(module Xunpu_TF-115_microSD (layer F.Cu) (tedit 6047D447) (solder_mask_margin 0.05) (solder_paste_margin -0.05) (attr smd) (fp_text reference REF** (at 0 0) (layer F.SilkS) (effects (font (size 0.8128 0.8128) (thickness 0.2032))) ) (fp_text value Xunpu_TF-115_microSD (at 0 0.9) (layer F.Fab) (effects (font (size 0.508 0.508) (thickness 0.127))) ) (fp_line (start -8 -5.7) (end -8 8.7) (layer F.SilkS) (width 0.127)) (fp_line (start 0.5 8) (end -7.8 8) (layer F.Fab) (width 0.127)) (fp_line (start 4.2 9) (end 0.5 8) (layer F.Fab) (width 0.127)) (fp_line (start 6.95 9) (end 4.2 9) (layer F.Fab) (width 0.127)) (fp_line (start 6.95 -5.5) (end 6.95 9) (layer F.Fab) (width 0.127)) (fp_line (start -7.8 -5.5) (end 6.95 -5.5) (layer F.Fab) (width 0.127)) (fp_line (start -8 -5.7) (end 7.15 -5.7) (layer F.SilkS) (width 0.127)) (fp_line (start 7.15 -5.7) (end 7.15 8.7) (layer F.SilkS) (width 0.127)) (fp_line (start -7.8 -5.5) (end -7.85 8) (layer F.Fab) (width 0.127)) (fp_line (start -8.15 -6) (end -8.15 9.45) (layer F.CrtYd) (width 0.05)) (fp_line (start -8.15 9.45) (end 7.4 9.45) (layer F.CrtYd) (width 0.05)) (fp_line (start 7.4 -6) (end 7.4 9.45) (layer F.CrtYd) (width 0.05)) (fp_line (start 7.4 -6) (end -8.15 -6) (layer F.CrtYd) (width 0.05)) (pad "" np_thru_hole circle (at 3.05 5.7) (size 1 1) (drill 1) (layers *.Cu *.Mask)) (pad "" np_thru_hole circle (at -4.95 5.7) (size 1 1) (drill 1) (layers *.Cu *.Mask)) (pad 8 smd roundrect (at -5.5 -5.3) (size 0.7 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)) (pad 7 smd roundrect (at -4.4 -5.3) (size 0.7 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)) (pad 6 smd roundrect (at -3.3 -5.3) (size 0.7 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)) (pad 5 smd roundrect (at -2.2 -5.3) (size 0.7 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)) (pad 4 smd roundrect (at -1.1 -5.3) (size 0.7 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)) (pad 3 smd roundrect (at 0 -5.3) (size 0.7 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)) (pad 2 smd roundrect (at 1.1 -5.3) (size 0.7 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)) (pad 1 smd roundrect (at 2.2 -5.3) (size 0.7 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)) (pad 10 smd roundrect (at 7.75 5.3) (size 1.2 2.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)) (pad 10 smd roundrect (at 6.85 -4.3) (size 1.6 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)) (pad 9 smd roundrect (at -6.6 -5.3) (size 0.7 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)) (pad 10 smd roundrect (at -7.8 -4.3) (size 1.2 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)) (pad 10 smd roundrect (at -7.75 5.3) (size 1.2 2.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)) )