diff --git a/SODIMM_DDR3_EDGE.kicad_mod b/SODIMM_DDR3_EDGE.kicad_mod new file mode 100644 index 0000000..8cfbae2 --- /dev/null +++ b/SODIMM_DDR3_EDGE.kicad_mod @@ -0,0 +1,214 @@ +(module SODIMM_DDR3_EDGE (layer F.Cu) (tedit 5ACAB8A1) + (fp_text reference REF** (at 8.5 -6) (layer F.SilkS) + (effects (font (size 1 1) (thickness 0.15))) + ) + (fp_text value "SODIMM DDR3 EDGE" (at 9.5 1) (layer F.Fab) + (effects (font (size 1 1) (thickness 0.15))) + ) + (pad 1 smd rect (at 2.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 2 smd rect (at 2.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 3 smd rect (at 2.75 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 4 smd rect (at 3.05 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 5 smd rect (at 3.35 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 6 smd rect (at 3.65 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 7 smd rect (at 3.95 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 8 smd rect (at 4.25 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 9 smd rect (at 4.55 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 10 smd rect (at 4.85 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 11 smd rect (at 5.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 12 smd rect (at 5.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 13 smd rect (at 5.75 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 14 smd rect (at 6.05 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 15 smd rect (at 6.35 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 16 smd rect (at 6.65 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 17 smd rect (at 6.95 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 18 smd rect (at 7.25 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 19 smd rect (at 7.55 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 20 smd rect (at 7.85 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 21 smd rect (at 8.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 22 smd rect (at 8.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 23 smd rect (at 8.75 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 24 smd rect (at 9.05 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 25 smd rect (at 9.35 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 26 smd rect (at 9.65 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 27 smd rect (at 9.95 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 28 smd rect (at 10.25 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 29 smd rect (at 10.55 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 30 smd rect (at 10.85 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 31 smd rect (at 11.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 32 smd rect (at 11.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 33 smd rect (at 11.75 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 34 smd rect (at 12.05 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 35 smd rect (at 12.35 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 36 smd rect (at 12.65 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 37 smd rect (at 12.95 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 38 smd rect (at 13.25 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 39 smd rect (at 13.55 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 40 smd rect (at 13.85 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 41 smd rect (at 14.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 42 smd rect (at 14.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 43 smd rect (at 14.75 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 44 smd rect (at 15.05 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 45 smd rect (at 15.35 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 46 smd rect (at 15.65 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 47 smd rect (at 15.95 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 48 smd rect (at 16.25 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 49 smd rect (at 16.55 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 50 smd rect (at 16.85 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 51 smd rect (at 17.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 52 smd rect (at 17.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 53 smd rect (at 17.75 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 54 smd rect (at 18.05 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 55 smd rect (at 18.35 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 56 smd rect (at 18.65 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 57 smd rect (at 18.95 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 58 smd rect (at 19.25 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 59 smd rect (at 19.55 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 60 smd rect (at 19.85 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 61 smd rect (at 20.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 62 smd rect (at 20.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 63 smd rect (at 20.75 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 64 smd rect (at 21.05 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 65 smd rect (at 21.35 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 66 smd rect (at 21.65 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 67 smd rect (at 21.95 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 68 smd rect (at 22.25 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 69 smd rect (at 22.55 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 70 smd rect (at 22.85 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 71 smd rect (at 23.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 72 smd rect (at 23.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 73 smd rect (at 26.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 74 smd rect (at 26.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 75 smd rect (at 26.75 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 76 smd rect (at 27.05 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 77 smd rect (at 27.35 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 78 smd rect (at 27.65 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 79 smd rect (at 27.95 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 80 smd rect (at 28.25 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 81 smd rect (at 28.55 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 82 smd rect (at 28.85 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 83 smd rect (at 29.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 84 smd rect (at 29.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 85 smd rect (at 29.75 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 86 smd rect (at 30.05 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 87 smd rect (at 30.35 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 88 smd rect (at 30.65 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 89 smd rect (at 30.95 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 90 smd rect (at 31.25 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 91 smd rect (at 31.55 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 92 smd rect (at 31.85 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 93 smd rect (at 32.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 94 smd rect (at 32.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 95 smd rect (at 32.75 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 96 smd rect (at 33.05 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 97 smd rect (at 33.35 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 98 smd rect (at 33.65 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 99 smd rect (at 33.95 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 100 smd rect (at 34.25 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 101 smd rect (at 34.55 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 102 smd rect (at 34.85 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 103 smd rect (at 35.