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Documentation update
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Docs.sch
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Docs.sch
@ -4,10 +4,10 @@ EELAYER END
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$Descr A4 11693 8268
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$Descr A4 11693 8268
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encoding utf-8
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encoding utf-8
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Sheet 2 2
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Sheet 2 2
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Title ""
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Title "GW4201D (RAM2GS II)"
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Date ""
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Date "2020-08-02"
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Rev ""
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Rev "1.0"
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Comp ""
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Comp "Garrett's Workshop"
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Comment1 ""
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Comment1 ""
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Comment2 ""
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Comment2 ""
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Comment3 ""
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Comment3 ""
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@ -1,63 +0,0 @@
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RAM2GS II (GW4201D) expands the Apple IIgs's
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fast memory to 8 MB.
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Low-Power, SDRAM-Based Design
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----------------------------------------
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Thanks to a modern, low-power design,
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RAM2GS II uses a maximum of 0.15 watts when idle
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(30 mA @ 5V) and 0.3W in active use (60 mA @ 5V).
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Unlike other IIgs expansion RAM cards, which are
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built with vintage asynchronous DRAM chips,
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RAM2GS II uses modern SDRAM. This design allows for
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low power consumption and improved reliability
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over other memory cards using 15+ year old chips.
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Small Size, Low-Profile
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----------------------------------------
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RAM2GS II features a small board outline and is the
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thinnest Apple IIgs expansion memory card ever produced,
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at under 4mm thin. Small and thin dimensions improve
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the mechanical compatibility between RAM2GS II and
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peripheral cards installed into the IIgs's Slot 7.
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Adjustable Capacity, Highly Compatible
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----------------------------------------
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The Apple IIgs can utilize up to 8 MB of fast memory,
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but due to limitations of the Apple IIgs hardware,
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not all 8 MB is considered "DMA-compatible."
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Only 4 MB of the 8 MB provided by an expansion RAM
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card such as the RAM2GS II is DMA-compatible,
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and peripheral cards which use DMA are
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not able to access expansion memory beyond 4 MB.
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RAM2GS II implements an adjustable capacity
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feature, allowing the user to select between
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fully DMA-compatible 4 MB capacity, or
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partially DMA-compatible 8MB capacity.
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Capacity settings can be set temporarily
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or saved in nonvolatile memory.
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The capacity adjustment utility is available on
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_RAM2GS II's support page_.
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Ecologically Friendly, Gold-Plated PCB
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----------------------------------------
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RAM2GS II features a lead-free, ENIG gold-plated,
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4-layer PCB and is fully EU RoHS-compliant.
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All units are tested extensively before shipment.
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Only new parts are used to build RAM2GS II,
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and all RAM2GS II cards are manufactured in our
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semi-automated facility in Columbus, Ohio,
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in the United States.
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Open-Source Design
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----------------------------------------
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RAM2GS II's design is fully open-source.
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The schematics, board layouts, CPLD firmware,
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and utility software are all freely available
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for commercial and noncommercial use.
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To download the design files, visit the
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_Garrett's Workshop GitHub page_.
