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40 lines
2.9 KiB
Plaintext
40 lines
2.9 KiB
Plaintext
(module Xunpu_TF-115_microSD (layer F.Cu) (tedit 606CA97D)
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(solder_mask_margin 0.05)
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(solder_paste_margin -0.05)
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(attr smd)
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(fp_text reference REF** (at -2.55 0 90) (layer F.SilkS)
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(effects (font (size 0.8128 0.8128) (thickness 0.2032)))
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)
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(fp_text value Xunpu_TF-115_microSD (at -1.65 0 90) (layer F.Fab)
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(effects (font (size 0.508 0.508) (thickness 0.127)))
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)
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(fp_line (start -8.25 7.6) (end 6.15 7.6) (layer F.SilkS) (width 0.127))
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(fp_line (start 5.45 -0.9) (end 5.45 7.4) (layer F.Fab) (width 0.127))
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(fp_line (start 6.45 -4.6) (end 5.45 -0.9) (layer F.Fab) (width 0.127))
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(fp_line (start 6.45 -7.35) (end 6.45 -4.6) (layer F.Fab) (width 0.127))
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(fp_line (start -8.05 -7.35) (end 6.45 -7.35) (layer F.Fab) (width 0.127))
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(fp_line (start -8.05 7.4) (end -8.05 -7.35) (layer F.Fab) (width 0.127))
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(fp_line (start -8.25 7.6) (end -8.25 -7.55) (layer F.SilkS) (width 0.127))
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(fp_line (start -8.25 -7.55) (end 6.15 -7.55) (layer F.SilkS) (width 0.127))
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(fp_line (start -8.05 7.4) (end 5.45 7.4) (layer F.Fab) (width 0.127))
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(fp_line (start -8.85 8.55) (end 6.9 8.55) (layer F.CrtYd) (width 0.05))
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(fp_line (start 6.9 8.55) (end 6.9 -8.55) (layer F.CrtYd) (width 0.05))
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(fp_line (start -8.85 -8.55) (end 6.9 -8.55) (layer F.CrtYd) (width 0.05))
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(fp_line (start -8.85 -8.55) (end -8.85 8.55) (layer F.CrtYd) (width 0.05))
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(pad "" np_thru_hole circle (at 3.15 -3.05 90) (size 1 1) (drill 1) (layers *.Cu *.Mask))
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(pad "" np_thru_hole circle (at 3.15 4.95 90) (size 1 1) (drill 1) (layers *.Cu *.Mask))
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(pad 8 smd roundrect (at -7.85 5.5 90) (size 0.7 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 7 smd roundrect (at -7.85 4.4 90) (size 0.7 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 6 smd roundrect (at -7.85 3.3 90) (size 0.7 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 5 smd roundrect (at -7.85 2.2 90) (size 0.7 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 4 smd roundrect (at -7.85 1.1 90) (size 0.7 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 3 smd roundrect (at -7.85 0 90) (size 0.7 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 2 smd roundrect (at -7.85 -1.1 90) (size 0.7 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 1 smd roundrect (at -7.85 -2.2 90) (size 0.7 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 10 smd roundrect (at 2.75 -7.75 90) (size 1.2 2.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 10 smd roundrect (at -6.85 -6.85 90) (size 1.6 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 9 smd roundrect (at -7.85 6.6 90) (size 0.7 1.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 10 smd roundrect (at -6.85 7.8 90) (size 1.2 1.5) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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(pad 10 smd roundrect (at 2.75 7.75 90) (size 1.2 2.2) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
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)
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