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 104 smd rect (at 35.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 105 smd rect (at 35.75 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 106 smd rect (at 36.05 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 107 smd rect (at 36.35 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 108 smd rect (at 36.65 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 109 smd rect (at 36.95 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 110 smd rect (at 37.25 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 111 smd rect (at 37.55 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 112 smd rect (at 37.85 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 113 smd rect (at 38.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 114 smd rect (at 38.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 115 smd rect (at 38.75 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 116 smd rect (at 39.05 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 117 smd rect (at 39.35 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 118 smd rect (at 39.65 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 119 smd rect (at 39.95 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 120 smd rect (at 40.25 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 121 smd rect (at 40.55 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 122 smd rect (at 40.85 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 123 smd rect (at 41.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 124 smd rect (at 41.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 125 smd rect (at 41.75 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 126 smd rect (at 42.05 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 127 smd rect (at 42.35 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 128 smd rect (at 42.65 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 129 smd rect (at 42.95 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 130 smd rect (at 43.25 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 131 smd rect (at 43.55 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 132 smd rect (at 43.85 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 133 smd rect (at 44.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 134 smd rect (at 44.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 135 smd rect (at 44.75 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 136 smd rect (at 45.05 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 137 smd rect (at 45.35 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 138 smd rect (at 45.65 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 139 smd rect (at 45.95 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 140 smd rect (at 46.25 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 141 smd rect (at 46.55 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 142 smd rect (at 46.85 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 143 smd rect (at 47.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 144 smd rect (at 47.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 145 smd rect (at 47.75 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 146 smd rect (at 48.05 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 147 smd rect (at 48.35 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 148 smd rect (at 48.65 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 149 smd rect (at 48.95 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 150 smd rect (at 49.25 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 151 smd rect (at 49.55 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 152 smd rect (at 49.85 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 153 smd rect (at 50.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 154 smd rect (at 50.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 155 smd rect (at 50.75 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 156 smd rect (at 51.05 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 157 smd rect (at 51.35 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 158 smd rect (at 51.65 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 159 smd rect (at 51.95 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 160 smd rect (at 52.25 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 161 smd rect (at 52.55 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 162 smd rect (at 52.85 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 163 smd rect (at 53.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 164 smd rect (at 53.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 165 smd rect (at 53.75 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 166 smd rect (at 54.05 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 167 smd rect (at 54.35 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 168 smd rect (at 54.65 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 169 smd rect (at 54.95 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 170 smd rect (at 55.25 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 171 smd rect (at 55.55 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 172 smd rect (at 55.85 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 173 smd rect (at 56.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 174 smd rect (at 56.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 175 smd rect (at 56.75 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 176 smd rect (at 57.05 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 177 smd rect (at 57.35 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 178 smd rect (at 57.65 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 179 smd rect (at 57.95 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 180 smd rect (at 58.25 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 181 smd rect (at 58.55 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 182 smd rect (at 58.85 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 183 smd rect (at 59.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 184 smd rect (at 59.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 185 smd rect (at 59.75 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 186 smd rect (at 60.05 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 187 smd rect (at 60.35 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 188 smd rect (at 60.65 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 189 smd rect (at 60.95 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 190 smd rect (at 61.25 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 191 smd rect (at 61.55 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 192 smd rect (at 61.85 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 193 smd rect (at 62.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 194 smd rect (at 62.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 195 smd rect (at 62.75 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 196 smd rect (at 63.05 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 197 smd rect (at 63.35 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 198 smd rect (at 63.65 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 199 smd rect (at 63.95 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 200 smd rect (at 64.25 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 201 smd rect (at 64.55 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 202 smd rect (at 64.85 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad 203 smd rect (at 65.15 -1.3) (size 0.45 2.5) (layers F.Cu F.Mask)) + (pad 204 smd rect (at 65.45 -1.3) (size 0.45 2.5) (layers B.Cu B.Mask)) + (pad "" np_thru_hole circle (at 2 -6) (size 1.8 1.8) (drill 1.8) (layers *.Cu *.Mask)) + (pad "" np_thru_hole circle (at 65.6 -6) (size 1.8 1.8) (drill 1.8) (layers *.Cu *.Mask)) +)