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56 lines
4.0 KiB
Plaintext
56 lines
4.0 KiB
Plaintext
(module NXP_DHVFQFN-20_SOT764-1 (layer F.Cu) (tedit 5E912FEA)
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(solder_mask_margin 0.03)
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(solder_paste_margin -0.025)
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(fp_text reference REF** (at 0 0) (layer F.Fab)
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(effects (font (size 0.254 0.254) (thickness 0.0635)))
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)
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(fp_text value NXP_DHVFQFN-20_SOT764-1 (at 0 2.45) (layer F.Fab)
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(effects (font (size 0.508 0.508) (thickness 0.127)))
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)
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(fp_line (start 3.05 2.05) (end 3.05 -2.05) (layer F.CrtYd) (width 0.05))
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(fp_line (start -3.05 -2.05) (end 3.05 -2.05) (layer F.CrtYd) (width 0.05))
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(fp_line (start -3.05 2.05) (end 3.05 2.05) (layer F.CrtYd) (width 0.05))
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(fp_line (start -3.05 -2.05) (end -3.05 2.05) (layer F.CrtYd) (width 0.05))
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(fp_line (start 2.4 -1.4) (end -2.4 -1.4) (layer F.Fab) (width 0.05))
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(fp_line (start 2.4 1.4) (end 2.4 -1.4) (layer F.Fab) (width 0.05))
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(fp_line (start -2.4 1.4) (end 2.4 1.4) (layer F.Fab) (width 0.05))
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(fp_line (start -2.4 -1.4) (end -2.4 1.4) (layer F.Fab) (width 0.05))
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(fp_line (start -2.7 -1.7) (end -2.7 -1.2) (layer F.SilkS) (width 0.127))
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(fp_line (start -2.7 -1.7) (end -2.2 -1.7) (layer F.SilkS) (width 0.127))
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(fp_line (start 2.7 1.7) (end 2.2 1.7) (layer F.SilkS) (width 0.127))
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(fp_line (start 2.7 1.7) (end 2.7 1.2) (layer F.SilkS) (width 0.127))
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(fp_line (start 2.7 -1.2) (end 2.7 -1.7) (layer F.SilkS) (width 0.127))
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(fp_line (start 2.7 -1.7) (end 2.25 -1.7) (layer F.SilkS) (width 0.127))
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(fp_line (start -2.7 1.2) (end -2.7 1.7) (layer F.SilkS) (width 0.127))
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(fp_text user REF** (at 0 -2.55) (layer F.SilkS)
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(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
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)
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(pad 1 smd roundrect (at -2.3 0.25 90) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 20 smd roundrect (at -2.3 -0.25 90) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 19 smd roundrect (at -1.75 -1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 14 smd roundrect (at 0.75 -1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 13 smd roundrect (at 1.25 -1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 12 smd roundrect (at 1.75 -1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 11 smd roundrect (at 2.3 -0.25 90) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 10 smd roundrect (at 2.3 0.25 90) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 6 smd roundrect (at 0.25 1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 5 smd roundrect (at -0.25 1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 4 smd roundrect (at -0.75 1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 3 smd roundrect (at -1.25 1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 2 smd roundrect (at -1.75 1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 21 smd roundrect (at 0 0) (size 2.9 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.05)
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(solder_paste_margin -0.28) (zone_connect 2))
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(pad 7 smd roundrect (at 0.75 1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 8 smd roundrect (at 1.25 1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 9 smd roundrect (at 1.75 1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 15 smd roundrect (at 0.25 -1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 16 smd roundrect (at -0.25 -1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 17 smd roundrect (at -0.75 -1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 18 smd roundrect (at -1.25 -1.3) (size 0.24 0.9) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/DFN-16-1EP_3x5mm_P0.5mm_EP1.66x4.4mm.wrl
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(at (xyz 0 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 -90))
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)
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)
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