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54 lines
2.9 KiB
Plaintext
54 lines
2.9 KiB
Plaintext
(module SON-8-1EP_3x2mm_P0.5mm_EP0.25x1.65mm (layer F.Cu) (tedit 6087F7AD)
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(descr "SON, 8 Pin (http://www.fujitsu.com/downloads/MICRO/fsa/pdf/products/memory/fram/MB85RS16-DS501-00014-6v0-E.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py")
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(tags "SON NoLead")
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(attr smd)
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(fp_text reference REF** (at 0 0) (layer F.Fab)
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(effects (font (size 0.508 0.508) (thickness 0.127)))
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)
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(fp_text value SON-8-1EP_3x2mm_P0.5mm_EP0.25x1.65mm (at 0 1.9) (layer F.Fab)
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(effects (font (size 0.8182 0.8128) (thickness 0.2032)))
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)
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(fp_line (start -1.5 -1.11) (end 1.1 -1.11) (layer F.SilkS) (width 0.12))
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(fp_line (start -1.1 1.11) (end 1.1 1.11) (layer F.SilkS) (width 0.12))
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(fp_line (start -1 -1) (end 1.5 -1) (layer F.Fab) (width 0.1))
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(fp_line (start 1.5 -1) (end 1.5 1) (layer F.Fab) (width 0.1))
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(fp_line (start 1.5 1) (end -1.5 1) (layer F.Fab) (width 0.1))
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(fp_line (start -1.5 1) (end -1.5 -0.5) (layer F.Fab) (width 0.1))
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(fp_line (start -1.5 -0.5) (end -1 -1) (layer F.Fab) (width 0.1))
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(fp_line (start -1.8 -1.25) (end -1.8 1.25) (layer F.CrtYd) (width 0.05))
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(fp_line (start -1.8 1.25) (end 1.8 1.25) (layer F.CrtYd) (width 0.05))
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(fp_line (start 1.8 1.25) (end 1.8 -1.25) (layer F.CrtYd) (width 0.05))
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(fp_line (start 1.8 -1.25) (end -1.8 -1.25) (layer F.CrtYd) (width 0.05))
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(fp_text user %R (at 0 -1.8) (layer F.SilkS)
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(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
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)
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(pad 1 smd roundrect (at -1.4 -0.75) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
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(solder_mask_margin 0.024))
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(pad 2 smd roundrect (at -1.4 -0.25) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
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(solder_mask_margin 0.024))
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(pad 3 smd roundrect (at -1.4 0.25) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
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(solder_mask_margin 0.024))
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(pad 4 smd roundrect (at -1.4 0.75) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
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(solder_mask_margin 0.024))
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(pad 5 smd roundrect (at 1.4 0.75) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
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(solder_mask_margin 0.024))
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(pad 6 smd roundrect (at 1.4 0.25) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
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(solder_mask_margin 0.024))
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(pad 7 smd roundrect (at 1.4 -0.25) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
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(solder_mask_margin 0.024))
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(pad 8 smd roundrect (at 1.4 -0.75) (size 0.9 0.3) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25)
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(solder_mask_margin 0.024))
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(pad 9 smd roundrect (at 0 0) (size 0.25 1.65) (layers F.Cu F.Mask) (roundrect_rratio 0.25)
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(solder_mask_margin 0.05))
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(model ${KISYS3DMOD}/Package_SON.3dshapes/WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm.wrl
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(offset (xyz -0.5 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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(model ${KISYS3DMOD}/Package_SON.3dshapes/WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm.wrl
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(offset (xyz 0.5 0 0))
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(scale (xyz 1 1 1))
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(rotate (xyz 0 0 0))
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)
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)
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