This commit is contained in:
Zane Kaminski 2018-08-21 09:33:10 -04:00
parent 79377910cb
commit 76abef400c
15 changed files with 4 additions and 8 deletions

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@ -1,4 +1,4 @@
(module primarypoints:BelFuse_1210 (layer F.Cu) (tedit 5A149C36)
(module stdpads:BelFuse_1210 (layer F.Cu) (tedit 5A149C36)
(fp_text reference REF** (at 0 -1.95) (layer F.SilkS)
(effects (font (size 0.508 0.508) (thickness 0.127)))
)

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@ -1,6 +1,4 @@
(module stdpads:Diodes_SOT-363_SC-88_419B (layer F.Cu) (tedit 59E78FAD)
(descr SOT-363)
(tags SOT-363)
(module stdpads:Diodes_SOT363 (layer F.Cu) (tedit 59E78FAD)
(attr smd)
(fp_text reference REF** (at 0 -1.75) (layer F.SilkS)
(effects (font (size 0.508 0.508) (thickness 0.127)))

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@ -1,11 +1,9 @@
(module stdpads:Semtech_QFN-16-1EP_3x3mm_Pitch0.5mm_ThermalVias_RearPad (layer F.Cu) (tedit 5B05C773)
(descr "16-Lead Plastic Quad Flat, No Lead Package (NG) - 3x3x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "QFN 0.5")
(module stdpads:Semtech_QFN-16-1EP_3x3mm (layer F.Cu) (tedit 5B05C773)
(attr smd)
(fp_text reference REF** (at 0 -2.45) (layer F.SilkS)
(effects (font (size 0.508 0.508) (thickness 0.127)))
)
(fp_text value Semtech_QFN-16-1EP_3x3mm_Pitch0.5mm_ThermalVias_RearPad (at 0 2.5) (layer F.SilkS)
(fp_text value Semtech_QFN-16-1EP_3x3mm (at 0 2.5) (layer F.SilkS)
(effects (font (size 0.508 0.508) (thickness 0.127)))
)
(fp_line (start -2.1 -2.1) (end -2.1 2.1) (layer F.CrtYd) (width 0.05))