stdpads.pretty/USB_Micro-B_ShouHan_MicroXNJ.kicad_mod

(footprint "USB_Micro-B_ShouHan_MicroXNJ" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 62F8F3A5)
  (descr "http://www.molex.com/pdm_docs/sd/1050170001_sd.pdf")
  (tags "Micro-USB SMD Typ-B")
  (solder_mask_margin 0.05)
  (solder_paste_margin -0.025)
  (attr smd)
  (fp_text reference "REF**" (at 0 -0.25) (layer "F.Fab")
    (effects (font (size 0.8128 0.8128) (thickness 0.2032)))
    (tstamp 3b8a74c1-8db7-45a0-a4b7-5035d10d78bf)
  )
  (fp_text value "USB_Micro-B_ShouHan_MicroXNJ" (at 0 -4.55) (layer "F.Fab")
    (effects (font (size 0.8128 0.8128) (thickness 0.2032)))
    (tstamp bbf1aa93-364e-425e-94f7-30c74d54c6cc)
  )
  (fp_text user "${REFERENCE}" (at 0 -3.3) (layer "F.SilkS")
    (effects (font (size 0.8128 0.8128) (thickness 0.2032)))
    (tstamp d53640f8-290d-4818-9efa-fa16f9f28a47)
  )
  (fp_text user "PCB Edge" (at 0 2.25) (layer "Dwgs.User")
    (effects (font (size 0.5 0.5) (thickness 0.08)))
    (tstamp 012e138a-c5b5-49d3-9d01-36e17cb03eec)
  )
  (fp_line (start -1.7 -2.4125) (end -1.25 -2.4125) (layer "F.SilkS") (width 0.12) (tstamp 4fceb532-0eef-443e-aaf2-0e8ef6656755))
  (fp_line (start 3.9 2.55) (end 3.9 2.1875) (layer "F.SilkS") (width 0.12) (tstamp 5d4a90e6-ee06-496a-a2d6-21d99549775b))
  (fp_line (start -3.9 -2.4125) (end -3.45 -2.4125) (layer "F.SilkS") (width 0.12) (tstamp 752159bd-53ef-4106-a739-1dc0c2393905))
  (fp_line (start -3.9 -0.05) (end -3.9 -2.4125) (layer "F.SilkS") (width 0.12) (tstamp 8b2ab8ba-bb34-4e24-8467-280d57f089e1))
  (fp_line (start 3.9 -2.4125) (end 3.45 -2.4125) (layer "F.SilkS") (width 0.12) (tstamp bb6c1ba3-25f6-4e6f-86f9-8b8e1f65126b))
  (fp_line (start -3.9 2.55) (end -3.9 2.1875) (layer "F.SilkS") (width 0.12) (tstamp be2fa3e0-68ee-4162-a2e9-c93f671b7de7))
  (fp_line (start -1.7 -2.4125) (end -1.7 -1.9625) (layer "F.SilkS") (width 0.12) (tstamp c8d74a79-e3f5-45e0-8406-b8cd6c3a0ac9))
  (fp_line (start 3.9 -0.05) (end 3.9 -2.4125) (layer "F.SilkS") (width 0.12) (tstamp f56dc3e0-41be-4f82-81e1-24c24f058d37))
  (fp_line (start -4.4 3.44) (end -4.4 -2.66) (layer "F.CrtYd") (width 0.05) (tstamp 28de6fa3-06c7-4b1f-a899-3b441333a4e4))
  (fp_line (start 4.4 -2.66) (end 4.4 3.44) (layer "F.CrtYd") (width 0.05) (tstamp 4c35459e-9ae7-48b5-a5bb-4bb4f0122c02))
  (fp_line (start -4.4 -2.66) (end 4.4 -2.66) (layer "F.CrtYd") (width 0.05) (tstamp d00f951b-5051-474f-8335-2b4075c1d1ee))
  (fp_line (start -4.4 3.44) (end 4.4 3.44) (layer "F.CrtYd") (width 0.05) (tstamp da16157f-0de1-45a6-a77e-0894780027ec))
  (fp_line (start -1.1 -2.2225) (end -1.1 -2.0125) (layer "F.Fab") (width 0.1) (tstamp 407023de-c23a-4b5b-8c1a-11b787c5ed46))
  (fp_line (start -1.5 -2.2225) (end -1.1 -2.2225) (layer "F.Fab") (width 0.1) (tstamp 49c0d86c-a502-42a0-8c0b-ee4379820067))
  (fp_line (start -1.3 -1.8125) (end -1.5 -2.0125) (layer "F.Fab") (width 0.1) (tstamp 513d3636-8895-4f1f-b7a3-41de48806947))