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Documentation/Schematic.pdf
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Documentation/Schematic.pdf
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@ -10,6 +10,13 @@
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)
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)
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(page A4)
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(page A4)
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(title_block
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(title "GW4203D (RAM2GS II)")
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(date 2020-08-02)
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(rev 1.0)
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(company "Garrett's Workshop")
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)
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(layers
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(layers
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(0 F.Cu signal)
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(0 F.Cu signal)
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(1 In1.Cu power)
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(1 In1.Cu power)
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@ -437,7 +444,7 @@
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(fp_text reference U9 (at 0 0 90) (layer F.Fab)
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(fp_text reference U9 (at 0 0 90) (layer F.Fab)
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(effects (font (size 0.254 0.254) (thickness 0.0635)))
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(effects (font (size 0.254 0.254) (thickness 0.0635)))
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)
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)
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(fp_text value 74LVC1G04GW (at 0.35 0 90) (layer F.Fab)
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(fp_text value 74LVC1G04 (at 0.35 0 90) (layer F.Fab)
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(effects (font (size 0.1905 0.1905) (thickness 0.047625)))
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(effects (font (size 0.1905 0.1905) (thickness 0.047625)))
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)
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)
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(fp_line (start 1.6 1.3) (end -1.6 1.3) (layer F.CrtYd) (width 0.05))
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(fp_line (start 1.6 1.3) (end -1.6 1.3) (layer F.CrtYd) (width 0.05))
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@ -478,7 +485,7 @@
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(fp_text reference U10 (at 0 0 90) (layer F.Fab)
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(fp_text reference U10 (at 0 0 90) (layer F.Fab)
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(effects (font (size 0.254 0.254) (thickness 0.0635)))
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(effects (font (size 0.254 0.254) (thickness 0.0635)))
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)
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)
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(fp_text value 74LVC1G04GW (at 0.35 0 90) (layer F.Fab)
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(fp_text value 74LVC1G04 (at 0.35 0 90) (layer F.Fab)
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(effects (font (size 0.1905 0.1905) (thickness 0.047625)))
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(effects (font (size 0.1905 0.1905) (thickness 0.047625)))
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)
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)
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(fp_line (start 1.6 1.3) (end -1.6 1.3) (layer F.CrtYd) (width 0.05))
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(fp_line (start 1.6 1.3) (end -1.6 1.3) (layer F.CrtYd) (width 0.05))
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@ -568,7 +575,7 @@
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(fp_text reference RN2 (at 0 0 90) (layer F.Fab)
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(fp_text reference RN2 (at 0 0 90) (layer F.Fab)
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(effects (font (size 0.254 0.254) (thickness 0.0635)))
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(effects (font (size 0.254 0.254) (thickness 0.0635)))
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)
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)
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(fp_text value 4x47 (at 0.3 0 90) (layer F.Fab)
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(fp_text value 4x30 (at 0.3 0 90) (layer F.Fab)
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(effects (font (size 0.1905 0.1905) (thickness 0.047625)))
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(effects (font (size 0.1905 0.1905) (thickness 0.047625)))
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)
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)
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(fp_text user %R (at 0 0 270) (layer F.SilkS) hide
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(fp_text user %R (at 0 0 270) (layer F.SilkS) hide
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@ -617,7 +624,7 @@
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(fp_text reference RN3 (at 0 0 90) (layer F.Fab)
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(fp_text reference RN3 (at 0 0 90) (layer F.Fab)
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(effects (font (size 0.254 0.254) (thickness 0.0635)))
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(effects (font (size 0.254 0.254) (thickness 0.0635)))
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)
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)
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(fp_text value 4x47 (at 0.3 0 90) (layer F.Fab)
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(fp_text value 4x30 (at 0.3 0 90) (layer F.Fab)
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(effects (font (size 0.1905 0.1905) (thickness 0.047625)))
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(effects (font (size 0.1905 0.1905) (thickness 0.047625)))
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)
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)
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(fp_text user %R (at 0 0 270) (layer F.SilkS) hide
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(fp_text user %R (at 0 0 270) (layer F.SilkS) hide
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@ -666,7 +673,7 @@
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(fp_text reference RN4 (at 0 0) (layer F.Fab)
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(fp_text reference RN4 (at 0 0) (layer F.Fab)
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(effects (font (size 0.254 0.254) (thickness 0.0635)))
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(effects (font (size 0.254 0.254) (thickness 0.0635)))
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)
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)
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(fp_text value 4x47 (at 0.3 0) (layer F.Fab)
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(fp_text value 4x30 (at 0.3 0) (layer F.Fab)
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(effects (font (size 0.1905 0.1905) (thickness 0.047625)))
