stdpads.pretty/NXP_VSSOP-8_2.3x2mm.kicad_mod
Zane Kaminski b5ea91afd3 idk
2024-03-18 18:36:39 -04:00

55 lines
3.7 KiB
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(footprint "NXP_VSSOP-8_2.3x2mm" (version 20221018) (generator pcbnew)
(layer "F.Cu")
(tags "VSSOP-8")
(solder_mask_margin 0.035)
(solder_paste_margin -0.025)
(attr smd)
(fp_text reference "REF**" (at 0 0) (layer "F.Fab")
(effects (font (size 0.254 0.254) (thickness 0.0635)))
(tstamp 85f72c47-528a-41f0-9c0f-0f84dda9ab4d)
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(fp_text value "NXP_VSSOP-8_2.3x2mm" (at 0 0.85) (layer "F.Fab")
(effects (font (size 0.127 0.127) (thickness 0.03175)))
(tstamp f8faa045-d368-4c73-ac04-f82a78d5e893)
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(fp_text user "${REFERENCE}" (at 0 -1.85) (layer "F.SilkS")
(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
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(fp_line (start 1.1 1.2) (end -1.1 1.2)
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(stroke (width 0.1) (type solid)) (layer "F.Fab") (tstamp 1f753600-e885-4040-8051-2f9fa50b914a))
(pad "1" smd roundrect (at -1.35 -0.8) (size 1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp b9491db9-5a26-425b-bd60-2c52726bd2cc))
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(pad "3" smd roundrect (at -1.35 0.25) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 651d2cf0-9695-4b04-a6f8-1d63158a7d85))
(pad "4" smd roundrect (at -1.35 0.8) (size 1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 503f49d3-0c79-423e-8a7e-09549a5816d6))
(pad "5" smd roundrect (at 1.35 0.8 270) (size 0.4 1) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp d495e0e1-1739-4553-94a1-2c3251a59fba))
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(pad "7" smd roundrect (at 1.35 -0.25) (size 1 0.3) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 31c43554-9132-4a1e-a148-167786d724b8))
(pad "8" smd roundrect (at 1.35 -0.8) (size 1 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 26cac26e-0431-48c1-987f-7c5578bfa7c5))
(model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/VSSOP-8_2.3x2mm_P0.5mm.wrl"
(offset (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)