(footprint "AppleIIBus_Edge" (version 20221018) (generator pcbnew)
  (layer "F.Cu")
  (attr exclude_from_pos_files exclude_from_bom allow_soldermask_bridges)
  (fp_text reference "REF**" (at 0 4.953) (layer "F.Fab")
      (effects (font (size 0.8128 0.8128) (thickness 0.2032)))
    (tstamp ad04afd9-9acb-4bbf-b2ae-ffc3351a65d5)
  )
  (fp_text value "AppleIIBus_Edge" (at 0 6.096) (layer "F.Fab")
      (effects (font (size 0.8128 0.8128) (thickness 0.2032)))
    (tstamp dcc4ad83-af74-4663-be06-23b103549e34)
  )
  (fp_line (start -32.512 4.318) (end -32.512 -3.81)
    (stroke (width 0.127) (type solid)) (layer "B.Fab") (tstamp 4538206f-804d-4b5d-a4b7-7f51d5454c8a))
  (fp_line (start 32.512 -3.81) (end 32.512 4.318)
    (stroke (width 0.127) (type solid)) (layer "B.Fab") (tstamp 251b66e6-76e9-4b8a-a938-dc4e4acd3186))
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    (stroke (width 0.127) (type solid)) (layer "B.Fab") (tstamp 9bd334e5-a663-47a3-a4f9-b2079e481b43))
  (fp_line (start -32.512 4.318) (end -32.512 -3.81)
    (stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp 3e4537cb-bf23-4d07-85c6-2b1a939b2b27))
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    (stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp e474019b-9482-4e2f-8ca8-3278136959f9))
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    (stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp 4730648d-de2b-48fa-8279-bc684cd576b8))
  (pad "1" smd roundrect (at -30.48 -0.1 180) (size 1.524 7.34) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.25) (tstamp c8c899db-3a23-4be1-b521-2afa935410f0))
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  (pad "3" smd roundrect (at -25.4 -0.1 180) (size 1.524 7.34) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.25) (tstamp b1397370-da7d-45c0-a757-af81c0632fe8))
  (pad "4" smd roundrect (at -22.86 -0.1 180) (size 1.524 7.34) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.25) (tstamp 446af94d-6ee8-49ea-9fca-8bee295391bf))
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  (pad "16" smd roundrect (at 7.62 -0.1 180) (size 1.524 7.34) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.25) (tstamp 7550a626-1d49-44cc-ae90-80ad63688bd6))
  (pad "17" smd roundrect (at 10.16 -0.1 180) (size 1.524 7.34) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.25) (tstamp daff1bda-4598-4a87-a2e1-a34cbde23077))
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  (pad "22" smd roundrect (at 22.86 -0.1 180) (size 1.524 7.34) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.25) (tstamp 140c9f5b-0fdc-4143-8b25-7a5f6e1349f6))
  (pad "23" smd roundrect (at 25.4 -0.1 180) (size 1.524 7.34) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.25) (tstamp 7a285534-4f38-4cca-8b95-d738214bd385))
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  (pad "25" smd roundrect (at 30.48 -0.1 180) (size 1.524 7.34) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.25) (tstamp c7ed152e-e369-4ba7-9d15-237bd3ff6e1c))
  (pad "26" smd roundrect (at 30.48 -0.1 180) (size 1.524 7.34) (layers "B.Cu" "B.Mask") (roundrect_rratio 0.25) (tstamp ab232705-8a76-488d-9e0b-72bff5d51db8))
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  (pad "28" smd roundrect (at 25.4 -0.1 180) (size 1.524 7.34) (layers "B.Cu" "B.Mask") (roundrect_rratio 0.25) (tstamp b4e2929a-1cb4-49c1-bf45-56b6108140fa))
  (pad "29" smd roundrect (at 22.86 -0.1 180) (size 1.524 7.34) (layers "B.Cu" "B.Mask") (roundrect_rratio 0.25) (tstamp 1d59344f-391c-44d6-a999-0e56001a382f))
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)