RAM2E/Hardware/LCMXO2/BOM/RAM2E-BOM.LCMXO2HC.csv

Reference, Quantity, Value, Footprint, Datasheet, LCSC Part, Mfg. Part Numbers, Notes
C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 C30 ,23,2u2,stdpads:C_0603,,C23630,Samsung CL10A225KO8NNNC,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred."
C1 C2 C3 C4 C5 C6 C29 ,7,10u,stdpads:C_0805,,C15850,Samsung CL21A106KAYNNNE,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred."
C31 ,1,15p,stdpads:C_0603,,C1644,Samsung CL10C150JB8NNNC,"10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred."
D1 ,1,Amber,stdpads:LED_0805,,C34499,Hubei Kento C34499,Any manufacturer's part is acceptable.
FID1 FID2 FID3 FID4 ,4,Fiducial,stdpads:Fiducial,,,,DNP - SMT vision system fiducial
H1 H2 H3 H4 ,4, ,stdpads:PasteHole_1.152mm_NPTH,,,,DNP - mounting hole for solder paste printing
H5 ,1, ,stdpads:PasteHole_1.1mm_PTH,,,,DNP - mounting hole
J1 ,1,AppleIIeAux,stdpads:AppleIIeAux_Edge,,,,DNP - edge connector
J2 ,1,JTAG,stdpads:TC2050,,,,DNP - test pad connector
J3 ,1,C14M,Connector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_Vertical,,,,DNP
R1 ,1,0,stdpads:R_0805,,C17477,Uniroyal 0805W8F0000T5E,Any manufacturer's part is acceptable.
R10 ,1,220,stdpads:R_0805,,C17557,Uniroyal 0805W8F2200T5E,Any manufacturer's part is acceptable.
R2 R3 R4 R12 R13 ,5,47,stdpads:R_0603,,C23182,Uniroyal 0603WAF470JT5E,Any manufacturer's part is acceptable.
R6 ,1,0,stdpads:R_0805,,C17477,Uniroyal 0805W8F0000T5E,Any manufacturer's part is acceptable.
R7 ,1,DNP,stdpads:R_0805,,,,
R5 R8 R9 R11 ,4,10k,stdpads:R_0603,,C25804,Uniroyal 0603WAF1002T5E,Any manufacturer's part is acceptable.
U1 ,1,LCMXO2-TG100,stdpads:TQFP-100_14x14mm_P0.5mm,,C1519051,"Lattice LCMXO2-640HC-4TG100C, Lattice LCMXO2-640HC-5TG100C, Lattice LCMXO2-640HC-6TG100C, Lattice LCMXO2-640HC-4TG100I, Lattice LCMXO2-640HC-5TG100I, Lattice LCMXO2-640HC-6TG100I, Lattice LCMXO2-1200HC-4TG100C, Lattice LCMXO2-1200HC-5TG100C, Lattice LCMXO2-1200HC-6TG100C, Lattice LCMXO2-1200HC-4TG100I, Lattice LCMXO2-1200HC-5TG100I, Lattice LCMXO2-1200HC-6TG100I",
U2 ,1,W9812G6KH-6,stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm,,C62379,"Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G",Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable.
U4 ,1,74LVC245APW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI 74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.
U3 U5 ,2,74AHC245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C6082,"NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI 74AHC245PW",Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.
U6 U7 ,2,74AHCT245PW,stdpads:TSSOP-20_4.4x6.5mm_P0.65mm,,C173388,"NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PW",Most 74AHCT245 in TSSOP-20 package is acceptable.
U8 ,1,XC6206P332MR,stdpads:SOT-23,,C5446,Torex XC6206P332MR,Most 3.3V regulator in SOT-23 package is acceptable.
U9 ,1,DNP,stdpads:SOT-23-5,,,,