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(effects (font (size 0.1905 0.1905) (thickness 0.047625)))
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)
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)
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(fp_text user %R (at 0 0 180) (layer F.SilkS) hide
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(fp_text user %R (at 0 0 180) (layer F.SilkS) hide
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@ -715,7 +722,7 @@
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(fp_text reference RN5 (at 0 0) (layer F.Fab)
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(fp_text reference RN5 (at 0 0) (layer F.Fab)
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(effects (font (size 0.254 0.254) (thickness 0.0635)))
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(effects (font (size 0.254 0.254) (thickness 0.0635)))
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)
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)
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(fp_text value 4x47 (at 0.3 0) (layer F.Fab)
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(fp_text value 4x30 (at 0.3 0) (layer F.Fab)
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(effects (font (size 0.1905 0.1905) (thickness 0.047625)))
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(effects (font (size 0.1905 0.1905) (thickness 0.047625)))
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)
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)
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(fp_text user %R (at 0 0 180) (layer F.SilkS) hide
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(fp_text user %R (at 0 0 180) (layer F.SilkS) hide
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@ -2367,7 +2374,7 @@
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)
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)
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)
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)
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(module stdpads:TSSOP-20_4.4x6.5mm_P0.65mm (layer F.Cu) (tedit 5EE296B4) (tstamp 5E96A451)
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(module stdpads:TSSOP-20_4.4x6.5mm_P0.65mm (layer F.Cu) (tedit 5EE296B4) (tstamp 5F273F52)
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(at 77.025 125.45 90)
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(at 77.025 125.45 90)
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(descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
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(descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
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(tags "SSOP 0.65")
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(tags "SSOP 0.65")
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@ -2896,7 +2903,7 @@
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(module stdpads:R_0805 (layer F.Cu) (tedit 5F027DD1) (tstamp 5EED1618)
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(module stdpads:R_0805 (layer F.Cu) (tedit 5F027DD1) (tstamp 5EED1618)
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(at 71.7 125.65)
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(at 71.7 125.65)
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(tags resistor)
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(tags resistor)
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(path /5EED7F16)
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(path /5F2CC469)
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(solder_mask_margin 0.05)
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(solder_mask_margin 0.05)
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(solder_paste_margin -0.025)
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(solder_paste_margin -0.025)
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(attr smd)
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(attr smd)
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22
RAM2GS.pro
22
RAM2GS.pro
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update=Sunday, July 05, 2020 at 10:26:01 PM
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update=Sunday, August 02, 2020 at 06:25:20 PM
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version=1
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version=1
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last_client=kicad
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last_client=kicad
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[general]
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[general]
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@ -12,16 +12,6 @@ NetIExt=net
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version=1
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version=1
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LibDir=
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LibDir=
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[eeschema/libraries]
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[eeschema/libraries]
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[schematic_editor]
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version=1
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PageLayoutDescrFile=
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PlotDirectoryName=
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SubpartIdSeparator=0
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SubpartFirstId=65
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NetFmtName=Pcbnew
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SpiceAjustPassiveValues=0
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LabSize=50
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ERC_TestSimilarLabels=1
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[pcbnew]
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[pcbnew]
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version=1
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version=1
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PageLayoutDescrFile=
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PageLayoutDescrFile=
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@ -272,3 +262,13 @@ uViaDrill=0.1
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dPairWidth=0.2
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dPairWidth=0.2
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dPairGap=0.25
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dPairGap=0.25
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dPairViaGap=0.25
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dPairViaGap=0.25
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[schematic_editor]
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version=1
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PageLayoutDescrFile=
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PlotDirectoryName=
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SubpartIdSeparator=0
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SubpartFirstId=65
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NetFmtName=Pcbnew
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SpiceAjustPassiveValues=0
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LabSize=50
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ERC_TestSimilarLabels=1
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1915
RAM2GS.sch
Normal file
1915
RAM2GS.sch
Normal file
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