RAM2E/Hardware/LCMXO/gerber/RAM2E-BOM.LCMXOC.csv
2021-06-01 05:30:16 -04:00

3.0 KiB

1ReferenceQuantityValueFootprintDatasheetLCSC PartMfg. Part NumbersNotes
2C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 C30 232u2stdpads:C_0603C23630Samsung CL10A225KO8NNNC10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred.
3C1 C2 C3 C4 C5 C6 C29 710ustdpads:C_0805C15850Samsung CL21A106KAYNNNE10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred.
4C31 115pstdpads:C_060310V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred.
5D1 1Whitestdpads:LED_0805C34499Hubei Kento C34499Any manufacturer's part is acceptable.
6FID1 FID2 FID3 FID4 4Fiducialstdpads:FiducialDNP - SMT vision system fiducial
7H1 H2 H3 H4 4stdpads:PasteHole_1.152mm_NPTHDNP - mounting hole for solder paste printing
8H5 1stdpads:PasteHole_1.1mm_PTHDNP - mounting hole
9J1 1AppleIIeAuxstdpads:AppleIIeAux_EdgeDNP - edge connector
10J2 1JTAGstdpads:TC2050DNP - test pad connector
11J3 1C14MConnector_PinHeader_2.54mm:PinHeader_1x02_P2.54mm_VerticalDNP
12R1 10stdpads:R_0805C17477Uniroyal 0805W8F0000T5EAny manufacturer's part is acceptable.
13R10 1180stdpads:R_0805C25270Uniroyal 0805W8F1800T5EAny manufacturer's part is acceptable.
14R2 R3 R4 R5 R8 547stdpads:R_0603C23182Uniroyal 0603WAF470JT5EAny manufacturer's part is acceptable.
15R6 10stdpads:R_0805C17477Uniroyal 0805W8F0000T5EAny manufacturer's part is acceptable.
16R7 1DNPstdpads:R_0805
17R9 110kstdpads:R_0603C25804Uniroyal 0603WAF1002T5EAny manufacturer's part is acceptable.
18U1 1LCMXO256-TN100stdpads:TQFP-100_14x14mm_P0.5mmC1550734Lattice LCMXO256C-3TN100C, Lattice LCMXO256C-4TN100C, Lattice LCMXO256C-5TN100C, Lattice LCMXO256C-3TN100I, Lattice LCMXO256C-4TN100I, Lattice LCMXO640C-3TN100C, Lattice LCMXO640C-4TN100C, Lattice LCMXO640C-5TN100C, Lattice LCMXO640C-3TN100I, Lattice LCMXO640C-4TN100I
19U11 125F010stdpads:SOIC-8_5.3mmC2687406Zetta ZD25WD20BTIGT, Adesto AT25SF081-SSHD, Winbond W25X20CLSNIGMost SPI flash in SOIC-8 (3.9mm / 150 mil width) package is acceptable.
20U2 1W9812G6KH-6stdpads:TSOP-II-54_22.2x10.16mm_P0.8mmC62379Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:GMost 166 MHz 128/256 Mbit x16 SDRAM is acceptable.
21U3 U4 U5 374LVC245APWstdpads:TSSOP-20_4.4x6.5mm_P0.65mmC6082NXP 74LVC245APW, TI SN74LVC245APW, NXP 74AHC245PW, NXP 74AHC245APW, TI SN74AHC245PWMost 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable.
22U6 U7 274AHCT245PWstdpads:TSSOP-20_4.4x6.5mm_P0.65mmC173388NXP 74AHCT245PW, NXP 74AHCT245APW, TI SN74AHCT245PWMost 74AHCT245 in TSSOP-20 package is acceptable.
23U8 1XC6206P332MRstdpads:SOT-23C5446Torex XC6206P332MRMost 3.3V regulator in SOT-23 package is acceptable.
24U9 1stdpads:SOT-23-5