  (fp_line (start -3 2.8) (end 3 2.8) (layer "F.Fab") (width 0.1) (tstamp 57673406-0848-490a-b6cf-ad3b5fd74817))
  (fp_line (start -1.5 -2.2225) (end -1.5 -2.0125) (layer "F.Fab") (width 0.1) (tstamp 6a4cba58-94db-4b2f-ad1d-9110c8f511d2))
  (fp_line (start -3.75 3.189204) (end -3.75 -2.2625) (layer "F.Fab") (width 0.1) (tstamp 7b35e377-a96a-490d-baa3-5ba85408f670))
  (fp_line (start -3.75 -2.2625) (end 3.75 -2.2625) (layer "F.Fab") (width 0.1) (tstamp 80cf20b9-31ae-430e-aebc-22215e79cf9e))
  (fp_line (start 3.75 3.189204) (end 3.75 -2.2625) (layer "F.Fab") (width 0.1) (tstamp 8a0f1d68-fcb6-4e69-86a0-25228a6362f6))
  (fp_line (start -3.75 3.189204) (end 3.75 3.189204) (layer "F.Fab") (width 0.1) (tstamp f1bb15cd-8c33-41de-b0b3-2d2cecc5ef20))
  (fp_line (start -1.1 -2.0125) (end -1.3 -1.8125) (layer "F.Fab") (width 0.1) (tstamp fb5f5711-2559-455f-a022-6ebe8aa3a2cf))
  (pad "1" smd roundrect (at -1.3 -1.575) (size 0.4 1.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2)
    (solder_mask_margin 0.04) (solder_paste_margin -0.05) (tstamp 17b500e6-2d02-41bd-819c-a0859ade554e))
  (pad "2" smd roundrect (at -0.65 -1.575) (size 0.4 1.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2)
    (solder_mask_margin 0.04) (solder_paste_margin -0.05) (tstamp 69ed4782-bd05-4740-9628-f01053e2c987))
  (pad "3" smd roundrect (at 0 -1.575) (size 0.4 1.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2)
    (solder_mask_margin 0.04) (solder_paste_margin -0.05) (tstamp e7885e9c-df74-4495-8a56-dc04059fb63f))
  (pad "4" smd roundrect (at 0.65 -1.575) (size 0.4 1.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2)
    (solder_mask_margin 0.04) (solder_paste_margin -0.05) (tstamp b507f3c7-dd52-44a5-be46-b7c93b1c846c))
  (pad "5" smd roundrect (at 1.3 -1.575) (size 0.4 1.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.2)
    (solder_mask_margin 0.04) (solder_paste_margin -0.05) (tstamp 5a5fe685-535f-45b0-85da-3c4fa2ab7849))
  (pad "6" smd roundrect (at 0.8 1.075) (size 0.6 1.35) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 1413f399-c032-41b9-b8a2-602bf7b1f982))
  (pad "6" thru_hole circle (at -2.425 -1.6) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask) (tstamp 82ca04ac-e46d-4657-ab9a-488c875db72a))
  (pad "6" smd roundrect (at -0.8 1.075) (size 0.6 1.35) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 9ac613ba-43cd-4c35-8e8d-7946421c3c6b))
  (pad "6" thru_hole circle (at 2.425 -1.6) (size 1.3 1.3) (drill 0.7) (layers *.Cu *.Mask) (tstamp b024edba-7a2b-497b-8a11-c45831be79f4))
  (pad "6" thru_hole oval (at -3.6 1.05 180) (size 1.07 1.9) (drill oval 0.5 1.3) (layers *.Cu *.Mask) (tstamp b6994e7c-4f8f-435a-8f1d-438b7427a25f))
  (pad "6" thru_hole oval (at 3.6 1.05) (size 1.07 1.9) (drill oval 0.5 1.3) (layers *.Cu *.Mask) (tstamp c5d5bafd-8003-4b07-9045-e05288cc68bc))
  (model "${KICAD6_3DMODEL_DIR}/Connector_USB.3dshapes/USB_Micro-B_Molex_47346-0001.wrl"
    (offset (xyz 0 0.15 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)