(module TSSOP-20_4.4x6.5mm_P0.65mm (layer F.Cu) (tedit 5EE296B4)
  (descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "SSOP 0.65")
  (solder_mask_margin 0.024)
  (solder_paste_margin -0.04)
  (attr smd)
  (fp_text reference REF** (at 0 0 90) (layer F.Fab)
    (effects (font (size 0.8128 0.8128) (thickness 0.2032)))
  )
  (fp_text value TSSOP-20_4.4x6.5mm_P0.65mm (at -1.016 0 90) (layer F.Fab)
    (effects (font (size 0.508 0.508) (thickness 0.127)))
  )
  (fp_line (start -1.2 -3.25) (end 2.2 -3.25) (layer F.Fab) (width 0.15))
  (fp_line (start 2.2 -3.25) (end 2.2 3.25) (layer F.Fab) (width 0.15))
  (fp_line (start 2.2 3.25) (end -2.2 3.25) (layer F.Fab) (width 0.15))
  (fp_line (start -2.2 3.25) (end -2.2 -2.25) (layer F.Fab) (width 0.15))
  (fp_line (start -2.2 -2.25) (end -1.2 -3.25) (layer F.Fab) (width 0.15))
  (fp_line (start -3.95 -3.55) (end -3.95 3.55) (layer F.CrtYd) (width 0.05))
  (fp_line (start 3.95 -3.55) (end 3.95 3.55) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.95 -3.55) (end 3.95 -3.55) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.95 3.55) (end 3.95 3.55) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.225 3.45) (end 2.225 3.45) (layer F.SilkS) (width 0.15))
  (fp_line (start -3.75 -3.45) (end 2.225 -3.45) (layer F.SilkS) (width 0.15))
  (fp_text user %R (at 0 0 90) (layer F.SilkS)
    (effects (font (size 0.8128 0.8128) (thickness 0.2032)))
  )
  (pad 1 smd roundrect (at -2.95 -2.925) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 2 smd roundrect (at -2.95 -2.275) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 3 smd roundrect (at -2.95 -1.625) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 4 smd roundrect (at -2.95 -0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 5 smd roundrect (at -2.95 -0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 6 smd roundrect (at -2.95 0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 7 smd roundrect (at -2.95 0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 8 smd roundrect (at -2.95 1.625) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 9 smd roundrect (at -2.95 2.275) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 10 smd roundrect (at -2.95 2.925) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 11 smd roundrect (at 2.95 2.925) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 12 smd roundrect (at 2.95 2.275) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 13 smd roundrect (at 2.95 1.625) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 14 smd roundrect (at 2.95 0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 15 smd roundrect (at 2.95 0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 16 smd roundrect (at 2.95 -0.325) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 17 smd roundrect (at 2.95 -0.975) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 18 smd roundrect (at 2.95 -1.625) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 19 smd roundrect (at 2.95 -2.275) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (pad 20 smd roundrect (at 2.95 -2.925) (size 1.45 0.45) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
  (model ${KISYS3DMOD}/Package_SO.3dshapes/TSSOP-20_4.4x6.5mm_P0.65mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)