stdpads.pretty/NXP_DHVFQFN-20_SOT764-1.kic...

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(module NXP_DHVFQFN-20_SOT764-1 (layer F.Cu) (tedit 5F32604D)
(solder_mask_margin 0.03)
(solder_paste_margin -0.03)
(attr smd)
(fp_text reference REF** (at 0 0) (layer F.Fab)
(effects (font (size 0.381 0.381) (thickness 0.09525)))
)
(fp_text value NXP_DHVFQFN-20_SOT764-1 (at 0 0.55) (layer F.Fab)
(effects (font (size 0.381 0.381) (thickness 0.09525)))
)
(fp_text user %R (at 0 -2.55) (layer F.SilkS)
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
)
(fp_line (start -2.7 1.2) (end -2.7 1.7) (layer F.SilkS) (width 0.127))
(fp_line (start 2.7 -1.7) (end 2.25 -1.7) (layer F.SilkS) (width 0.127))
(fp_line (start 2.7 -1.2) (end 2.7 -1.7) (layer F.SilkS) (width 0.127))
(fp_line (start 2.7 1.7) (end 2.7 1.2) (layer F.SilkS) (width 0.127))
(fp_line (start 2.7 1.7) (end 2.2 1.7) (layer F.SilkS) (width 0.127))
(fp_line (start -2.7 -1.7) (end -2.2 -1.7) (layer F.SilkS) (width 0.127))
(fp_line (start -2.7 -1.7) (end -2.7 -1.2) (layer F.SilkS) (width 0.127))
(fp_line (start -2.4 -1.4) (end -2.4 1.4) (layer F.Fab) (width 0.05))
(fp_line (start -2.4 1.4) (end 2.4 1.4) (layer F.Fab) (width 0.05))
(fp_line (start 2.4 1.4) (end 2.4 -1.4) (layer F.Fab) (width 0.05))
(fp_line (start 2.4 -1.4) (end -2.4 -1.4) (layer F.Fab) (width 0.05))
(fp_line (start -3.05 -2.05) (end -3.05 2.05) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.05 2.05) (end 3.05 2.05) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.05 -2.05) (end 3.05 -2.05) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.05 2.05) (end 3.05 -2.05) (layer F.CrtYd) (width 0.05))
(pad 18 smd roundrect (at -1.25 -1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 17 smd roundrect (at -0.75 -1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 16 smd roundrect (at -0.25 -1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 15 smd roundrect (at 0.25 -1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 9 smd roundrect (at 1.75 1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 8 smd roundrect (at 1.25 1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 7 smd roundrect (at 0.75 1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 21 smd roundrect (at 0 0) (size 2.9 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.05)
(solder_paste_margin -0.28) (zone_connect 2))
(pad 2 smd roundrect (at -1.75 1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 3 smd roundrect (at -1.25 1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 4 smd roundrect (at -0.75 1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 5 smd roundrect (at -0.25 1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 6 smd roundrect (at 0.25 1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 10 smd roundrect (at 2.3 0.25 90) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 11 smd roundrect (at 2.3 -0.25 90) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 12 smd roundrect (at 1.75 -1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 13 smd roundrect (at 1.25 -1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 14 smd roundrect (at 0.75 -1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 19 smd roundrect (at -1.75 -1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 20 smd roundrect (at -2.3 -0.25 90) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 1 smd roundrect (at -2.3 0.25 90) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(model ${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/DFN-16-1EP_3x5mm_P0.5mm_EP1.66x4.4mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 -90))
)
)