RAM2E/Hardware/LCMXO2/BOM/RAM2E-BOM.LCMXO2HC.csv

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2021-06-01 09:30:16 +00:00
Reference, Quantity, Value, Footprint, Datasheet, LCSC Part, Mfg. Part Numbers, Notes
C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 C30 ,23,2u2,stdpads:C_0603,,C23630,Samsung CL10A225KO8NNNC,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred."
C1 C2 C3 C4 C5 C6 C29 ,7,10u,stdpads:C_0805,,C15850,Samsung CL21A106KAYNNNE,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred."
C31 ,1,15p,stdpads:C_0603,,C1644,Samsung CL10C150JB8NNNC,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred."
D1 ,1,Amber,stdpads:LED_0805,,C34499,Hubei Kento C34499,Any manufacturer's part is acceptable.
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FID1 FID2 FID3 FID4 ,4,Fiducial,stdpads:Fiducial,,,,DNP - SMT vision system fiducial
H1 H2 H3 H4 ,4, ,stdpads:PasteHole_1.152mm_NPTH,,,,DNP - mounting hole for solder paste printing
H5 ,1, ,stdpads:PasteHole_1.1mm_PTH,,,,DNP - mounting hole
J1 ,1,AppleIIeAux,stdpads:AppleIIeAux_Edge,,,,DNP - edge connector
J2 ,1,JTAG,stdpads:TC2050,,,,DNP - test pad connector
J3 ,1,C14M,Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical,,,,DNP
R1 ,1,0,stdpads:R_0805,,C17477,Uniroyal 0805W8F0000T5E,Any manufacturer's part is acceptable.
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R10 ,1,220,stdpads:R_0805,,C17557,Uniroyal 0805W8F2200T5E,Any manufacturer's part is acceptable.
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R2 R3 R4 R12 R13 ,5,47,stdpads:R_0603,,C23182,Uniroyal 0603WAF470JT5E,Any manufacturer's part is acceptable.
R6 ,1,0,stdpads:R_0805,,C17477,Uniroyal 0805W8F0000T5E,Any manufacturer's part is acceptable.
R7 ,1,DNP,stdpads:R_0805,,,,
R5 R8 R9 R11 ,4,10k,stdpads:R_0603,,C25804,Uniroyal 0603WAF1002T5E,Any manufacturer's part is acceptable.
U1 ,1,LCMXO2-TG100,stdpads:TQFP-100_14x14mm_P0.5mm,,C1519051,"Lattice LCMXO2-640HC-4TG100C, Lattice LCMXO2-640HC-5TG100C, Lattice LCMXO2-640HC-6TG100C, Lattice LCMXO2-640HC-4TG100I, Lattice LCMXO2-640HC-5TG100I, Lattice LCMXO2-640HC-6TG100I, Lattice LCMXO2-1200HC-4TG100C, Lattice LCMXO2-1200HC-5TG100C, Lattice LCMXO2-1200HC-6TG100C, Lattice LCMXO2-1200HC-4TG100I, Lattice LCMXO2-1200HC-5TG100I, Lattice LCMXO2-1200HC-6TG100I",
U2 ,1,W9812G6KH-6,stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm,,C62379,"Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G",Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable.
U3 U4 U5 ,3,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI 74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.
U6 U7 ,2,74AHCT245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C173388,"NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW",Most 74AHCT245 in TSSOP-20 package is acceptable.
U8 ,1,XC6206P332MR,stdpads:SOT-23,,C5446,Torex XC6206P332MR,Most 3.3V regulator in SOT-23 package is acceptable.
U9 ,1,DNP,stdpads:SOT-23-5,,,,