3.2 KiB
3.2 KiB
| 1 | Reference | Quantity | Value | Footprint | Datasheet | Notes | LCSC Part | Mfg. Part Numbers |
|---|---|---|---|---|---|---|---|---|
| 2 | C30 | 1 | 15p | stdpads:C_0603 | 10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred. | C1644 | Samsung CL10C150JB8NNNC | |
| 3 | C1 C2 C3 C4 C26 | 5 | 10u | stdpads:C_0805 | 10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred. | C15850 | Samsung CL21A106KAYNNNE | |
| 4 | C5 C6 C7 C8 C9 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C27 C28 C29 | 24 | 2u2 | stdpads:C_0603 | 10V or higher. Any manufacturer's part is acceptable but Samsung, Murata, Yageo preferred. | C23630 | Samsung CL10A225KO8NNNC | |
| 5 | D1 | 1 | Amber | stdpads:LED_0805 | Any manufacturer's part is acceptable. | |||
| 6 | FID1 FID2 FID3 FID4 | 4 | Fiducial | stdpads:Fiducial | DNP - SMT vision system fiducial | |||
| 7 | H1 H2 H4 H5 | 4 | stdpads:PasteHole_1.152mm_NPTH | DNP - mounting hole for solder paste printing | ||||
| 8 | H3 | 1 | stdpads:PasteHole_1.1mm_PTH | DNP - mounting hole | ||||
| 9 | J1 | 1 | Memory Expansion | stdpads:AppleIIgsMemoryExpansion_Edge | DNP - edge connector | |||
| 10 | J2 | 1 | JTAG | Connector:Tag-Connect_TC2050-IDC-FP_2x05_P1.27mm_Vertical | DNP - test pad connector | |||
| 11 | R1 R7 R8 R9 R10 | 5 | 10k | stdpads:R_0603 | Any manufacturer's part is acceptable. | C25804 | Uniroyal 0603WAF1002T5E | |
| 12 | R2 R3 R5 R11 R12 R13 | 4 | 47 | stdpads:R_0603 | Any manufacturer's part is acceptable. | C23182 | Uniroyal 0603WAF470JT5E | |
| 13 | R4 | 1 | DNP | stdpads:R_0805 | ||||
| 14 | R6 | 1 | 220 | stdpads:R_0805 | Any manufacturer's part is acceptable. | C17557 | Uniroyal 0805W8F2200T5E | |
| 15 | U1 | 1 | LCMXO2ZE-TG100 | stdpads:TQFP-100_14x14mm_P0.5mm | C1519051 | Lattice LCMXO2-640ZE-4TG100C, Lattice LCMXO2-640ZE-5TG100C, Lattice LCMXO2-640ZE-6TG100C, Lattice LCMXO2-640ZE-4TG100I, Lattice LCMXO2-640ZE-5TG100I, Lattice LCMXO2-640ZE-6TG100I, Lattice LCMXO2-1200ZE-4TG100C, Lattice LCMXO2-1200ZE-5TG100C, Lattice LCMXO2-1200ZE-6TG100C, Lattice LCMXO2-1200ZE-4TG100I, Lattice LCMXO2-1200ZE-5TG100I, Lattice LCMXO2-1200ZE-6TG100I | ||
| 16 | U9 U10 | 2 | 74LVC1G04GW | stdpads:SOT-353 | Most 74LVC1G04 or 74AHC1G04 in SOT-353 package is acceptable. | C10237 | NXP 74LVC1G04GW, TI SN74LVC1G04DCK | |
| 17 | U11 | 1 | AP2127K-1.2TRG1 | stdpads:SOT-23-5 | Most 1.2V regulator in SOT-23-5 package is acceptable. | C151376 | Diodes AP2127K-1.2TRG1, Torex XC6228D122VR | |
| 18 | U2 | 1 | W9812G6KH-6 | stdpads:TSOP-II-54_22.2x10.16mm_P0.8mm | Most 166 MHz 128/256 Mbit x16 SDRAM is acceptable. | C62379 | Winbond W9812G6KH-6, Winbond W9812G6KH-6I, Winbond W9825G6KH-6, Winbond W9825G6KH-6I, ISSI IS42S16160J-6TL, ISSI IS42S16160J-6TLI, Micron MT48LC16M16A2P-6A :G, Micron MT48LC16M16A2P-6A IT:G | |
| 19 | U3 | 1 | 60M | stdpads:Crystal_SMD_7050-4Pin_7.0x5.0mm_SiTime | Most 60-62.5 MHz 3.3V crystal oscillator or silicon oscillator is acceptable. Do not use crystal resonator or ceramic resonator. | C26255 | SiTime SIT1602AI-82-33E-60.000000Y, Shenzhen SCTF S7D60.000000B20F30T, Taiten OCETGLJTNF-60MHZ | |
| 20 | U4 | 1 | 74AHCT245PW | stdpads:TSSOP-20_4.4x6.5mm_P0.65mm | Most 74AHCT245 in TSSOP-20 package is acceptable. | C173388 | NXP 74AHCT245PW, TI SN74AHCT245PW | |
| 21 | U5 U6 U7 | 3 | 74LVC245APW | stdpads:TSSOP-20_4.4x6.5mm_P0.65mm | Most 74LVC245 or 74AHC245 in TSSOP-20 package is acceptable. | C6082 | NXP 74LVC245APW, TI SN74LVC245APW | |
| 22 | U8 | 1 | AZ1117CH-3.3TRG1 | stdpads:SOT-223 | Most 1117-type 3.3V regulator in SOT-223 package is acceptable. | C92102 | Diodes AZ1117CH-3.3TRG1, Diodes AZ1117EH-3.3TRG1 |