stdpads.pretty/TSSOP-20_4.4x6.5mm_P0.65mm.kicad_mod

(footprint "TSSOP-20_4.4x6.5mm_P0.65mm" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5F27C9F6)
  (descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "SSOP 0.65")
  (solder_mask_margin 0.024)
  (solder_paste_margin -0.04)
  (attr smd)
  (fp_text reference "REF**" (at 0 0 180) (layer "F.Fab")
    (effects (font (size 0.8128 0.8128) (thickness 0.2032)))
    (tstamp 43f74e43-55b7-4fe9-8c02-54741cb68671)
  )
  (fp_text value "TSSOP-20_4.4x6.5mm_P0.65mm" (at 0 1.016 180) (layer "F.Fab")
    (effects (font (size 0.508 0.508) (thickness 0.127)))
    (tstamp 054863d5-7e10-41d4-a646-2a858ec7ceff)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.SilkS")
    (effects (font (size 0.8128 0.8128) (thickness 0.2032)))
    (tstamp 6398af37-19f8-4769-a00f-fa5baf3c6ea5)
  )
  (fp_line (start 3.45 2.225) (end 3.45 -2.225) (layer "F.SilkS") (width 0.15) (tstamp 5c9bc151-e282-4405-8be4-f7b49b568fbb))
  (fp_line (start -3.45 3.75) (end -3.45 -2.225) (layer "F.SilkS") (width 0.15) (tstamp 6f39ac71-504f-4657-8986-24ff4f2d032d))
  (fp_line (start -3.55 3.95) (end -3.55 -3.95) (layer "F.CrtYd") (width 0.05) (tstamp 5f696e54-9d03-4869-8439-f96563aad50e))
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  (fp_line (start -3.55 3.95) (end 3.55 3.95) (layer "F.CrtYd") (width 0.05) (tstamp 809f70fd-374c-4d5c-9cab-d8e44fa2006c))
  (fp_line (start 3.55 3.95) (end 3.55 -3.95) (layer "F.CrtYd") (width 0.05) (tstamp b991f6de-4188-4c5b-bb36-b3817a5574f7))
  (fp_line (start -3.25 1.2) (end -3.25 -2.2) (layer "F.Fab") (width 0.15) (tstamp 3d5b62d6-49aa-432f-a5c6-cbb1891b0055))
  (fp_line (start -3.25 -2.2) (end 3.25 -2.2) (layer "F.Fab") (width 0.15) (tstamp 58017232-9d7d-49d5-9831-e20babc97c1a))
  (fp_line (start -2.25 2.2) (end -3.25 1.2) (layer "F.Fab") (width 0.15) (tstamp 610ff452-4197-4517-81ff-20199023d33e))
  (fp_line (start 3.25 -2.2) (end 3.25 2.2) (layer "F.Fab") (width 0.15) (tstamp 8bb178d5-a2ca-4502-8601-3d181150c3b6))
  (fp_line (start 3.25 2.2) (end -2.25 2.2) (layer "F.Fab") (width 0.15) (tstamp b849c879-8aa2-4aef-88eb-e2294cabc69f))
  (pad "1" smd roundrect (at -2.925 2.95 90) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 111a9cf1-58cb-4410-953d-499d23c85f0f))
  (pad "2" smd roundrect (at -2.275 2.95 90) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 8b65eba9-3370-4aa6-9c98-1579ce1acb40))
  (pad "3" smd roundrect (at -1.625 2.95 90) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp aea0c070-06c6-4135-a708-f46d34e6fdae))
  (pad "4" smd roundrect (at -0.975 2.95 90) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 483f331b-2bc0-4cb8-bb92-1b8a345841cf))
  (pad "5" smd roundrect (at -0.325 2.95 90) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 6d883ddf-40ea-443e-84fa-f7d018bddc4a))
  (pad "6" smd roundrect (at 0.325 2.95 90) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 24fe7676-0c0a-4b5a-8a61-dd833b2a3e83))
  (pad "7" smd roundrect (at 0.975 2.95 90) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 9560da74-dd09-4735-9bb3-c63169b5b561))
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  (pad "9" smd roundrect (at 2.275 2.95 90) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp f3269157-290f-42d2-ad85-a243e0c16d86))
  (pad "10" smd roundrect (at 2.925 2.95 90) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 4831ae25-0940-40bd-8287-52f3b995212e))
  (pad "11" smd roundrect (at 2.925 -2.95 90) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 97fa9751-3b73-499b-9a68-82d7d05ad2e5))
  (pad "12" smd roundrect (at 2.275 -2.95 90) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp ad1d94a8-7d85-4004-9ab8-aa55ca511b8a))
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  (pad "14" smd roundrect (at 0.975 -2.95 90) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 1e85f89b-021b-44a1-8852-55aafbf7a71c))
  (pad "15" smd roundrect (at 0.325 -2.95 90) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 68015416-9ad1-4782-8d78-de2b22d855e2))
  (pad "16" smd roundrect (at -0.325 -2.95 90) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 5910a5fe-02d2-43c3-8275-719282a4fba5))
  (pad "17" smd roundrect (at -0.975 -2.95 90) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp e12498fb-0073-451e-bfed-533c8939e787))
  (pad "18" smd roundrect (at -1.625 -2.95 90) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 9a3c2099-a93b-43c7-a533-2eec49fc7cb1))
  (pad "19" smd roundrect (at -2.275 -2.95 90) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 0edef41d-0d73-4adf-8257-f364e3a9253f))
  (pad "20" smd roundrect (at -2.925 -2.95 90) (size 1.45 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 88aaa8ca-5d5e-420e-9150-eae76ab65680))
  (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/TSSOP-20_4.4x6.5mm_P0.65mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 -90))
  )
)