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unused footprint for testing alternate MPN

This commit is contained in:
Romain Dolbeau 2022-09-26 17:50:52 +02:00
parent e1be4beb2d
commit 003a0509bc
1 changed files with 44 additions and 0 deletions
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nubus-to-ztex/For_SeeedStudio.pretty/TVSOP-14_4.4x3.6mm_P0.40mm.kicad_mod Normal file
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(module TVSOP-14_4.4x3.6mm_P0.40mm (layer F.Cu) (tedit 632C6C07)
(descr "14-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
(tags "SSOP 0.65")
(attr smd)
(fp_text reference REF** (at 0 -3.55) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value TVSOP-14_4.4x3.6mm_P0.40mm (at 0 3.55) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.2 -1.8) (end 2.2 -1.8) (layer F.Fab) (width 0.15))
(fp_line (start 2.2 -1.8) (end 2.2 1.8) (layer F.Fab) (width 0.15))
(fp_line (start 2.2 1.8) (end -2.2 1.8) (layer F.Fab) (width 0.15))
(fp_line (start -2.2 1.8) (end -2.2 -0.8) (layer F.Fab) (width 0.15))
(fp_line (start -2.2 -0.8) (end -1.2 -1.8) (layer F.Fab) (width 0.15))
(fp_line (start -3.95 -2.1) (end -3.95 2.1) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.95 -2.1) (end 3.95 2.1) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.95 -2.1) (end 3.95 -2.1) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.95 2.1) (end 3.95 2.1) (layer F.CrtYd) (width 0.05))
(fp_line (start -2.325 -1.925) (end -2.325 -1.8) (layer F.SilkS) (width 0.15))
(fp_line (start 2.325 -1.925) (end 2.325 -1.7) (layer F.SilkS) (width 0.15))
(fp_line (start 2.325 1.925) (end 2.325 1.7) (layer F.SilkS) (width 0.15))
(fp_line (start -2.325 1.925) (end -2.325 1.7) (layer F.SilkS) (width 0.15))
(fp_line (start -2.325 -1.925) (end 2.325 -1.925) (layer F.SilkS) (width 0.15))
(fp_line (start -2.325 1.925) (end 2.325 1.925) (layer F.SilkS) (width 0.15))
(fp_line (start -2.325 -1.8) (end -3.675 -1.8) (layer F.SilkS) (width 0.15))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.8 0.8) (thickness 0.15)))
)
(pad 1 smd rect (at -3.1 -1.2) (size 1.80 0.28) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -3.1 -0.8) (size 1.80 0.28) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -3.1 -0.4) (size 1.80 0.28) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -3.1 0) (size 1.80 0.28) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -3.1 0.4) (size 1.80 0.28) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -3.1 0.8) (size 1.80 0.28) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -3.1 1.2) (size 1.80 0.28) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at 3.1 1.2) (size 1.80 0.28) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 3.1 0.8) (size 1.80 0.28) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at 3.1 0.4) (size 1.80 0.28) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at 3.1 0) (size 1.80 0.28) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at 3.1 -0.4) (size 1.80 0.28) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at 3.1 -0.8) (size 1.80 0.28) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at 3.1 -1.2) (size 1.80 0.28) (layers F.Cu F.Paste F.Mask))
)