_line (start 10.55 4.25) (end -10.55 4.25) (layer F.CrtYd) (width 0.05))
  (fp_line (start 10.55 -4.25) (end 10.55 4.25) (layer F.CrtYd) (width 0.05))
  (fp_line (start -10.55 -4.25) (end 10.55 -4.25) (layer F.CrtYd) (width 0.05))
  (fp_line (start -9.2 4.12) (end 9.2 4.12) (layer F.SilkS) (width 0.12))
  (fp_line (start 9.2 -4.12) (end -10.2 -4.12) (layer F.SilkS) (width 0.1))
  (fp_line (start -8.2 -4) (end -9.2 -3) (layer F.Fab) (width 0.1))
  (fp_text user %R (at 0 0) (layer F.SilkS)
    (effects (font (size 0.8128 0.8128) (thickness 0.2032)))
  )
  (fp_line (start 9.2 -4) (end 9.2 4) (layer F.Fab) (width 0.1))
  (fp_line (start 9.2 4) (end -9.2 4) (layer F.Fab) (width 0.1))
  (fp_line (start -9.2 4) (end -9.2 -3) (layer F.Fab) (width 0.1))
  (fp_line (start -8.2 -4) (end 9.2 -4) (layer F.Fab) (width 0.1))
  (pad 1 smd roundrect (at -9.75 -3.75) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 17 smd roundrect (at 9.75 3.75) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 2 smd roundrect (at -9.75 -3.25) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 3 smd roundrect (at -9.75 -2.75) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 4 smd roundrect (at -9.75 -2.25) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 5 smd roundrect (at -9.75 -1.75) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 6 smd roundrect (at -9.75 -1.25) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 7 smd roundrect (at -9.75 -0.75) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 8 smd roundrect (at -9.75 -0.25) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 9 smd roundrect (at -9.75 0.25) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 10 smd roundrect (at -9.75 0.75) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 11 smd roundrect (at -9.75 1.25) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 12 smd roundrect (at -9.75 1.75) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 13 smd roundrect (at -9.75 2.25) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 14 smd roundrect (at -9.75 2.75) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 15 smd roundrect (at -9.75 3.25) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 16 smd roundrect (at -9.75 3.75) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 18 smd roundrect (at 9.75 3.25) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 19 smd roundrect (at 9.75 2.75) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 20 smd roundrect (at 9.75 2.25) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 21 smd roundrect (at 9.75 1.75) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 22 smd roundrect (at 9.75 1.25) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 23 smd roundrect (at 9.75 0.75) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 24 smd roundrect (at 9.75 0.25) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 25 smd roundrect (at 9.75 -0.25) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 26 smd roundrect (at 9.75 -0.75) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 27 smd roundrect (at 9.75 -1.25) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 28 smd roundrect (at 9.75 -1.75) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 29 smd roundrect (at 9.75 -2.25) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 30 smd roundrect (at 9.75 -2.75) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 31 smd roundrect (at 9.75 -3.25) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 32 smd roundrect (at 9.75 -3.75) (size 1.1 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (model ${KISYS3DMOD}/Package_SO.3dshapes/TSOP-I-32_18.4x8mm_P0.5mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)